Laser IC Unpacking Device PL101
Laser IC decapsulation device that can remove the plastic part of plastic-molded ICs down to less than 100 microns from the surface of the IC chip, without damaging the chip. 【Features】 ○ As a pre-treatment for decapsulation using chemical solutions, it minimizes the impact of the chemical solution on ICs with Cu wiring, etc. ○ Decapsulation can be performed simply by dropping the chemical solution onto the surface of the chip; it is also possible to use a decapsulation device, and the amount of chemical solution used is extremely minimal. ○ Effective in reducing decapsulation time as a pre-treatment for dry decapsulation. ○ Removal processing in a short time; the processing time for an area of 10mm x 10mm is about 2 minutes. ○ The processing range can be set from a computer screen, and it is easy to operate by simply turning on the switch. ○ Compact design that can be installed on a desk. ● For other functions and details, please download the catalog.
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basic information
Laser IC decapsulation device that can remove the plastic part of plastic-molded ICs down to less than 100 microns from the surface of the IC chip, without damaging the chip. 【Features】 ○ As a pre-treatment for decapsulation using chemical solutions, it minimizes the impact of the chemical solution on the decapsulation of ICs with Cu wiring, etc. ○ Decapsulation can be performed simply by dropping the chemical solution onto the surface of the chip; it is also possible to use a decapsulation device, and the amount of chemical solution used is extremely minimal. ○ Effective in reducing decapsulation time as a pre-treatment for dry decapsulation. ○ Removal processing in a short time; the processing time for an area of 10mm x 10mm is approximately 2 minutes. ○ The processing range can be set from a computer screen, and it is easy to operate—just turn on the switch. ○ Compact design that can be installed on a desk. ● For other functions and details, please download the catalog.
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Company information
Japan Scientific Co., Ltd. is a company located in Itabashi-ku, Tokyo, primarily engaged in the development, manufacturing, and sales of semiconductor unpacking equipment and testing equipment, as well as providing contract unpacking services. Our equipment is widely used by customers around the world, and the unpacking technology developed through our contract unpacking service, EDLab, has gained high trust. For failure analysis, please leave it to Japan Scientific.
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