Wafer surface modification and precision bonding equipment

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last updated：Jul 13, 2009

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Wafer surface modification and precision bonding equipment

A device for precision bonding of wafer-level silicon, metals, quartz, glass, etc., after surface modification treatment in a vacuum to any atmosphere. ■□■Features■□■ ■Compatible with various 4 to 6-inch wafer-level bonding ■Pre-treatment function through surface modification suitable for any material ■Bonding system equipped with uniform heating and pressurization functions ■Heating and cooling system to reduce residual stress ■Compatible with ultra-high vacuum to pressurized atmosphere ■Arbitrary position pressurization and voltage application control mechanism For custom-made semiconductor manufacturing equipment, scientific instruments, and accessories, please leave it to us. For more details, please contact us.

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A device for precision bonding of wafer-level silicon, metals, quartz, glass, etc., after surface modification treatment in a vacuum to any atmosphere. ■□■Features■□■ ■Compatible with various 4 to 6-inch wafer-level bonding ■Pre-treatment function through surface modification suitable for any material ■Bonding system equipped with uniform heating and pressurization functions ■Heating and cooling system to reduce residual stress ■Compatible with ultra-high vacuum to pressurized atmospheres ■Arbitrary position pressurization and voltage application control mechanism ■For custom-made semiconductor manufacturing equipment, scientific instruments, and accessories, please leave it to us. For more details, please contact us.