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  1. Home
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  3. Electronic Components and Modules
  4. Optical Components
  5. Other optical parts
  6. Chip type "Optical Remote Control Receiving Module"

Chip type "Optical Remote Control Receiving Module"

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PIC79603

last updated:Mar 30, 2021

コーデンシ
コーデンシ
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Optical remote control receiving module with the smallest chip size in the industry.

- With a chip size of 4.5 x 2.8 x 1.1 mm, the mounting area is only 12.6 square millimeters. This is the smallest mounting area. - Compared to other products, it is approximately 30% smaller in mounting area and over 50% smaller in volume. - The power supply voltage for operation is wide-ranging at 2.7V-5.5V, making it a multi-voltage type. - The current consumption is 1.3 mA/max, which is about 40% less compared to other products, making it suitable for portable devices. - The reach distance is the same as conventional products at 8 m/min.

    SensorsOther semiconductorsOther optical parts
072721004.image_data.jpg

Chip type "Optical Remote Control Receiving Module"

072721004.image_data.jpg
072721004.image_data.jpg

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basic information

The conventional "optical remote control receiving module" is of the lead type, and due to constraints in shape, there has been a demand for miniaturization of the optical remote control receiving part. The chip-type "optical remote control receiving module PIC79603" is a chip product measuring 4.5 x 3.8 x 1.1 mm. While miniaturization of devices is a given, the chip type (surface mount) can be placed in a reflow oven along with other electronic components, contributing to a reduction in assembly labor for the circuit board.

Price information

-

Delivery Time

P4

Applications/Examples of results

If your device uses the conventional lead-type "optical remote control receiving module," you can use the chip-type "optical remote control receiving module PIC79603." - AV equipment such as TVs, VCRs, DVD players, and digital cameras - Cameras - Indoor lighting equipment - Air and temperature control devices (air conditioners)

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コーデンシ

コーデンシ

Electronic Components and Semiconductors

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1. Optical Sensing Related Optical sensors have a proven track record with major home appliance and industrial equipment manufacturers as core products, and we are advancing the development of optical, circuit, and mechanical designs to meet diverse sensing requirements. We are developing mixed-signal ICs that incorporate digital processing circuits, leveraging the features of fine sensing through 3D processing and sub-micron C-MOS wafer processes, resulting in compact, high-performance, high-value-added products. 2. Optical Media Related We have a wide range of products and a proven track record in CD/DVD technology. In response to market demands for high-speed and short-wavelength applications such as Next DVD, we are advancing the development of dedicated epitaxial equipment and processes for miniaturization. We plan to ship sample products of silicon photodetectors that utilize the quantum effects of ZnO/Si heterojunctions, which exhibit blue sensitivity and high-speed performance.

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