List of CAE products
- classification：CAE
901～945 item / All 3770 items
Reduce the workload from handling heavy objects! Here are five case studies that solved customer challenges! We are also accepting free consultations and tests tailored to your work!
- Other conveying machines
Presentation of explanatory materials on JIS and ISO standards. We propose suitable safety barriers from a rich product series! Free rental of demo kits.
- Other safety and hygiene products
Eliminating guess-based reliability assessment with reliability modeling that quantifies risk.
- simulator
[New Publication: White Paper] Optimization of CAPEX, Risk Mitigation, and Performance Maximization Throughout the Entire Plant Lifecycle
Among equipment projects, one in five is seen to be over budget, making decision-making regarding all expenditures crucial for equipment project owners. Throughout the project lifecycle or the lifespan of the plant, various concerns and decisions, both large and small, may arise from design to operation. Decisions are often based on trade-offs between the ability to achieve key performance indicators such as plant throughput, quality, uptime, and safety, and costs. Carefully evaluating these trade-offs fundamentally determines whether the project will succeed, achieve overall goals, and result in customer satisfaction. For more details, please refer to the related catalog.
Equipped with electron microscopes, metal microscopes, and more! We analyze based on accumulated experience.
- Analysis Services
The loaded data can be analyzed using analysis software for conditional searches and trigger searches, which helps reduce analysis time.
- Other analyses
In addition to reading VAM data, settings and monitoring are possible! The read data can be sent via email and analyzed on a PC.
- Other analyses
Temperature Control Chamber for Camera System Testing
- Temperature and humidity measuring instruments
- Temperature and Humidity Control
- Other analyses
For concerns such as liquid leakage from joints and the risk of liquid leakage during disasters like earthquakes!
- Structural Analysis
Turnkey HPC. Flexible options for both location and scale.
- Analysis Services
An open and flexible integrated platform for inclusive model-based development.
- simulator
Current Status and Future Challenges of Press Forming Simulation Related to Mold Deflection
- simulator
Feature-rich general-purpose process simulator: Make free choices in a risk-free virtual environment. [Online experience seminar in progress]
- simulator
Composite material property calculation tool (Young's modulus, thermal conductivity, etc.)
- Mechanism Analysis
Comprehensive CAE post-processing and data visualization
- Other analyses
2D/3D CAE - Experimental data analysis and plot creation
- Other analyses
Visual environment for model-based development of embedded systems
- Other analyses
Mathematical formulas, script writing, data analysis, visualization
- Other analyses
Exploration and optimization of powerful design
- Other analyses
Design for efficient metal and resin extrusion molding.
- Other analyses
Topology exploration of electric motors and multiphysics optimization.
- Magnetic field analysis/electromagnetic wave analysis
Accelerate the design of motors, sensors, and actuators.
- Other analyses
SCORG is a measurement software for the design and analysis of screw compressors, expanders, pumps, and motors.
- simulator
- Thermo-fluid analysis
- Contract Analysis
This is an introduction to press forming simulation that takes into account mold deflection using "ASU/ISTR" and "ASU/P-form."
- simulator
Are you measuring the correct thermal conductivity of the thermal pad?
- Thermo-fluid analysis
[Web Seminar for Electronics Manufacturers and Developers] The First Step in Solving Thermal Issues! 'Basics of Thermal Conductivity and Measurement Methods/Measurement Examples'
The "Fundamentals of Thermal Conductivity and Measurement Methods/Case Studies" seminar hosted by Nikkan Kogyo Shimbun will be held soon! In manufacturing and development, thermal issues in electronic devices and materials cannot be avoided. To solve these problems, it is essential to accurately understand the "thermal conductivity" of components and materials and to carry out appropriate thermal design. This seminar will cover the various types of thermal conductive materials used in electronic devices, detailing their measurement methods and specific case studies. By understanding the characteristics and advantages of various thermal conductivity measurement methods, participants will develop the skills to select the optimal method according to the situation. Additionally, actual measurement case studies of thermal conductivity will be introduced, providing knowledge directly applicable to product development and quality control. This seminar is recommended for those who want to acquire advanced thermal property measurement techniques to improve the performance of electronic products and prevent issues. <Knowledge to be Acquired> ◇ Basic knowledge of thermal conductivity ◇ Principles of thermal conductivity measurement instruments ◇ Differences in thermal conductivity measurement methods (which instruments to use for which types of samples) Please click the [Details & Registration] button below to apply.
