メルテックス Company Overview

We would like to express our congratulations on your continued prosperity. We also sincerely thank you for your exceptional support. We are pleased to announce that our company will be exhibiting at the 3rd Kyushu Semiconductor Industry Exhibition, which will be held at Marine Messe Fukuoka. At this exhibition, our specialized staff will be present to directly answer any questions or consultations regarding our products and technologies. We understand that you are busy, but we sincerely hope you will visit us. 【Exhibition Details】 Date: September 30 (Wed) - October 1 (Thu), 2026, 10:00 AM - 5:00 PM Venue: Marine Messe Fukuoka, Hall A, A4-51 【Exhibited Products List】 □ Direct tin alloy plating on copper bumps is possible. Improve production efficiency with simultaneous plating of different diameters! □ The number one electroless UBM plating process with proven results in the semiconductor industry. □ Optimal copper seed layer etching process design guided by three chemistries. □ High-selectivity titanium seed layer etchant - precisely removes only Ti without affecting other metals. □ Bump damage reduction and environmentally friendly dry film stripping agent. □ Two-fluid developing machine.

With the spread of AI, semiconductors are being demanded to have higher speeds and larger capacities than ever before. On the other hand, the miniaturization that has supported performance improvements is beginning to show its limits. In this context, attention is being drawn to implementation technologies that combine multiple chips to enhance performance. With the spread of HBM and chiplets, the focus of competition in the semiconductor industry is shifting from "the technology to make chips" to "the technology to connect chips." This seminar will explain the background of why implementation technology is becoming important in the AI era, as well as introduce recent trends in middle-process and connection structure technologies. Additionally, it will clearly explain the role of plating and surface treatment technologies that support these advancements. This seminar aims to provide information that will lead the semiconductor business in the AI era for those who want to grasp industry trends and implementation technology trends. Date: September 17, 2026 (Thursday) Time: 11:00 AM - 11:50 AM (Japan Time) Cost: Free Instructor: Takahiro Shimoda, Sales Department, Japan Sales Group, Western Japan Sales Division Format: Webinar (Zoom)

This is a beginner-friendly web seminar that addresses concerns such as 'I want to learn the manufacturing process of circuit boards thoroughly from the basics' and 'I actually don't know what role plating plays.' The seminar will start with the fundamentals, such as the definition of printed circuit boards and materials, and will explain the entire manufacturing process step by step. In the main plating process, we will visually introduce the flow from pre-treatment to electrification and thickness formation. We will convey the interesting aspects and importance of the technology that ensures uniform plating, which tends to be uneven due to physical shapes, using chemicals (additives). This curriculum is designed to be accessible even for those without specialized knowledge. Please make use of it not only as a training step for new personnel but also for reviewing and relearning basic knowledge. Date: July 23, 2026 (Thursday) Time: 11:00 AM - 11:50 AM (Japan Time) Cost: Free Instructor: Masao Kawada, Sales Department, Japan Sales Group, Eastern Japan Sales Section Biography: 38 years in sales. Since joining the company, he has consistently built his career in the sales department, handling both domestic and international clients. He possesses a wealth of knowledge backed by practical experience. Format: Web seminar (Zoom)