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  1. Home
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  3. Electronic Components and Modules
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  6. BGA Rework

BGA Rework

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last updated:May 29, 2015

ピーダブルビー 草津事業所
ピーダブルビー 草津事業所
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We can accommodate large substrates and thick substrates.

BGA rework refers to the process of partially heating BGA on completed circuit boards to remove and install them. Our company has newly introduced a BGA rework device that can handle large circuit boards (Max 500×600) and thick boards (Max 7mm) due to its high thermal capacity, in addition to being lead-free. For reballing work when "wanting to reuse components," we have solder balls available in both eutectic and lead-free options, compatible with pitches ranging from 1.27mm to 0.4mm. We can also accommodate BGA jumper work.

    Printed Circuit BoardOther semiconductorsPrototype Services
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BGA Rework

  • Related Link - http://www.pwb.co.jp

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basic information

Rework Device Features 1: Hot Air Lower Heater Compared to conventional rework devices (IR: infrared), it has a larger heat output, making it capable of handling large and thick substrates. By warming the entire substrate, it suppresses warping even in thin and large substrates, allowing for safe removal and installation. 2: Nitrogen Compatibility Nitrogen compatibility is essential for lead-free soldering. The nitrogen convection from the upper heater suppresses oxidation of the solder, enabling soldering under optimal conditions. 3: Suppression of Component Surface Temperature For components with low heat resistance, a small amount of unheated air is blown from the center of the hot air of the upper heater, which helps to suppress the temperature on the component's surface, allowing work to be done while reducing stress on the components. *Reference: For soldering at 237 degrees, work can be done at 224 degrees on the component's surface.

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Applications/Examples of results

Jumper extraction from a 0.35mm pitch CSP. Board thickness 6mm, substrate size 480mm x 550mm for BGA replacement.

Company information

ピーダブルビー

ピーダブルビー 草津事業所

Industrial Electrical Equipment

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P-Dub-B Co., Ltd. has been expanding its business areas related to printed circuit boards since its establishment in 1978, and now has built a consistent production system (ADAMS) that handles everything in-house, from software and hardware design to manufacturing and assembly. We flexibly respond to our customers' increasingly diverse and sophisticated needs.

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The related categories of Printed Circuit Board

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  • Semiconductors and ICs
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