Thermosetting adhesive film for semiconductors and FPC, lead-free solder reflow compatible.
■Product thickness: 35μm ■Crimping conditions: 150℃ 0.3MPa × 10 min ■Curing conditions: 150℃ × 60 min ■Adhesive strength: 20N/cm (Polyimide/Polyimide), 22N/cm (Polyimide/Galvanized Epoxy), 18N/cm (Polyimide/SUS) ■Heat resistance: 260℃ × 30 sec
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basic information
This is a thermosetting adhesive film with excellent adhesion and heat resistance, ideal for applications such as bonding reinforcement plates for flexible printed circuit boards, interlayer bonding for multilayer flexible printed circuit boards, and bonding TAB and stiffeners in T-BGA. It is halogen-free, cadmium-free, and lead-free compliant.
Price information
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Delivery Time
P4
Applications/Examples of results
For adhesive use of stiffeners, heat spreaders, and various reinforcement plates for flexible printed circuit boards (copper, SUS, polyimide, glass epoxy, aluminum, etc.)
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Company information
The Toyo Ink Group aims to provide cutting-edge technology and quality as a "lifestyle culture creation company" that expands globally. *As of April 1, 2011, Toyo Ink Manufacturing Co., Ltd. transitioned to a holding company structure and changed its name to Toyo Ink SC Holdings Co., Ltd. The printing and information-related business and packaging-related business were succeeded by Toyo Ink Co., Ltd., while the polymer and coating-related business and color materials and functional materials-related business were succeeded by Toyo Chem Co., Ltd. respectively.*
