[Seminar] How to Use Heat Dissipation Devices and Basics of Thermal Design
[Instructor]
Hirokazu Shibata, President and CEO of ZAZU Design Co., Ltd.
[Key Lecture Content]
As the importance of heat dissipation design increases in daily operations, it is necessary to study a range of books on thermal engineering to learn the overall picture of heat dissipation design. However, books on thermal engineering typically start with the basics of heat transfer and cover topics such as temperature boundary layers and dimensionless numbers related to heat transfer, making it quite difficult for beginners to grasp the overall picture in a short period.
This seminar is aimed at engineers who will begin thermal design in the future, focusing on various heat dissipation devices as specific subjects. The goal is to understand the basics of thermal design while learning about the characteristics and usage of these heat dissipation devices. After attending this seminar, participants are expected to acquire knowledge equivalent to that gained from studying a range of thermal engineering books.
[Lecture Topics]
1. Current Status and Challenges of Thermal Design
2. How "Thermal Resistance" Determines Heat Dissipation Pathways
3. Fundamental Laws Governing Heat Transfer
4. Air Cooling through Heat Transfer
5. Heat Diffusion through Thermal Conduction
6. Heat Transfer via Two-Phase Flow of Gas and Liquid
7. Q&A Session

| Date and time | Wednesday, May 20, 2026 01:00 PM ~ 05:00 PM |
|---|---|
| Entry fee | Charge |
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Details & Registration
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