Notice of Participation in the 3rd Kyushu Semiconductor Industry Exhibition
We would like to express our congratulations on your continued prosperity. We also sincerely thank you for your exceptional support.
We are pleased to announce that our company will be exhibiting at the 3rd Kyushu Semiconductor Industry Exhibition, which will be held at Marine Messe Fukuoka.
At this exhibition, our specialized staff will be present to directly answer any questions or consultations regarding our products and technologies. We understand that you are busy, but we sincerely hope you will visit us.
【Exhibition Details】
Date: September 30 (Wed) - October 1 (Thu), 2026, 10:00 AM - 5:00 PM
Venue: Marine Messe Fukuoka, Hall A, A4-51
【Exhibited Products List】
□ Direct tin alloy plating on copper bumps is possible. Improve production efficiency with simultaneous plating of different diameters!
□ The number one electroless UBM plating process with proven results in the semiconductor industry.
□ Optimal copper seed layer etching process design guided by three chemistries.
□ High-selectivity titanium seed layer etchant - precisely removes only Ti without affecting other metals.
□ Bump damage reduction and environmentally friendly dry film stripping agent.
□ Two-fluid developing machine.

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