Detailed investigation of surface chemical composition, bonding states, and impurity distribution!
We would like to introduce our "Surface and Thin Film Analysis of Semiconductors." We propose effective analyses for material evaluation and failure mode identification in the process development, process management, and failure analysis of semiconductor devices. We provide detailed information that is useful for research and development, manufacturing processes, and failure analysis by examining the chemical composition, bonding states, and impurity distribution of surfaces. Please feel free to contact us when you need our services. 【Top Surface】 ■Composition: XPS ■Bonding State: XPS ■Contamination: TOF-SIMS, ICP-MS ■Roughness: AFM, SEM *For more details, please download the PDF or feel free to contact us.
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【Interface】 ■Interface Layer: XPS・XRD・3DAP(APT)・TEM-EDS・TEM-EELS ■Diffusion Layer: SIMS・3DAP(APT)・SCM ■Roughness: XRR・SEM・TEM・3DAP(APT) *For more details, please download the PDF or feel free to contact us.
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Our company offers contract analysis services. Since our establishment in August 2002, we have utilized reliable analysis and measurement technologies along with state-of-the-art equipment to provide optimal nano-level microfabrication, analysis, evaluation of reliability, environmental safety chemical analysis, and service solutions for a wide range of markets centered around semiconductors, liquid crystals, metals, and new materials. Please feel free to contact us if you have any requests.
![[Analysis Case] Depth Direction Analysis of Components in SiON Ultra-Thin Films](https://image.mono.ipros.com/public/product/image/e89/2001523596/IPROS13835893106959613763.jpg?w=280&h=280)
![[Analysis Case] Evaluation of Interstitial Carbon in Si Substrate Using Low-Temperature PL and SIMS Analysis](https://image.mono.ipros.com/public/product/image/d8b/2000328299/IPROS6080220165169586207.jpg?w=280&h=280)
