Copper sulfate plating additive with low film thickness and high filling ability!
"Lucent Copper SVF" is a copper sulfate plating additive for printed circuit boards. It excels in filling performance and throwing power in high current density areas compared to conventional additives, providing a reliable plating film on boards with mixed vias and through holes. [Features] - High filling capability with low film thickness - Compatible with boards with mixed through holes - Suitable for high current density *For more details, please refer to the PDF document or feel free to contact us.
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Surface treatment, that is to say, plating, has contributed to the development of our lives and various industries. What we at Meltex create are primarily the chemical products used in this plating process. Since our company was founded in 1960, we have consistently developed and provided high-performance, high-quality plating chemicals, earning a strong reputation. Moving forward, we will continue to leverage our accumulated experience and know-how, along with the latest research and development systems, to challenge ourselves in exploring new technologies and product areas, particularly in the electronics field. By providing the best chemicals, we aim to unlock the infinite potential of plating technology, which is essential to people's lives. That is our mission at Meltex.