Low elasticity makes bending of FPC easy. Contributes to thinner, lighter designs and increased design flexibility.
The "Photo-sensitive Coverlay (PICC)" is a solder resist for flexible substrates that excels in flexibility, insulation, and manufacturability. With low elasticity, it allows the substrate to be easily bent, contributing to greater design freedom, and eliminates the need for coverlay, enabling significant thinning and weight reduction of the entire substrate. 【Features】 ■ Suitable for high-density mounting with a minimum opening size of 80–150μm ■ High flexibility that does not produce cracks even after over 10 million sliding tests (R=5mm) ■ Can cover the entire outer surface with only PICC, contributing to process shortening and simplification ■ EMI shielding can be directly applied ■ High insulation reliability, compatible with line & space of 25μm/25μm *For more details, please refer to the PDF document. Feel free to contact us with any inquiries.
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basic information
[Image of Utilizing Photosensitive Cover Lay (PICC)] Multifunctionalization of Wire Harnesses Flexible Substrate for Mobile Device Antenna Cables Lightweight Multifunctionalization of 5G/6G Communication and CASE Electronic Boards Wearable Devices and Smartphones Applications in Healthcare and Medical Devices *For more details, please refer to the PDF document. Feel free to contact us as well.*
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*For more details, please refer to the materials. Feel free to contact us as well.*
Detailed information
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Achieving high-density mounting, lightweight, thin design, and free design.
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High flexibility that does not develop cracks even after more than 10 million bending tests (R = 5mm).
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Tamura’s products have been supporting various industries and social infrastructure as materials, components, and devices that range from consumer products, such as automobiles and electronic equipment, to devices at manufacturing sites and renewable energy and aerospace fields.
