List of Printed Circuit Board products
- classification:Printed Circuit Board
676~690 item / All 1984 items
Presentation of explanatory materials on JIS and ISO standards. We propose suitable safety barriers from a rich product series! Free rental of demo kits.
- Other safety and hygiene products
You can download a free booklet that introduces the uses, structures, and examples of various types of frames.
- Other machine tools
- Solar power generator
- Other energy equipment
Supports from small quantities to mass production. UL compliant, bendable processing available, compatible pitch: 0.5 to 2.54 mm, cable length: up to 1,000 mm.
- Printed Circuit Board
- cable
- Other cable related products
We have compiled terms used in meetings related to FPC manufacturing. Please use it as an introductory mini-dictionary and an offline search tool.
- Printed Circuit Board
Press Release from Taiyo TechnoRex: Participation in Wakayama Prefecture's "Space Town Development Promotion Project"
Our company has decided to participate in the "Space Town Development Promotion Project (Kii Space HUB)," which aims to create new industries and revitalize the region with a space theme, promoted by Wakayama Prefecture, in our core business of electronic substrate. Taking this opportunity, we will actively advance our technological development and business enhancement in the space field. The Space Town Development Promotion Project is a project aimed at the accumulation of the space industry, human resource development, and regional revitalization in Wakayama Prefecture, where the private rocket launch site "Spaceport Kii" is located, and it has garnered national attention. We aim to contribute to the lightweight and high functionality of space equipment by leveraging the manufacturing technologies of flexible printed circuit boards and electroforming that we have cultivated so far. In the future, we will actively engage in human resource development for those involved in the space business, starting with the provision of technology for satellite-mounted equipment and communication modules. We will also consider collaboration with private space companies, promoting value creation and business development in this new field of the space industry, while striving to balance technological innovation and social contribution, and continuing our challenges toward realizing a sustainable future.
Surface treatment using plating to prevent light reflection, enabling ultra-fine processing at the micron level! It is widely applied in fields such as electronic components and semiconductors.
- Printed Circuit Board
【TTL】Microfabrication technology! Applying techniques such as electroplating, silicon etching, and glass etching to the development of various advanced technologies!
Microfabrication technology (photofabrication) plays an important role as a production technology, producing precision machined components such as lead frames, HDD suspensions, encoders, TAB tapes, various filters, and decorative items. Additionally, based on photofabrication technology, current advanced technologies such as printed circuit boards, photomasks for LSI, color filters for color liquid crystal display devices, and semiconductors are also being developed. [Source: Photofabrication Association - Technical Explanation]
Ultra-fine processing at the micron level is possible! It is widely applied in fields such as electronic components and semiconductors.
- Printed Circuit Board
Press Release from Taiyo TechnoRex: Participation in Wakayama Prefecture's "Space Town Development Promotion Project"
Our company has decided to participate in the "Space Town Development Promotion Project (Kii Space HUB)," which aims to create new industries and revitalize the region with a space theme, promoted by Wakayama Prefecture, in our core business of electronic substrate. Taking this opportunity, we will actively advance our technological development and business enhancement in the space field. The Space Town Development Promotion Project is a project aimed at the accumulation of the space industry, human resource development, and regional revitalization in Wakayama Prefecture, where the private rocket launch site "Spaceport Kii" is located, and it has garnered national attention. We aim to contribute to the lightweight and high functionality of space equipment by leveraging the manufacturing technologies of flexible printed circuit boards and electroforming that we have cultivated so far. In the future, we will actively engage in human resource development for those involved in the space business, starting with the provision of technology for satellite-mounted equipment and communication modules. We will also consider collaboration with private space companies, promoting value creation and business development in this new field of the space industry, while striving to balance technological innovation and social contribution, and continuing our challenges toward realizing a sustainable future.
From high-frequency applications to the design, manufacturing, evaluation testing, and analysis reports of flexible printed circuit boards with various characteristics!
- Printed Circuit Board
【TTL_Exhibition Participation Information】JPCAShow2025 'Newly Developed Topics.'
◆FPC (Flexible Printed Circuit Board)◆ ~Tayo Technorex's Strengths in the FPC Manufacturing Process~ The manufacturing of FPC requires multiple critical processing steps. Improving the "strengths" of each process directly leads to advancements in technology and quality, as well as new product development. This time, we will introduce the "strengths" we have cultivated over many years in each process! <Design> Circuit design, artwork, S-parameter analysis <Layer Connection> Build-up FPC, filled vias, small-diameter vias <Circuit Formation> MSAP method, thin copper, thick copper <Insulation Treatment> High-precision openings ±20μm, LCP coverlay <Surface Treatment> Standard NiAu to special plating options (Ni-Pd-Au, direct Au, etc.) <Post-Processing> High-precision outline processing ±50μm, diverse tools <Assembly> Solder mounting, ACF bonding, wire bonding, ultrasonic joining, EMS support ◆Various Substrates and Ceramic Material Systems◆ Introduction of AI technology, final appearance inspection equipment, and electrical testing equipment ◆Efficiency and Automation◆ Proposals for utilizing FA and collaborative robots
Ultra-fine lines, high density, and high-resolution flexible printed circuit boards have made it possible to form ultra-fine circuits through the integration of MSAP technology and via filling techniq...
