Tabletop manual wire bonder Model 626. It can be used for prototyping and development.
The Model 626 is a multi-wire bonder that supports ball bonding, wedge bonding, and bump bonding all in one machine. Hybond's unique Soft Touch load control is effective for bonding thin and fragile materials. It comes standard with precise wire feeding functionality, stitch bonding, loop height control, independent parameter settings for 1st and 2nd bonds, and tail length settings. The work stage is available in various configurations to suit customer applications.
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basic information
【Features】 (Model 626) ○ HYBOND Soft Touch Bond Force Control System ○ Bonding Program: 100 Pattern Memory ○ Programmable Loop & Search Height Settings ○ Electric Z-Axis Control for Bond Head ○ Built-in Temperature Controller ○ Stitch Bonding Capable ○ High/Low Ultrasonic Power Switching Function ○ 0.5-inch and 2-inch Wire Spool Mount ● For more details, please contact us.
Price information
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Price range
P5
Delivery Time
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Applications/Examples of results
Development of various sensors, small-scale production of MEMS devices.
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Our company was founded in 1976 in Okaya City, Nagano Prefecture, and since then, we have expanded our export business of machine tools to the Chinese and Southeast Asian markets. Starting in 1997, we began importing, selling, and servicing equipment for the electronics industry. Currently, we are also working on the development of our own products, such as various reflow soldering machines and ultrasonic metal joining devices, to meet market needs.