Fine pattern large diameter copper sulfate plating additive for via filling.
Successfully achieved a balance between the uniformity of the plating film thickness and good via filling properties! It also accommodates plating for core layers that require through-hole filling.
Triggered by the outbreak of the novel coronavirus infection, digital transformation (DX) has progressed, leading to rapid growth in markets such as internet shopping, electronic payments, and video streaming services. Additionally, electronic devices, including smartphones, continue to evolve significantly, and as the performance and miniaturization of these devices improve, there is a strong demand for higher density and thinner printed circuit boards. Semiconductor package substrates are formed using a semi-additive method, with interlayer connections made through via filling plating. As the miniaturization of circuits advances, it has become increasingly difficult to achieve both uniformity in plating thickness and good via filling properties. To achieve further uniformity in pattern plating thickness and excellent via filling properties, our company has developed a new additive for electroplating copper (copper sulfate), called Topluchina GAP.
- 企業：奥野製薬工業 大阪・放出、東京、名古屋など
- 価格：Other
