List of Other electronic parts products
- classification：Other electronic parts
181～240 item / All 8155 items
Reduce the workload from handling heavy objects! Here are five case studies that solved customer challenges! We are also accepting free consultations and tests tailored to your work!
- Other conveying machines
Presentation of explanatory materials on JIS and ISO standards. We propose suitable safety barriers from a rich product series! Free rental of demo kits.
- Other safety and hygiene products
High-performance heat sink series for power electronics PM (Profilmecc)
- Other electronic parts
High-Performance Heat Sink for Power Electronics PM (Profilmecc) Series
- Other electronic parts
Monitor CAN/CAN FD data via USB connection!
- Other electronic parts
Easy access to CAN/LIN channels via Ethernet/USB!
- Other electronic parts
Responding to ODM mass production through collaboration with implementation manufacturers and PCB manufacturers (China) with whom we have a business partnership!
- Circuit board design and manufacturing
- Other electronic parts
High power & wide-range scanning! Equipped with a large mirror to achieve small spot and high-density processing!
- Scanner
- Multifunction printer
- Other electronic parts
Next-generation ultra-fast Z-axis focus unit
- Other electronic parts
BGA heat sink with a black anodized surface made of AL6063-T5 aluminum alloy.
- Other electronic parts
Aluminum extruded heat sink with pins for fixing the substrate, capable of securing semiconductors with a dedicated clip.
- Other electronic parts
Improvement of electrical performance and response performance through partial coating! Contributes to the enhancement of product functionality.
- Processing Contract
- Coating Agent
- Other electronic parts
![[Analysis Case] Competitive Adsorpt...](https://image.mono.ipros.com/public/product/image/387108/IPROS9160298122875376108.jpg?w=280&h=280){kind=small}
It is possible to evaluate the competitive adsorption of multiple molecules using the focus parameters for film formation (temperature, pressure).
- Contract Analysis
- Other electronic parts
- Memory
Introducing a case where low melting viscosity hot melt was used for sealing IC tags.
- Processing Contract
- Other electronic parts
- Coating Agent
Hot melt molding for waterproofing, dustproofing, and miniaturization of M2M/IOT sensors.
Our company specializes in hot melt technology, specifically "hot melt molding," which is used for low-pressure molding to seal electronic devices. In recent years, we have received a significant number of inquiries for M2M/IOT applications, particularly for sensors installed outdoors and those used in harsh environments, aimed at waterproofing, dustproofing, and insulation. Examples of inquiries: - Sensors for agricultural applications (soil sensors, livestock management sensors) - Sensors for building management - Sensors for monitoring the operational status of outdoor equipment (such as outdoor units) - Drones, etc. Why is hot melt molding gaining attention? - It can mold at low pressure, allowing for sealing even delicate sensors. - Extensive waterproofing and dustproofing experience cultivated through automotive components. - The hot melt used is flame-retardant and UL94 V-0 certified. - The raw materials are derived from natural components (non-petroleum-based) and are environmentally friendly. Matsumoto Processing also accommodates small-batch sealing through a contract production system. Customers with themes related to waterproofing and dustproofing for sensors are encouraged to inquire.
LED module waterproof sealing! A case of process improvement through switching from potting.
- Other molds
- Coating Agent
- Other electronic parts
Hot melt molding for waterproofing, dustproofing, and miniaturization of M2M/IOT sensors.
Our company specializes in hot melt technology, specifically "hot melt molding," which is used for low-pressure molding to seal electronic devices. In recent years, we have received a significant number of inquiries for M2M/IOT applications, particularly for sensors installed outdoors and those used in harsh environments, aimed at waterproofing, dustproofing, and insulation. Examples of inquiries: - Sensors for agricultural applications (soil sensors, livestock management sensors) - Sensors for building management - Sensors for monitoring the operational status of outdoor equipment (such as outdoor units) - Drones, etc. Why is hot melt molding gaining attention? - It can mold at low pressure, allowing for sealing even delicate sensors. - Extensive waterproofing and dustproofing experience cultivated through automotive components. - The hot melt used is flame-retardant and UL94 V-0 certified. - The raw materials are derived from natural components (non-petroleum-based) and are environmentally friendly. Matsumoto Processing also accommodates small-batch sealing through a contract production system. Customers with themes related to waterproofing and dustproofing for sensors are encouraged to inquire.
