Introducing dry film stripping agents and seed layer (copper/titanium) etching solutions!
The "LtF Process" is a product for the Fan-Out packaging process. We offer amine-based dry film resist stripping solutions, copper sputter seed layer etching solutions, and titanium sputter seed layer etching solutions. 【Features】 ■ Dry film stripping agent ⇒ Reduces copper dissolution ■ Copper sputter seed layer etching solution ⇒ Maintains stable performance due to continuous supply method ■ Titanium sputter seed layer etching solution ⇒ Low corrosiveness to other metal materials and excellent selective etching properties *For more details, please refer to the PDF document or feel free to contact us.
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Surface treatment, that is to say, plating, has contributed to the development of our lives and various industries. What we at Meltex create are primarily the chemical products used in this plating process. Since our company was founded in 1960, we have consistently developed and provided high-performance, high-quality plating chemicals, earning a strong reputation. Moving forward, we will continue to leverage our accumulated experience and know-how, along with the latest research and development systems, to challenge ourselves in exploring new technologies and product areas, particularly in the electronics field. By providing the best chemicals, we aim to unlock the infinite potential of plating technology, which is essential to people's lives. That is our mission at Meltex.