Last Updated： Aggregation Period:Oct 08, 2025～Nov 04, 2025
This ranking is based on the number of page views on our site.
Last Updated： Aggregation Period:Oct 08, 2025～Nov 04, 2025
This ranking is based on the number of page views on our site.
Last Updated： Aggregation Period:Oct 08, 2025～Nov 04, 2025
This ranking is based on the number of page views on our site.
16～30 item / All 552 items
The body weight is reduced by about 50%! These wheels are perfect for the product's legs.
Successful significant cost reduction achieved through new design (Design Registration No. 1103831). The main body weight has been reduced by approximately 50% (compared to conventional models). It is optimal as a product leg and also as factory equipment. Thoroughly pursuing affordability and ease of use.
Maintaining high dispersion for over a week! Dispersant for silicon wafers with high viscosity.
"VECTOR HTS-3" is a dispersant developed for the lapping of silicon wafers. It has high biodegradability and viscosity, and by mixing alumina with pure water, a moderately viscous lapping slurry can be obtained. There are no changes in physical or chemical properties, and high dispersibility is maintained for over a week. 【Features】 ■ For lapping slurry ■ High biodegradability ■ High viscosity ■ No changes in physical or chemical properties ■ Wafer flatness ■ Reduced wafer damage *For more details, please refer to the PDF document or feel free to contact us.
Additives developed for use in circulation pumps! Reduction in slurry waste and usage of abrasives.
"VECTOR HTN" is an additive for high-speed circulation slurries, developed for use with circulation pumps. It uniformly disperses various abrasives such as alumina, cerium, zirconia, SiC, B4C, synthetic/natural diamonds, and garnet. It can be continuously used as a circulation slurry, reducing slurry waste and the amount of abrasives used. 【Features】 ■ Improved dispersibility ■ Reduced material damage (processing altered layer) ■ High lap rate ■ Scratch-free ■ Effective cleaning after polishing *For more details, please refer to the PDF document or feel free to contact us.
Dilute to 5% for use with coolant capacity! It is an additive that helps prevent rust.
"Anti-Rust" is an additive that can be used to prevent rust by diluting it with coolant used in cutting equipment. The usage method is to dilute it to 5% of the coolant capacity. In addition, we also offer preservatives such as "Anti-Septic," which can be used together to prevent spoilage during the summer when bacteria are likely to proliferate, as well as a defoamer called "Anti-Foam." 【Product Lineup (Excerpt)】 ■ Anti-Rust 1L ■ Anti-Rust 5L ■ Anti-Rust 10L ■ Anti-Foam 1L ■ Anti-Septic 1L *For more details, please refer to the PDF document or feel free to contact us.
Forming a lubricating film that withstands extreme high loads and high temperatures on the sliding surface.
It is a high-concentration lubricant additive for high-load, high-speed sliding surfaces and differential gears.
![[BiRAL Problem Solving Case] Press Die (Punching Die)](https://image.mono.ipros.com/public/product/image/559/2000127641/IPROS1285420816348115838.JPG?w=280&h=280)
Eliminate mold burning.
Issues: At Company A, despite using oil mist lubrication with industrial oil for a high-speed punching press (300 strokes/min), it seized up in about a week. Solution: By adding 10% of the Bilal additive T&D to the industrial oil and performing the pressing operation, maintenance checks and parts replacements were extended from one week to one month. ● For more details, please download the catalog or contact us.
Electric Purifier for Biodiesel Fuel Elion Cleaner
Biodiesel fuel, as clean as possible! Electric purification device for biodiesel fuel that achieves ultra-purification using the power of high-voltage static electricity. 【Features】 ○ Purifies biodiesel fuel to ultra-clean levels using electric power (high voltage 10KV static electricity) ○ Removes ultra-fine contaminants (below 0.01μ) that cannot be removed by filters Maintains NAS grade and Class 2 standards ○ Capable of removing all debris that does not dissolve in biodiesel fuel, regardless of type (metal, non-ferrous metal, organic matter, inorganic matter) ○ Oxidized contaminants are removed, enabling the provision of ultra-clean oil ○ Reduces breakdowns in trucks and other vehicles, prevents fuel troubles, and stabilizes quality. Increases reliability ○ Achieving ultra-purification of biodiesel fuel allows for the maintenance of an even cleaner environment ○ By implementing in conjunction with Elion Dry, productivity is significantly improved, contributing to cost reduction ● For other functions and details, please download the catalog.
It is a flame-retardant and heat-resistant additive, and in recent years, it has been used as a dopant in high-nickel cathode materials (NCA, NCMA) for secondary batteries.