Even thin and small samples, as well as samples with high thermal conductivity, can be measured!
- Thermo-fluid analysis
[Web Seminar for Electronics Manufacturers and Developers] The First Step in Solving Thermal Issues! 'Basics of Thermal Conductivity and Measurement Methods/Measurement Examples'
The "Fundamentals of Thermal Conductivity and Measurement Methods/Case Studies" seminar hosted by Nikkan Kogyo Shimbun will be held soon! In manufacturing and development, thermal issues in electronic devices and materials cannot be avoided. To solve these problems, it is essential to accurately understand the "thermal conductivity" of components and materials and to carry out appropriate thermal design. This seminar will cover the various types of thermal conductive materials used in electronic devices, detailing their measurement methods and specific case studies. By understanding the characteristics and advantages of various thermal conductivity measurement methods, participants will develop the skills to select the optimal method according to the situation. Additionally, actual measurement case studies of thermal conductivity will be introduced, providing knowledge directly applicable to product development and quality control. This seminar is recommended for those who want to acquire advanced thermal property measurement techniques to improve the performance of electronic products and prevent issues. <Knowledge to be Acquired> ◇ Basic knowledge of thermal conductivity ◇ Principles of thermal conductivity measurement instruments ◇ Differences in thermal conductivity measurement methods (which instruments to use for which types of samples) Please click the [Details & Registration] button below to apply.
Leave the measurement of the thermal conductivity of carbon fiber reinforced plastic (CFRP) to us.
- Thermo-fluid analysis
[Web Seminar for Electronics Manufacturers and Developers] The First Step in Solving Thermal Issues! 'Basics of Thermal Conductivity and Measurement Methods/Measurement Examples'
The "Fundamentals of Thermal Conductivity and Measurement Methods/Case Studies" seminar hosted by Nikkan Kogyo Shimbun will be held soon! In manufacturing and development, thermal issues in electronic devices and materials cannot be avoided. To solve these problems, it is essential to accurately understand the "thermal conductivity" of components and materials and to carry out appropriate thermal design. This seminar will cover the various types of thermal conductive materials used in electronic devices, detailing their measurement methods and specific case studies. By understanding the characteristics and advantages of various thermal conductivity measurement methods, participants will develop the skills to select the optimal method according to the situation. Additionally, actual measurement case studies of thermal conductivity will be introduced, providing knowledge directly applicable to product development and quality control. This seminar is recommended for those who want to acquire advanced thermal property measurement techniques to improve the performance of electronic products and prevent issues. <Knowledge to be Acquired> ◇ Basic knowledge of thermal conductivity ◇ Principles of thermal conductivity measurement instruments ◇ Differences in thermal conductivity measurement methods (which instruments to use for which types of samples) Please click the [Details & Registration] button below to apply.
For the efficiency of product design and development! Analyzing mechanical behavior, including deformation of parts due to load, contributes to reducing prototyping costs and shortening development ti...
- Other analyses
SCORG is a measurement software for the design and analysis of screw compressors, expanders, pumps, and motors.
- simulator
- Thermo-fluid analysis
- Contract Analysis
High-precision simulation software recognized by the world.
- simulator
- Solar power generator
- SFA/Sales Support System
Announcement of the Laplace Seminar to be held in January
We invite you to participate in the "Laplace Seminar," a content-rich event that includes a casual Q&A session to introduce our products and solutions. Please join us as a place for information gathering and study. ■ Kyoto Venue <Date and Location> Date: January 24, 2020 (Friday) Venue: Laplace System Co., Ltd. Kyoto Headquarters <Seminar Content> Part 1 (14:30–15:30): Overview of Solar Pro products and new features Part 2 (15:45–16:45): Monitoring and output control, etc. Part 3 (17:00–17:30): Individual consultations
~Press molding simulation software for all tool designers~
- Stress Analysis
The most innovative software for hot/cold forging simulation!
- Other analyses
World's first! Dedicated software developed for extrusion technology simulation and optimization of extrusion die design.
- Thermo-fluid analysis
Equipped with unique dedicated features specialized for ring rolling analysis!
- Structural Analysis
Transforming the design process to achieve early launch of new products!
- Stress Analysis
- Complete solid, high-speed, injection molding simulation -
- Stress Analysis
COPRA is a global analysis software specialized in roll forming. We offer a total solution from design and analysis to parts database management.
- Stress Analysis