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Surface and thin film analysis of semiconductors

Detailed investigation of surface chemical composition, bonding states, and impurity distribution!

We would like to introduce our "Surface and Thin Film Analysis of Semiconductors." We propose effective analyses for material evaluation and failure mode identification in the process development, process management, and failure analysis of semiconductor devices. We provide detailed information that is useful for research and development, manufacturing processes, and failure analysis by examining the chemical composition, bonding states, and impurity distribution of surfaces. Please feel free to contact us when you need our services. 【Top Surface】 ■Composition: XPS ■Bonding State: XPS ■Contamination: TOF-SIMS, ICP-MS ■Roughness: AFM, SEM *For more details, please download the PDF or feel free to contact us.

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Analysis of Coating Films on Metal Surfaces

The bonding state with metals and the dispersion state of resin material components can be clearly observed!

We would like to introduce our "Coating Film Analysis of Metal Surfaces." When evaluating coating films (resins or ceramics) formed on metal surfaces for purposes such as corrosion prevention, cross-sectional processing using ion milling allows for clear observation of the bonding state with the metal and the dispersion state of the resin material components. Ion milling is used for preparing samples for cross-sectional observation, such as in SEM. Ar ions are irradiated onto the relevant part of the sample, and processing is performed using the sputtering effect. **Advantages of Ion Milling Processing:** - Allows for confirmation of the material in its original state without detaching inclusions. - If voids are observed, it can be identified that they are not due to detachment. - Element distribution confirmation (EDS analysis) enables clear observation of particles within the white resin, the interface with the metal, and the layering of the plating layer on the metal surface. *For more details, please download the PDF or feel free to contact us.*

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