List of Semiconductors and ICs products

  • classification:Semiconductors and ICs

1306~1350 item / All 4531 items

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Presentation of explanatory materials on JIS and ISO standards. We propose suitable safety barriers from a rich product series! Free rental of demo kits.

  • Satech - AdaptaGuard_Ipros_2023_JP_1.jpg
  • Satech - BlueGuard_Ipros_2023_JP_1.jpg
  • Satech - EasyGuard_Ipros_2023_JP_1.jpg
  • Satech - FastGuard_Ipros_2023_JP_2.jpg
  • Satech - ImpactGuard_Ipros_2023_JP_1.jpg
  • Satech - EasyGuard_Ipros_2023_JP_Media-gallery_1.jpg
  • Satech - ImpactGuard_Ipros_2023_JP_Media-gallery_2.jpg
  • Satech - AdaptaGuard_Ipros_2023_JP_Media-gallery_1.jpg
  • Satech - BlueGuard_Ipros_2023_JP_Media-gallery_2.jpg
  • Other safety and hygiene products

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Amino acid-derived natural cationic polymer that can be used in food preservatives, hygiene materials, and daily necessities. It is a safe material as it is a fermentation product produced by natural ...

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  • IPROS73360025638150253760.jpeg
  • Shelf life enhancer

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Introduction of the preservative polylysine / fermented polyamino acids that contribute to food poisoning prevention.

We provide easy-to-understand materials explaining the natural preservative polylysine, which prevents food poisoning. ε-Polylysine (hereafter referred to as polylysine) is an amino acid-derived preservative widely used as a food preservative. By adding polylysine, the growth of microorganisms that cause food poisoning can be prevented. Every year, food poisoning caused by microorganisms is a significant issue and is frequently reported in the news. Even foods that do not appear to be spoiled can rapidly proliferate microorganisms if the growth environment is suitable, so caution is necessary. Even if something looks clean, contamination by bacteria can progress, posing a risk of food poisoning. By ensuring hygiene management during the manufacturing process, proper storage at appropriate temperatures, and the appropriate use of the preservative polylysine, food safety can be more effectively protected. 【Features】 ■ A safe material produced through fermentation by natural microorganisms (not genetically modified organisms) ■ Provides a good image as a natural fermented product ■ Listed in the existing additive registry as a food preservative ■ A safe domestic product *Please feel free to contact us.

Bidirectional high pulses of both positive and negative voltages can be absorbed! Surface mount package that does not take up implementation area.

  • diode

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Thermal pad for TO-5 package transistors

  • aos-5-アルミナセラミックサーマルパッド-al2o3 (1).jpg
  • csm_1zeilMag_weiss_E_b78887b03c.jpg
  • Other semiconductors

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Thermal pad for TO-247 and TO-218 package transistors.

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  • csm_1zeilMag_weiss_E_b78887b03c.jpg
  • Other semiconductors

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Fischer Elektronik manufactured high-performance heat sink for forced air cooling (hollow type) W200mm x H84mm

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  • csm_1zeilMag_weiss_E_b78887b03c.jpg
  • Other semiconductors

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Clip-type heatsink for TO-220 package semiconductors that can be mounted without screws.

  • fk255.eps.jpg
  • csm_1zeilMag_weiss_E_b78887b03c.jpg
  • Other semiconductors

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54mm diameter round LED heat sink

  • ICKLEDR54x20G.jpg
  • csm_1zeilMag_weiss_E_b78887b03c.jpg
  • Other semiconductors

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Clip-type heat sink that can be mounted without screws on TO-247, TO-248, TO-220, and TO-218 package semiconductors.

  • FK-245-MI-247-O.jpg
  • csm_1zeilMag_weiss_E_b78887b03c.jpg
  • Other semiconductors

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Insulated clamp parts for TO-247 package power transistors

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  • csm_1zeilMag_weiss_E_b78887b03c.jpg
  • Other semiconductors

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Round Pin Heat Sink "ICK S R 140 x 70"

  • ick_s_r140x70.eps.jpg
  • csm_1zeilMag_weiss_E_b78887b03c.jpg
  • Other semiconductors

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Efficient heat dissipation is possible with a W129mm x H66mm hollow-type heat sink and axial fan.

  • la_hb5.eps.jpg
  • csm_1zeilMag_weiss_E_b78887b03c.jpg
  • Other semiconductors

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A clip that can securely make contact with a TO-220 package transistor and a heat sink.

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  • thfa2.eps.jpg
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  • Other semiconductors

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98 mm diameter x 50 mm height round pin fin heat sink (Al99.5)

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  • csm_1zeilMag_weiss_E_b78887b03c.jpg
  • Other semiconductors

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This is a black anodized heat sink for BGA with a width of 45 mm, a length of 42.5 mm, and a height of 6 mm.

  • csm_1zeilMag_weiss_E_b78887b03c.jpg
  • Other semiconductors

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200mm diameter, 40mm height round LED heat sink

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  • csm_1zeilMag_weiss_E_b78887b03c.jpg
  • Other semiconductors

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Efficient heat dissipation is possible with a W66mm x H66mm hollow-type heat sink and an axial fan.

