Exploring the substrate technology that supports the evolution of AI and the electronics industry! An explanation of the critical points in the peeling of dry film resist, which is essential for the realization of technology.

Dear Sir/Madam,
I hope this message finds you in good health and spirits. I would also like to express my sincere gratitude for your continued support.
We are pleased to announce that we will be holding a web seminar on November 21st. Below are the details regarding the event and how to participate.
【Event Overview】
We will discuss the challenges of printed circuit boards and package substrates that support the rapid evolution of information and communication technologies such as AI, as well as the essential dry film resist for achieving chiplet implementation. Finally, we will explain the dry film resist stripping agents for solving these challenges.
Date: Thursday, November 21, 2024
Time: 11:00 AM - 11:40 AM (approximately 40 minutes)
*Japan Time
Cost: Free
Format: Web Seminar (using Zoom)
Note: Participation from competing companies is not permitted. Thank you for your understanding.
Sincerely,

Date and time | Thursday, Nov 21, 2024 11:00 AM ~ 11:40 AM |
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Entry fee | Free |
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