We solved the request to tidy up the internal wiring of the enclosure with hot melt molding!
- Processing Contract
- Other electronic parts
- Coating Agent
Hot melt molding for waterproofing, dustproofing, and miniaturization of M2M/IOT sensors.
Our company specializes in hot melt technology, specifically "hot melt molding," which is used for low-pressure molding to seal electronic devices. In recent years, we have received a significant number of inquiries for M2M/IOT applications, particularly for sensors installed outdoors and those used in harsh environments, aimed at waterproofing, dustproofing, and insulation. Examples of inquiries: - Sensors for agricultural applications (soil sensors, livestock management sensors) - Sensors for building management - Sensors for monitoring the operational status of outdoor equipment (such as outdoor units) - Drones, etc. Why is hot melt molding gaining attention? - It can mold at low pressure, allowing for sealing even delicate sensors. - Extensive waterproofing and dustproofing experience cultivated through automotive components. - The hot melt used is flame-retardant and UL94 V-0 certified. - The raw materials are derived from natural components (non-petroleum-based) and are environmentally friendly. Matsumoto Processing also accommodates small-batch sealing through a contract production system. Customers with themes related to waterproofing and dustproofing for sensors are encouraged to inquire.
"Complete sealing of electronic components in just a few dozen seconds. Ideal for waterproofing, dustproofing, and insulation!" Hot melt molding is gaining attention for the waterproof sealing of elec...
- Other polymer materials
- Coating Agent
- Other electronic parts
Waterproof and insulation protection for small motors in a short time. The spotlighted sealing technology "Hot Melt Molding."
"Complete sealing of small motors in just a few dozen seconds. Ideal for waterproofing, dustproofing, and insulation!" Hot melt molding, which is gaining attention for waterproof sealing of small motors, is a technology that achieves environmental protection such as waterproofing and dustproofing by low-pressure insert molding of thermoplastic adhesives. Compared to traditional thermosetting resin sealing, two-component potting, and conformal coating, sealing is completed in an extremely short time, leading to its expanded adoption as a sealing technology. If you are considering waterproof sealing and protection for small motors, please feel free to contact us.
We provide certification services and authorization acquisition agency services related to radio wave laws in countries around the world. We reduce the time, cost, and effort involved in regulatory co...
- Other electronic parts
[Online Seminar] Key Points and Latest Trends in Radio Law Applications for Asian Countries in 2024, along with Updates on Major Regulatory Changes in Other Countries.
When shipping wireless-equipped products to countries in the Asia region, it is necessary to meet the regulatory requirements for each destination. These requirements vary significantly due to the radio wave regulations of each country and region, and in recent years, there have been changes to regulations and revisions to the application processes. This seminar will serve as a revised version of the radio wave regulation seminar conducted in 2022 for countries in the Asia region, following up on the previous content while also providing information on the latest trends and regulatory updates. This seminar is intended for those planning to expand their products to various Asian countries, as well as for those who are already operating in the region, providing an opportunity to organize information. Additionally, the second part of the seminar will include the latest trends from major countries outside of Asia. It will also be useful for obtaining the latest information. You can check the details of the seminar by clicking the "Details & Registration" button below.
For devices that require a clock in digital circuits! We propose the high-precision, compact Seiko Epson SPXO.
- Other electronic parts
For devices that require a digital circuit clock! High precision, compact Seiko Epson crystal oscillator (X'tal).
- Other electronic parts
Even if it's used frequently, it's durable! Are you looking for a high-precision rotary volume?
- Other electronic parts
Aluminum extruded heat sink with substrate fixing pins and nylon washers.
- Other electronic parts
Aluminum extruded heat sink with substrate fixing pins and nylon washers.
- Other electronic parts
Aluminum extruded heat sink with pins for fixing the substrate and nylon washers.
- Other electronic parts
Aluminum extruded heat sink with pins for fixing the substrate, capable of securing semiconductors with a dedicated clip.
- Other electronic parts
Aluminum extruded heat sink with pins for fixing the substrate, capable of securing semiconductors with a dedicated clip.
- Other electronic parts
Clip-type heat sink using AL1050 (with mounting pins for circuit board)
- Other electronic parts
Aluminum extruded heat sink with pins for substrate fixation, featuring M3 screw holes for semiconductor mounting.
- Other electronic parts
Maximizing the efficiency of the thermal system with an optimized aluminum base plate and embedded tubes.
