Over 50,000 rework achievements for BGA with a pitch of 0.35 to 1.27mm! Even for just one piece, you can trust us with circuit boards that have underfill applied!
Our company performs "BGA rework and reballing" using IPC-recommended IR rework equipment (7 units owned). We have a track record of reworking over 100,000 BGA components with pitches ranging from 0.35 to 1.27mm, as well as reballing over 50,000 BGA components with ball diameters from Φ0.2 to 0.76mm. We can also accommodate copper core balls. We can handle requests starting from just one piece, and we are capable of working on circuit boards with underfill applied, as well as replacing QFN and connector components. We can also address components that are difficult to replace. Please feel free to consult with us. 【Features】 ■ BGA and QFN Rework - Over 100,000 BGA rework achievements with pitches from 0.35 to 1.27mm - Achievements with 1,300 special QFN components - Capable of handling difficult-to-replace components - Analysis of soldering conditions using X-ray observation equipment with CT functionality ■ BGA Reballing - Over 50,000 reballing achievements for BGA components with ball diameters from Φ0.2 to 0.76mm - Capable of handling components with underfill applied - Can manage the entire process from BGA removal to reballing to rework *For more details, please refer to the PDF document or feel free to contact us.
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basic information
Our company has been committed to creating a more environmentally friendly world by focusing on the global environment and engaging in repair, reballing, and parts regeneration activities, even before the term SDGs became widely recognized. You can also trust us with BGA with over 3000 pins. We are capable of reworking Enpirion as well. Enpirion is a DC-DC converter power device (PowerSoC) that integrates inductors in a high-density manner. [BGA Reballing Procedure] 1. IC removal 2. Removal of residual solder 3. Solder paste printing 4. Solder ball mounting 5. Heating with an IR heater We can also accommodate reballing and mounting of various interposers. We also accept requests for changes in solder composition (eutectic solder balls ⇔ lead-free solder balls). *For more details, please refer to the PDF document or feel free to contact us.
Price information
Estimated labor cost for parts replacement (rework) BGA: 3,500 yen to 10,000 yen Module: 3,500 yen to 8,000 yen QFN: 2,500 yen to 6,000 yen FET: 800 yen to 2,500 yen QFP/SOP: 500 yen to 5,000 yen Estimated labor cost for BGA reballing 5 or fewer: 6,000 yen per unit 6 to 9: 5,000 yen per unit
Price range
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Delivery Time
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Applications/Examples of results
- I want to exchange it due to defective analysis. - I would like to analyze it by exchanging it with a good product. - I want to implement it later because the delivery of the device is not on time. - A malfunction error occurs due to the solder balls not being joined. - In such cases, please consider our BGA rework/reball and QFN rework services. - We provide high quality through spot heating with no unevenness using IR radiation heating. - You can also rely on us for LGA and BGA with over 3000 pins. *For more details, please refer to the PDF document or feel free to contact us.
Detailed information
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Rework Device Using an infrared rework device. ■ Compatible with large multilayer substrates of size 4,600WL ■ Upper heater: 4-zone selection, medium wavelength IR heater (no nozzle required) ■ Lower heater: 5-zone selection, medium wavelength IR heater ■ Automatic profile tracking control heating with non-contact temperature sensor ■ Standard included AccuTC thermocouple that does not require tape fixation ■ Automatic upper and lower substrate cooling fans ■ Optical 25x X digital 12x reflow observation camera
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BGA rework The circuit board with underfill will be reworked after the underfill is removed.
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BGA reballing We have solder balls available in sizes ranging from Φ0.2mm to 0.8mm. Please feel free to contact us.
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Company information
The impetus for our work on BGA rework was "environmental protection." Starting around 2002, we began to see a significant number of circuit board repairs that were impossible to fix while conducting mobile phone repair operations. When BGA (IC) was incorporated into mobile phones, adhesive (underfill) was used as a measure to prevent solder peeling. This adhesive reinforces the bonding between the circuit board and the IC, but due to aging and usage conditions such as drops, it can surprisingly crack easily. Later, these cracks can erode the solder of the IC, leading to functional failures. Since mobile phone circuit boards have many functions, the disposal cost for a single unit can be enormous. If IC replacement becomes possible, repairs can be conducted with just the cost of the IC and its replacement, allowing other components to be reused, which we believe connects this recycling technology to "environmental protection." Our company has been committed to creating a more environmentally friendly world through circuit board modification, repair, BGA reballing, and component regeneration long before the term SDGs became widely recognized, emphasizing the importance of the global environment.