- Printed Circuit Board
- Circuit board design and manufacturing
【TTL_Exhibition Participation Information】JPCAShow2025 'Newly Developed Topics.'
◆FPC (Flexible Printed Circuit Board)◆ ~Tayo Technorex's Strengths in the FPC Manufacturing Process~ The manufacturing of FPC requires multiple critical processing steps. Improving the "strengths" of each process directly leads to advancements in technology and quality, as well as new product development. This time, we will introduce the "strengths" we have cultivated over many years in each process! <Design> Circuit design, artwork, S-parameter analysis <Layer Connection> Build-up FPC, filled vias, small-diameter vias <Circuit Formation> MSAP method, thin copper, thick copper <Insulation Treatment> High-precision openings ±20μm, LCP coverlay <Surface Treatment> Standard NiAu to special plating options (Ni-Pd-Au, direct Au, etc.) <Post-Processing> High-precision outline processing ±50μm, diverse tools <Assembly> Solder mounting, ACF bonding, wire bonding, ultrasonic joining, EMS support ◆Various Substrates and Ceramic Material Systems◆ Introduction of AI technology, final appearance inspection equipment, and electrical testing equipment ◆Efficiency and Automation◆ Proposals for utilizing FA and collaborative robots
We welcome inquiries and consultations regarding flexible procurement challenges! We respond to various requests, including halogen-free types. We cater to everything from digital cameras to the aeros...
- Printed Circuit Board
- Circuit board design and manufacturing
- Other electronic parts
【TTL_Exhibition Participation Information】JPCAShow2025 'Newly Developed Topics.'
◆FPC (Flexible Printed Circuit Board)◆ ~Tayo Technorex's Strengths in the FPC Manufacturing Process~ The manufacturing of FPC requires multiple critical processing steps. Improving the "strengths" of each process directly leads to advancements in technology and quality, as well as new product development. This time, we will introduce the "strengths" we have cultivated over many years in each process! <Design> Circuit design, artwork, S-parameter analysis <Layer Connection> Build-up FPC, filled vias, small-diameter vias <Circuit Formation> MSAP method, thin copper, thick copper <Insulation Treatment> High-precision openings ±20μm, LCP coverlay <Surface Treatment> Standard NiAu to special plating options (Ni-Pd-Au, direct Au, etc.) <Post-Processing> High-precision outline processing ±50μm, diverse tools <Assembly> Solder mounting, ACF bonding, wire bonding, ultrasonic joining, EMS support ◆Various Substrates and Ceramic Material Systems◆ Introduction of AI technology, final appearance inspection equipment, and electrical testing equipment ◆Efficiency and Automation◆ Proposals for utilizing FA and collaborative robots
Introduction to high-difficulty FPCs, specific issues, and TAIYO's one-stop service, covering the basics of flexible substrates (glossary)!
- Printed Circuit Board
- Other cable related products
- Other electronic parts
【TTL_Exhibition Participation Information】JPCAShow2025 'Newly Developed Topics.'
◆FPC (Flexible Printed Circuit Board)◆ ~Tayo Technorex's Strengths in the FPC Manufacturing Process~ The manufacturing of FPC requires multiple critical processing steps. Improving the "strengths" of each process directly leads to advancements in technology and quality, as well as new product development. This time, we will introduce the "strengths" we have cultivated over many years in each process! <Design> Circuit design, artwork, S-parameter analysis <Layer Connection> Build-up FPC, filled vias, small-diameter vias <Circuit Formation> MSAP method, thin copper, thick copper <Insulation Treatment> High-precision openings ±20μm, LCP coverlay <Surface Treatment> Standard NiAu to special plating options (Ni-Pd-Au, direct Au, etc.) <Post-Processing> High-precision outline processing ±50μm, diverse tools <Assembly> Solder mounting, ACF bonding, wire bonding, ultrasonic joining, EMS support ◆Various Substrates and Ceramic Material Systems◆ Introduction of AI technology, final appearance inspection equipment, and electrical testing equipment ◆Efficiency and Automation◆ Proposals for utilizing FA and collaborative robots
We specialize in the implementation of a small number of diverse printed circuit boards.
- Printed Circuit Board
【Zero Waiting Time for Estimates!】 By simply filling out the necessary information, you can achieve an estimate response with "zero waiting time." We won't keep you waiting for PCB manufacturing estim...
- Printed Circuit Board
[Application Examples] Application Materials for High-Frequency Passive Probes / MP300
- Printed Circuit Board
Birth of a substrate utilizing new materials.
- Printed Circuit Board
Eliminate unexpected defective product leaks and delays in delivery due to complaint handling. We will respond with automatic inspection equipment and facilities, as well as experienced microscope ins...
- Printed Circuit Board
Leave the handling of printed circuit board claims to us. Quick, careful, and low-cost! Our employees, who are well-versed in circuit boards, will solve your problems.
- Printed Circuit Board