Dicing saw frame with barcode for product management, small lot support is also available.
We offer price advantages and can accommodate short delivery times. We also utilize laser processing machines, allowing us to handle various shapes. There is also a cost-effective type available using NSS431DP-2.
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basic information
It is a tool used in the process of dicing (cutting) silicon wafers.
Price information
-
Delivery Time
P4
Applications/Examples of results
It is used in semiconductor manufacturing companies.
Company information
While material sales is our main business, we are eager to engage in development. If you have any questions about what we can do, please feel free to consult with us. Regarding metals, we will take on all challenges, including materials, molds, pressing, machining, heat treatment, surface treatment, etc. We obtained ISO 9001:2000 certification in June 2004.
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