Last Updated： Aggregation Period:Sep 24, 2025～Oct 21, 2025
This ranking is based on the number of page views on our site.
Last Updated： Aggregation Period:Sep 24, 2025～Oct 21, 2025
This ranking is based on the number of page views on our site.
Last Updated： Aggregation Period:Sep 24, 2025～Oct 21, 2025
This ranking is based on the number of page views on our site.
166～180 item / All 199 items
We provide information on the main methods of coating and potting that are effective for insulation and moisture-proofing of substrates and electronic devices.
For details, please check the materials from "PDF Download."
There are various processes involved in the assembly of electronic devices, and we will introduce the basic items related to them. This page explains wiring processing.
For more details, please refer to the PDF document or feel free to contact us.
By designing the circuit board from the perspective of the assembly site, customers can achieve benefits such as reduced labor costs and improved quality.
〇What is silk printing? It displays product names, product numbers, and company logos. It provides indications to assist with the assembly work. 〇Assembly Assistance By displaying reference locations, it clarifies the assembly positions. By marking polarity, it indicates the assembly orientation. By displaying symbol marks and component shapes, it visually assists in identifying the type of component. For examples of assembly assistance and useful information, please check the materials available for "PDF Download."
There are various processes involved in the assembly of electronic devices, and we will introduce the basic items related to them. This page explains the crimping process.
For more details, please refer to the PDF document or feel free to contact us.
By designing circuit boards from the perspective of the assembly site, customers can achieve benefits such as reduced labor hours and improved quality.
This page presents a proposal for the pattern design of polarized components implemented in a jet soldering bath, focusing on quality improvement and enhancement from the perspective of reducing reverse mounting and inspection labor. *For more details, please refer to the PDF document or feel free to contact us.*
By designing the circuit board from the perspective of the assembly site, customers can achieve benefits such as reduced labor costs and improved quality.
This explains the solder palette effective for double-sided mounting of substrates and the precautions for component placement when using it. *For more details, please refer to the PDF document or feel free to contact us.*
I am explaining the basic soldering methods for substrate mounting (the process of attaching electronic components to printed circuit boards).
This explains the flow and key points of the reflow soldering process. For more details, please refer to the PDF document or feel free to contact us.
We are explaining the basic soldering techniques for mounting electronic components on printed circuit boards (PCB assembly).
This explains the flow and key points of the flow soldering process. For more details, please refer to the PDF document or feel free to contact us.
I am explaining the basic soldering techniques for substrate mounting (attaching electronic components to printed circuit boards).
I am explaining the points of manual soldering. For more details, please refer to the PDF document or feel free to contact us.
This is an explanation of the basic soldering techniques for mounting electronic components on printed circuit boards (PCBs).
This is an example of mask opening correction when you want to reduce the amount of solder. For more details, please refer to the PDF document or feel free to contact us.
I am explaining the basic soldering methods for substrate mounting (installing electronic components on printed circuit boards).
This explains the fixation of components using a thermosetting adhesive to accommodate double-sided mixed mounting boards. *For more details, please refer to the PDF document or feel free to contact us.*
I am explaining the basic soldering methods for substrate mounting (installing electronic components on printed circuit boards).
This explains the flow jigs for supporting dual-sided mixed loading boards. *For more details, please refer to the PDF document or feel free to contact us.
The work card aims to improve the efficiency and quality of operations in circuit board assembly.
We have made it possible to check the implementation positions and precautions for parts using colors and images. *For more details, please refer to the PDF document or feel free to contact us.
When performing substrate mounting, various problems and troubles may sometimes occur.
Among them, there are issues related to working conditions, management, and handling that can arise, as well as those caused by materials such as circuit boards and components. Here, we will introduce just one example of such defects, their causes, and countermeasures. *For more details, please refer to the PDF document or feel free to contact us.*
When performing substrate mounting, various problems and troubles may sometimes occur.
Among them, there are issues related to working conditions, management, and handling, as well as those caused by the base materials such as circuit boards and components. Here, we will introduce just one example of such defects, including their causes and countermeasures. *For more details, please refer to the PDF document or feel free to contact us.*
