List of Design and production support products
- classification：Design and production support
3301～3330 item / All 12273 items
For those who have isolators. Achieving high chemical resistance and workability. Low cost and short delivery times are also possible for glove box and isolator gloves.
- Work gloves
Notice of participation in 'INTERPHEX Week Tokyo' from May 20 (Wednesday) to May 22 (Friday), 2026.
Ito Corporation will be exhibiting at "INTERPHEX Week Tokyo" held at Makuhari Messe. This exhibition is the largest in Japan, showcasing a wide range of products and services related to the research and manufacturing of pharmaceuticals, cosmetics, and regenerative medicine from 25 countries and regions around the world. Pharmaceutical and cosmetic manufacturers, as well as regenerative medicine companies, will be attending from all over the globe. We will be showcasing "Gloves for Glove Boxes/Isolators" manufactured by Tron Power. We look forward to your visit.
Are you measuring the correct thermal conductivity of the thermal pad?
- Thermo-fluid analysis
[Web Seminar for Electronics Manufacturers and Developers] The First Step in Solving Thermal Issues! 'Basics of Thermal Conductivity and Measurement Methods/Measurement Examples'
The "Fundamentals of Thermal Conductivity and Measurement Methods/Case Studies" seminar hosted by Nikkan Kogyo Shimbun will be held soon! In manufacturing and development, thermal issues in electronic devices and materials cannot be avoided. To solve these problems, it is essential to accurately understand the "thermal conductivity" of components and materials and to carry out appropriate thermal design. This seminar will cover the various types of thermal conductive materials used in electronic devices, detailing their measurement methods and specific case studies. By understanding the characteristics and advantages of various thermal conductivity measurement methods, participants will develop the skills to select the optimal method according to the situation. Additionally, actual measurement case studies of thermal conductivity will be introduced, providing knowledge directly applicable to product development and quality control. This seminar is recommended for those who want to acquire advanced thermal property measurement techniques to improve the performance of electronic products and prevent issues. <Knowledge to be Acquired> ◇ Basic knowledge of thermal conductivity ◇ Principles of thermal conductivity measurement instruments ◇ Differences in thermal conductivity measurement methods (which instruments to use for which types of samples) Please click the [Details & Registration] button below to apply.
Even thin and small samples, as well as samples with high thermal conductivity, can be measured!
- Thermo-fluid analysis
[Web Seminar for Electronics Manufacturers and Developers] The First Step in Solving Thermal Issues! 'Basics of Thermal Conductivity and Measurement Methods/Measurement Examples'
The "Fundamentals of Thermal Conductivity and Measurement Methods/Case Studies" seminar hosted by Nikkan Kogyo Shimbun will be held soon! In manufacturing and development, thermal issues in electronic devices and materials cannot be avoided. To solve these problems, it is essential to accurately understand the "thermal conductivity" of components and materials and to carry out appropriate thermal design. This seminar will cover the various types of thermal conductive materials used in electronic devices, detailing their measurement methods and specific case studies. By understanding the characteristics and advantages of various thermal conductivity measurement methods, participants will develop the skills to select the optimal method according to the situation. Additionally, actual measurement case studies of thermal conductivity will be introduced, providing knowledge directly applicable to product development and quality control. This seminar is recommended for those who want to acquire advanced thermal property measurement techniques to improve the performance of electronic products and prevent issues. <Knowledge to be Acquired> ◇ Basic knowledge of thermal conductivity ◇ Principles of thermal conductivity measurement instruments ◇ Differences in thermal conductivity measurement methods (which instruments to use for which types of samples) Please click the [Details & Registration] button below to apply.
Leave the measurement of the thermal conductivity of carbon fiber reinforced plastic (CFRP) to us.