Super Fine - A flame-retardant and heat-resistant additive, recently used as a dopant in high-nickel cathode materials (NCA, NCMA) for secondary batteries. - Improves energy density and driving range. - Applicable as a heat dissipation material for secondary batteries (adhesives, heat dissipation fillers, heat dissipation pads, etc.).
Copper sulfate plating additive for printed wiring boards (PWB) significantly improves via filling characteristics and uniformity of pattern plating thickness.
With the miniaturization and high performance of electronic devices, semiconductor devices are also becoming finer and more functional, and there is a growing demand for further miniaturization of wiring and reduction of via diameter in semiconductor package substrates that connect semiconductor devices to main substrates. Additionally, copper sulfate plating is required to have both high via filling capability and uniform plating thickness simultaneously. Okuno Pharmaceutical Industry has solved these challenges. Here’s what’s amazing! ◆ Copper sulfate plating additive for via filling: Topluchina GAP ◆ - Excellent uniformity of plating thickness in pattern plating - Reduces variation in plating thickness due to pattern density differences - Reduces variation in wiring width - Capable of filling large diameter blind via holes - Enables uniform electrowinning with excellent electric copper plating - Compatible with various via diameters - Excellent thermal shock resistance - Performs well across a wide current density (1.0 to 2.0 A/dm²) - Achieves high filling capability in baths with high sulfuric acid concentration - Allows for analysis of all additive components Our specialized sales representatives will propose the perfect chemicals and processes for you. Please feel free to consult us about anything.
At a bath temperature of 20°C, hard anodizing is possible, achieving a hardness of HV400 or higher.
Typically, the hardness of anodized (anodic oxidation) coatings is between HV200 and 500. Among these, hard anodized coatings have a higher hardness and excellent wear resistance, making them widely used in vehicles and machine parts. However, while regular anodizing is performed in a liquid at around 20°C, hard anodizing requires a liquid at around 0°C, necessitating a cooling system. Okuno Pharmaceutical Industry has solved this problem. What's amazing about it! - By adding Top Hardener AL, cooling of the liquid becomes unnecessary. - Hard anodizing is possible at a bath temperature of 20°C. - It has low solubility, preventing the dissolution of pore walls. - Achieves hardness of HV400 or more. - Significantly reduces energy costs associated with cooling. Our specialized sales staff will propose the perfect chemicals and processes for our customers. Please feel free to consult us about anything.
Successfully achieved a balance between the uniformity of the plating film thickness and good via filling properties! It also accommodates plating for core layers that require through-hole filling.
Triggered by the outbreak of the novel coronavirus infection, digital transformation (DX) has progressed, leading to rapid growth in markets such as internet shopping, electronic payments, and video streaming services. Additionally, electronic devices, including smartphones, continue to evolve significantly, and as the performance and miniaturization of these devices improve, there is a strong demand for higher density and thinner printed circuit boards. Semiconductor package substrates are formed using a semi-additive method, with interlayer connections made through via filling plating. As the miniaturization of circuits advances, it has become increasingly difficult to achieve both uniformity in plating thickness and good via filling properties. To achieve further uniformity in pattern plating thickness and excellent via filling properties, our company has developed a new additive for electroplating copper (copper sulfate), called Topluchina GAP.
Newly developed for through-hole plating of printed circuit boards, ideal for high multilayer boards equipped with IC substrates and semiconductor package boards.
With the miniaturization, high functionality, and high density of electronic devices, there is an increasing demand for high-performance through-hole plating for module substrates and high-layer printed wiring boards. Our company has developed a sulfuric acid copper plating additive, Topluchina MSD, specifically for through-holes that can handle high currents, primarily for module substrates and high-layer printed wiring boards. This product achieves high throwing power at high current densities and contributes to improved productivity by reducing maintenance through stable operation.
Additives for electroplating copper that are optimal for forming fine wiring on semiconductor package substrates.
We have developed two new products, "Topluchina NSV ADV" and "Topluchina NSV LV," as plating additives for via filling with high current density fine patterns. Topluchina NSV ADV maintains excellent via filling performance while achieving high film thickness uniformity in fine wiring. Topluchina NSV LV is a copper sulfate plating additive compatible with fine patterns and large-diameter vias, enabling through-hole filling by plating copper inside the through holes.
Granular copper plating film for lead frames that contributes to the improvement of adhesion strength with sealing resin.
Power semiconductors that can operate in high-load environments are used in various fields such as industrial equipment, solar power generation, electric vehicles, communication devices, and energy conversion equipment. In recent years, as high voltage and high current capabilities have advanced, there is a growing need for packaging technologies that offer higher connection reliability. If the lead frame, which connects the semiconductor device and circuit, experiences delamination at the interface of the substrate resin under thermal load, it can lead to short circuits or disconnections. Our company has newly developed an additive that forms a granular copper plating to achieve high adhesion between the frame, coating, and mold resin.
