Flame-retardant flexible substrate thermosetting solder resist
This is a thermosetting printing ink used for FPC substrates. It excels in flame resistance, chemical resistance, and electrical insulation, maintaining high reliability. 【Features】 ◆ Single-component, halogen-free, and formaldehyde-free compliant ◆ Curing conditions: 130°C for 10 minutes ◆ 100/100 ◆ Surface hardness: HB ◆ Shelf life: 6 months (refrigerated at 10°C or below) *For more details, please inquire via request for materials or download.
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basic information
This is a thermosetting printing ink used for FPC substrates. It excels in flame resistance, chemical resistance, and electrical insulation, maintaining high reliability. 【Features】 ◆ Single-component, halogen-free, and formaldehyde-free product ◆ Curing conditions: 130°C for 10 minutes ◆ 100/100 ◆ Surface hardness: HB ◆ Shelf life: 6 months (refrigerated at 10°C or below) *For more details, please inquire via document request or download.
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This is a printing ink used for undercoating and overcoating FPC circuits.
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Recent advancements in electronics have made remarkable progress, significantly transforming our lives to be more convenient and comfortable. Moving forward, electronics will continue to break through the conventional notion of "impossible" and will lead us into a new world of a highly information-oriented society, realizing dreams. To bring about this new world of electronics, it is essential to conduct research and development of outstanding electronic materials that support it. Our company will promote the development of even more advanced functional materials based on the experience and achievements we have built over many years in the research and development of electronic materials.