- Thermo-fluid analysis
[Web Seminar for Electronics Manufacturers and Developers] The First Step in Solving Thermal Issues! 'Basics of Thermal Conductivity and Measurement Methods/Measurement Examples'
The "Fundamentals of Thermal Conductivity and Measurement Methods/Case Studies" seminar hosted by Nikkan Kogyo Shimbun will be held soon! In manufacturing and development, thermal issues in electronic devices and materials cannot be avoided. To solve these problems, it is essential to accurately understand the "thermal conductivity" of components and materials and to carry out appropriate thermal design. This seminar will cover the various types of thermal conductive materials used in electronic devices, detailing their measurement methods and specific case studies. By understanding the characteristics and advantages of various thermal conductivity measurement methods, participants will develop the skills to select the optimal method according to the situation. Additionally, actual measurement case studies of thermal conductivity will be introduced, providing knowledge directly applicable to product development and quality control. This seminar is recommended for those who want to acquire advanced thermal property measurement techniques to improve the performance of electronic products and prevent issues. <Knowledge to be Acquired> ◇ Basic knowledge of thermal conductivity ◇ Principles of thermal conductivity measurement instruments ◇ Differences in thermal conductivity measurement methods (which instruments to use for which types of samples) Please click the [Details & Registration] button below to apply.
For the efficiency of product design and development! Analyzing mechanical behavior, including deformation of parts due to load, contributes to reducing prototyping costs and shortening development ti...
- Other analyses
SCORG is a measurement software for the design and analysis of screw compressors, expanders, pumps, and motors.
- simulator
- Thermo-fluid analysis
- Contract Analysis
The upgraded hot end allows for quick release and installation in just one minute.
- 3D Printer
Stable performance for 8,000 hours: The thick metal plate and aluminum alloy vertical profile provide stable performance.
- 3D Printer
High-stability cube-shaped frame. It has an orthogonal structure and is reinforced by a silicone bed mount.
- 3D Printer
A design that achieves unparalleled precision and surface finishing.
- 3D Printer
High-precision simulation software recognized by the world.
- simulator
- Solar power generator
- SFA/Sales Support System
Announcement of the Laplace Seminar to be held in January
We invite you to participate in the "Laplace Seminar," a content-rich event that includes a casual Q&A session to introduce our products and solutions. Please join us as a place for information gathering and study. ■ Kyoto Venue <Date and Location> Date: January 24, 2020 (Friday) Venue: Laplace System Co., Ltd. Kyoto Headquarters <Seminar Content> Part 1 (14:30–15:30): Overview of Solar Pro products and new features Part 2 (15:45–16:45): Monitoring and output control, etc. Part 3 (17:00–17:30): Individual consultations
~Press molding simulation software for all tool designers~
- Stress Analysis
The most innovative software for hot/cold forging simulation!
- Other analyses
World's first! Dedicated software developed for extrusion technology simulation and optimization of extrusion die design.
- Thermo-fluid analysis
Equipped with unique dedicated features specialized for ring rolling analysis!
- Structural Analysis
Transforming the design process to achieve early launch of new products!
- Stress Analysis
- Complete solid, high-speed, injection molding simulation -
- Stress Analysis
COPRA is a global analysis software specialized in roll forming. We offer a total solution from design and analysis to parts database management.
- Stress Analysis
- General-purpose P-method nonlinear finite element analysis system for designers - StressCheck
- Structural Analysis
A paper box that wraps the ultimate food.
- Printing/Publishing
- Prototype Services
- Exhibition planning/construction
Improving work efficiency with multiple tool library management! Let me explain the greatness of "Multi-Tool Library" in BobCAD-CAM!
- 3D CAD
- 3D CAM
The tool database input and surface shading rendering are also standard features, thoroughly pursuing ease of use!
- Other CAD
It features heat resistance above 300℃ and high rigidity, making it suitable for the manufacture of high-temperature components. It can be used for tooling and functional testing.
- 3D Printer
All measurement conditions, including high voltage bias and gain, can be set using the included control software!
- Other analyses
It combines high transparency and durability, and due to its load-bearing capacity, it is suitable for lightweighting parts that require durability, such as handles, cranks, and knobs.
- 3D Printer
A package that protects products for a lifetime.
- Printing/Publishing
- Prototype Services
- Exhibition planning/construction
Over 80 years of know-how utilized for comprehensive domestic support! We flexibly accommodate requests ranging from total design for manufacturing and assembly to prototypes and specific processes on...
- Prototype Services