List of Semiconductors and ICs products
- classification:Semiconductors and ICs
946~990 item / All 4375 items
Reduce the workload from handling heavy objects! Here are five case studies that solved customer challenges! We are also accepting free consultations and tests tailored to your work!
- Other conveying machines
Presentation of explanatory materials on JIS and ISO standards. We propose suitable safety barriers from a rich product series! Free rental of demo kits.
- Other safety and hygiene products
High-performance radiator with 3 AC230V axial fans + airflow chamber + aluminum heat sink.
- Other semiconductors
Powerful forced air cooling radiator combining AC230V axial fan, airflow chamber, and aluminum heat sink.
- Other semiconductors
CZ method/FZ method, we can provide single crystal silicon ingots up to a maximum diameter of Φ600mm!
- Other semiconductors
The misalignment of measures is due to the shallow exploration of the causes. By repeatedly asking questions, the essence becomes clear.
- Other semiconductors
Semiconductor parts microfabrication. We accept processing from 1 to 100 pieces per month.
- Other semiconductors
W190mm x H66mm hollow type heat sink with axial fan enables efficient heat dissipation.
- Other semiconductors
In addition to high-purity SiC for semiconductor device components, overseas SiC wafers, and refractory SiC, we also offer contract services for laser processing that is compatible with SiC components...
- Wafer
- Oxidation/Diffusion Device
Low power consumption radio tuner IC designed for disaster situations.
- Dedicated IC
Achieves angle accuracy of ±0.1°, comparable to optical types, with a magnetic encoder that is easy to assemble! No dust-proof measures are necessary! (Many successful switches from optical types have...
- Sensors
- Other semiconductors
A low-heat current sensor that contributes to the miniaturization of substrates!
- Other semiconductors
- Sensors
High-reliability 4Gb DDR3 memory series with built-in ECC.
- Memory
RAMXEED's RF communication and analog circuit technology for AD converters have been adopted by Seed Corporation's smart contact lenses!
- Memory
The wisdom of Japanese manufacturing × the abundant supply capacity of China
- Other semiconductors
- Other contract services
Maintains high stability even beyond the operating temperature in a compact size (2.0X1.6mm)!
- Other semiconductors
Environmentally resistant specifications supported! A SCSI-compatible memory drive is available as a replacement in case of failure. Comprehensive catalog and case study materials are currently being ...
- Memory
New SiC-SBD (low VF), compact surface mount package! AEC-Q101 compliant (planned).
- diode
Achieving the world's highest level of low loss! Samples are also available.
- Other semiconductors
Adopted by major domestic customers in FA, industrial machinery, and robot devices!
- Other semiconductors
Achieving world-class ultra-low VF! We would like to introduce our featured products.
- diode
Ultra-fast FRD, reducing recovery current by 40%! Low noise (reduction of noise countermeasure components)
- Other semiconductors
Overwhelming capacity of 800 machine tools! We will introduce processing examples of NC lathes (including multi-tasking machines).
- Processing Contract
- Other semiconductors
Socia's insulation panels are effective in manufacturing plants for semiconductors, precision machinery, pharmaceuticals, and food processing, as the temperature, humidity, and cleanliness do not fluc...
- Other semiconductors
SUS tank inside semiconductor manufacturing equipment
- Other semiconductors
[Factory Security] No software installation required
- Wafer
- controller
- Other inspection equipment and devices
Memory-focused company under the Chinese major television brand KONKA Group.
- Memory
Genuine adoption in various manufacturing equipment! It is also useful for repairs of manufacturing equipment.
- Other semiconductors
- Metal bearings
You can investigate the changes in degassing intensity while maintaining the temperature.
- Contract Analysis
- Memory
The diffusion layer structure of SiC devices can be visualized (high-sensitivity evaluation of the diffusion layer structure).
- Contract Analysis
- Transistor
The evaluation of the crystal structure can be performed based on the STEM images and the results of atomic composition measurements.
- Contract Analysis
- magnet
- Memory
Microscopic structural analysis of amorphous films is possible through simulation.
- Contract Analysis
- Memory
It is possible to confirm the stress distribution in the sample cross-section.
- Contract Analysis
- Wafer
It is possible to evaluate trace metals in ppm orders.
- Contract Analysis
- Ceramics
- Wafer
Evaluation of functional groups in graphene is possible using thermal decomposition GC/MS method.
- Contract Analysis
- Transistor
- Power storage device
Non-destructive three-dimensional observation of the internal structure of a discrete package.
- Contract Analysis
- Other semiconductors
Quantitative evaluation of the roughness of trench sidewalls related to device characteristics.
- Contract Analysis
- Other semiconductors
Evaluation of microscopic atomic structures is possible through computational simulation.
- Contract Analysis
- Other semiconductors
Reverse engineering of DRAM on the product's internal substrate.
- Contract Analysis
- Memory
It is possible to obtain insights into the size and distribution of crystal grains in metallic polycrystals.
- Contract Analysis
- Memory