メルテックス Company Profile

"Even though the plating bath is regularly analyzed and should not have any issues, why are there troubles...?" Have you ever had such an experience? The causes of plating troubles are not singular; they often lurk in "overlooked change points" outside of the plating bath. In this seminar, we will introduce key points for "multifaceted perspectives and observations" to identify signs of trouble and change points from the entire process, including materials, pretreatment, and equipment. Please take this opportunity to gather hints for on-site improvements that only a chemical manufacturer can provide. Date: July 24, 2025 (Thursday) Time: 11:00 AM (approximately 50 minutes) *Japan time Cost: Free Format: Webinar (using Zoom) Instructor: Takuro Hatsukawa, Technical Research Institute Biography: 1988: Joined the Research Department at Meltex 1993: Assigned to Waseda University Science and Engineering Research Institute 1996: Returned to the Research Department 2004: Transferred to the Sales Department 2012: Transferred to the Technical Development Department, current position

"Even though the plating bath is regularly analyzed and should not have any issues, why are there troubles...?" Have you ever had such an experience? The causes of plating troubles are not singular; they often lie in "overlooked points of change" outside of the plating bath. In this seminar, we will introduce key points for "multifaceted perspectives and observations" to identify signs of trouble and points of change throughout the entire process, including materials, pretreatment, and equipment. Please take this opportunity to bring home hints for on-site improvements that only a chemical manufacturer can provide.

Dear Sir/Madam, I hope this message finds you in good health and spirits. I would also like to express my sincere gratitude for your continued support. We are pleased to announce that we will be holding a web seminar on November 21st. Below are the details regarding the event and how to participate. 【Event Overview】 We will discuss the challenges of printed circuit boards and package substrates that support the rapid evolution of information and communication technologies such as AI, as well as the essential dry film resist for achieving chiplet implementation. Finally, we will explain the dry film resist stripping agents for solving these challenges. Date: Thursday, November 21, 2024 Time: 11:00 AM - 11:40 AM (approximately 40 minutes) *Japan Time Cost: Free Format: Web Seminar (using Zoom) Note: Participation from competing companies is not permitted. Thank you for your understanding. Sincerely,