Minimal damage to the electrodes! Barrier layer formation process on semiconductor wafer electrodes!
The "Melplate UBM Process" is a process for forming UBM (Under Barrier Metal) on semiconductor aluminum electrodes through electroless nickel-gold plating. It enables stable plating treatment for devices with large-area electrodes. The process features minimal damage to the electrodes and excellent barrier properties and smoothness of the coating. 【Features】 ■ Selective electroless plating for UBM formation on microelectrodes ■ Applicable to a wide variety of electrode materials ■ Electrode formation using reduction-type thick gold plating is also possible *For more details, please refer to the PDF materials or feel free to contact us.
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[In Development] ■ Electrode formation process using non-cyanide electroless silver plating *For more details, please refer to the PDF document or feel free to contact us.*
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For more details, please refer to the PDF document or feel free to contact us.
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Surface treatment, that is to say, plating, has contributed to the development of our lives and various industries. What we at Meltex create are primarily the chemical products used in this plating process. Since our company was founded in 1960, we have consistently developed and provided high-performance, high-quality plating chemicals, earning a strong reputation. Moving forward, we will continue to leverage our accumulated experience and know-how, along with the latest research and development systems, to challenge ourselves in exploring new technologies and product areas, particularly in the electronics field. By providing the best chemicals, we aim to unlock the infinite potential of plating technology, which is essential to people's lives. That is our mission at Meltex.