  • la_hb4.eps.jpg
  • csm_1zeilMag_weiss_E_b78887b03c.jpg
  • Other semiconductors

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Axial flow heat sink with axial flow fan for AC230V

  • la_hl3.eps.jpg
  • la_hl1_3diag.eps.jpg
  • csm_1zeilMag_weiss_E_b78887b03c.jpg
  • Other semiconductors

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Heat sink for DIP IC (14, 16 contacts)

  • ick1416l.jpg
  • ick_l.eps.jpg
  • csm_1zeilMag_weiss_E_b78887b03c.jpg
  • Other semiconductors

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High-performance heat sink for forced air cooling (hollow type) W400mm x H88mm, 31 fins

  • sk440_461.eps.jpg
  • csm_1zeilMag_weiss_E_b78887b03c.jpg
  • Other semiconductors

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With a pressing force of 55N, the transistor in the TO-220 and TO-3P packages can be reliably brought into contact with the heat sink.

  • thfa8.eps.jpg
  • IPROS2175634052087143217.jpeg
  • Other semiconductors

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With a pressing force of 59N, it is possible to ensure that transistors in TO-248 and TO-218 packages make reliable contact with the heat sink.

  • thfa4.jpg
  • thfa4.eps.jpg
  • IPROS2175634052087143217.jpeg
  • Other semiconductors

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A pressing force of 20N can reliably ensure that the TO-220 package transistor makes contact with the heat sink.

  • thfa1.jpg
  • thfa1.eps.jpg
  • IPROS2175634052087143217.jpeg
  • Other semiconductors

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Zener diode combined with a transistor or MOSFET!

  • Transistor

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Built-in resistance allows for miniaturization of the set and reduction of component count due to the compact surface mount design!

  • Transistor

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One-stop solution from design to manufacturing of power semiconductors!

  • Other semiconductors

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Nikkankogyo Shimbun - Award-winning products of the Excellent New Technology and New Products Award! Eliminated the need for external shielding.

  • Other semiconductors

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Output current values can be adjusted according to the duty ratio of the pulse input signal!!

  • ASIC

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LED driver with adjustable light output now features additional protection functions, including open and short circuit detection!

  • ASIC

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You can download and view the latest flyers and catalog data distributed at the exhibition held in November 2024!

  • DRAM&Flash.JPG
  • カメラモジュール.jpg
  • Memory
  • Other semiconductors

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We offer semiconductor products primarily featuring Toshiba semiconductors, as well as LCDs and electronic components!

  • Other semiconductors

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Achieving a product pitch of ±0.03mm tailored to the specifications of the automatic assembly line! *Samples available upon request.

  • Other semiconductors

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Achieved a product pitch of ±0.03mm tailored to the specifications of the automatic assembly line!

  • 12a.PNG
  • 12b.PNG
  • Other semiconductors

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Achieves low RDS(on) to maximize the effective use of package space.

  • Other semiconductors

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Introducing our unique package and DioMOS technology fusion module!

  • Other semiconductors

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The adoption of a unique gate structure chip achieves high tolerance against lightning surges and other disturbances!

  • 3-2.PNG
  • Other semiconductors

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Insulation withstand voltage 2500V! A module that uses IGBTs specialized for high-speed performance.

  • Other semiconductors

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Compact, high-reliability SOT-227 standard package! Direct mounting to heat sinks is possible.

  • Other semiconductors

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A report analyzing industry and market trends, focusing on materials and devices expanding for AI data center applications that can handle the rapidly increasing AI processing.

  • Other semiconductors
  • Database
  • EAI/ETL/WEB application server

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A new style heat sink with lower thermal resistance than the popular FK244 series.

  • fk283.eps.jpg
  • fischer-elektronik-フィッシャー-smd-smt-ヒートシンク.jpg
  • csm_1zeilMag_weiss_E_b78887b03c.jpg
  • Other semiconductors

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By directly soldering SMT power devices to the circuit board, a heat dissipation effect can be achieved.

  • 1674879186.jpg
  • fk256tr.jpg
  • fischer-elektronik-フィッシャー-smd-smt-ヒートシンク.jpg
  • csm_1zeilMag_weiss_E_b78887b03c.jpg
  • Other semiconductors

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Here is an amazing thermal solution with exceptionally excellent thermal conductivity in the thickness direction of the TIM sheet!

  • Composite Materials
  • Other semiconductors
  • Generators and transmission motors

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Zebro.jpg

We will exhibit at the 2nd Power Device & Module EXPO!

We will be exhibiting at the 39th NePCON Japan (2nd Power Device & Module EXPO). We propose the vertically oriented high thermal conductivity TIM "Zebro." Just applying pressure (surface pressure) brings astonishing thermal management! It has high durability and does not suffer from characteristic degradation due to pump-out or dry-out phenomena. It can be used for a long time with stable low thermal resistance, making it a highly reliable heat dissipation material. For those looking for TIM with good thermal conductivity, or for those struggling with insufficient cooling from conventional heat dissipation materials, we provide thermal management solutions tailored to your needs. We sincerely look forward to your visit!

Heat sink for PCB mounting, 35.3 mm wide x 35 mm high.

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  • csm_1zeilMag_weiss_E_b78887b03c.jpg
  • Other semiconductors

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Pursuing extremes with rich achievements and advanced technology! Establishing a processing capability system positioned among the world's top class.

  • Other semiconductors
  • Wafer processing/polishing equipment

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An example of connecting different pitches through a pitch conversion adapter linked by a pattern!

  • Other semiconductors

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An adapter composed of a substrate material (CEM-3) that is resistant to high-temperature reflow and pin terminals for SMT implementation!

  • Other semiconductors

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A pin header composed of electrical connection pins and positioning and stacking pins, with a case where the spacer tube has been eliminated.

  • Other semiconductors

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