- Other electronic parts
It ensures reliable and seamless bonding through solid-state FSW.
- Other electronic parts
LED indoor lighting and LED downlights use LED modules for COB heat dissipation.
- Other electronic parts
LED modules used in indoor LED lighting and LED downlights for COB heat dissipation.
- Other electronic parts
The LED module and COB are designed to be easily secured with screws.
- Other electronic parts
The LED module and COB are designed in advance to facilitate easy screw fixation.
- Other electronic parts
It is designed to securely fix major manufacturers' LED modules and COBs with screws.
- Other electronic parts
Mounting hole options compatible with major manufacturers' LED modules and COB.
- Other electronic parts
There are mounting hole options compatible with major manufacturers' LED modules and COB.
- Other electronic parts
Mounting hole options compatible with major manufacturers' LED modules and COBs.
- Other electronic parts
Mounting hole options compatible with major manufacturers' LED modules and COBs.
- Other electronic parts
Mounting hole options compatible with major manufacturers' LED modules and COBs.
- Other electronic parts
Mounting hole options compatible with major manufacturers' LED modules and COBs.
- Other electronic parts
Floodlights, streetlights, and facility lighting using SMD chip LEDs such as 3030, 2835, and 5050 for heat dissipation.
- Other electronic parts
Mounting hole options compatible with major manufacturers' LED modules and COBs.
- Other electronic parts
Options for mounting holes compatible with major manufacturers' LED modules and COBs are available.
- Other electronic parts
Optional mounting holes compatible with major manufacturers' LED modules and COB.
- Other electronic parts
Pure aluminum (AL1050 / AL1060 / AL1070) available! 2.0mm diameter round pin fin heat sink with excellent heat dissipation.
- Other electronic parts
Pure aluminum (AL1050 / AL1060 / AL1070) available! 2.3mm diameter round pin fin heat sink with excellent heat dissipation.
- Other electronic parts
Pure aluminum (AL1050 / AL1060 / AL1070) available! 2.3mm diameter round pin fin heat sink with excellent heat dissipation.
- Other electronic parts
Pure aluminum (AL1050 / AL1060 / AL1070) available! 2mm diameter round pin fin heat sink with excellent heat dissipation.
- Other electronic parts
Pure aluminum (AL1050 / AL1060 / AL1070) available! 2.7mm diameter round pin fin heat sink with excellent heat dissipation.
- Other electronic parts
IC cooler with a DC fan integrated into an AL6063-T5 heat sink (with fan guard and resin push pins).
- Other electronic parts
Pure aluminum (AL1050 / AL1060 / AL1070) available! 2.7mm diameter round pin fin heat sink with excellent heat dissipation.
- Other electronic parts
Round pin fin heat sink with excellent heat dissipation using CU1100.
- Other electronic parts
Thin fancy sink with a height of 13mm (L70.0 x W60.0 x H13.0 mm)
- Other electronic parts
Scheduled for exhibition at Techno Frontier 2025! JARO's cold forged pin fin IC cooler, ultra-thin type.
- Other electronic parts
A slim fan sink with a height of 12.7mm and a unique finger guard.
- Other electronic parts
Aluminum extruded heat sink with pins for fixing the substrate, capable of securing semiconductors with a dedicated clip.
- Other electronic parts
A box that can combine 6:4 RF input and output into a matrix state.
- Other electronic parts
Asynchronous bidirectional frequency conversion of the input signal.
- Other electronic parts
Released Rad-Hard versions of SigmaQuad-II+, SyncBurst, and NBT SRAM.
- Other electronic parts
- Memory
GSI Technology Rad-Hard SRAM
Release of Rad-Hard versions of SigmaQuad-II+, SyncBurst, and NBT SRAM! GSI's Rad-Hard SRAM is expected to be a key component in advanced systems utilizing cutting-edge FPGAs, ADCs, and DACs. The initial release products are certified to Class-Q and Class-V levels to meet the stringent requirements of aerospace and defense customers. For satellite and defense customers eagerly awaiting alternatives to current Rad-Hard memory solutions, GSI's Rad-Hard SRAM leverages our proven commercial technology and architecture with radiation enhancement, providing efficient and high-performance state-of-the-art memory at the 40nm technology node.
Suitable for a wide range of applications, from integration into AGVs, UAVs, and various applications to measurement purposes!
- Sensors
- Other electronic parts