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CVDの製品一覧

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Atmospheric Pressure CVD (APCVD) System for Small-scale Production and Development (D501)

Atmospheric Pressure CVD (APCVD) System for Small-scale Production and Development (D501)

For prototyping, development, and small lot production For deposition of NSG(SiO2)/BSG/PSG/BPSG Batch processing (simultaneous processing of multiple substrates) APCVD system

The D501 is a batch processing (multiple-unit simultaneous processing) atmospheric pressure CVD system (APCVD system) for small-volume production/testing and silicon oxide deposition (SiO2 deposition) on irregularly shaped substrates. 【Features】 　・Simultaneous processing of substrates of different shapes and sizes 　・High deposition speed 　・Simple maintenance 　・Small footprint 　・Low CoO (low running cost) 【Applications】 　・Interlayer insulating (NSG/PSG/BPSG) 　・Hard mask for diffusion/ion implantation, Sacrificial deposition (NSG) 　・Passivation deposition (protective deposition, insulating deposition) (NSG) 　・Source films for solid phase diffusion for solar cells (BSG, PSG)/Cap deposition (NSG) *For more details, please contact us or download the catalog for further information.

  • CVD Equipment

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High-performance Single-wafer Processing Atmospheric Pressure CVD (APCVD) System (A200V)

High-performance Single-wafer Processing Atmospheric Pressure CVD (APCVD) System (A200V)

Small quantities and wide varieties. NSG(SiO2)/PSG/BPSG deposition. Single-wafer processing atmospheric pressure CVD (APCVD) system (Compatible with 8-inch SiC wafers)

A200V is a single-wafer processing atmospheric pressure CVD system (APCVD system) for silicon oxide (SiO2) deposition, such as interlayer insulating deposition, passivation deposition (protective deposition), and sacrificial deposition. 【Features】 　・Ideal for insulating depositions and diffusion/plasma mask depositions. 　・Low particle film deposition by single-wafer face-down deposition. 　・High safety and deposition stability by using a sealed chamber. 　・Wafer warp correction function (patented) for SiC wafers. 　・Low-load, long-cycle maintenance. 　・Compact cabinet and adjacent installation to the mirror type for space saving. 　・Low CoO (low running cost) 【Applications】 　・Interlayer dielectric deposition for power semiconductors (NSG/PSG/BPSG) 　・Hard mask for diffusion/ion implantation, Sacrificial depositions (NSG) 　・Passivation depositions (protective depositions, insulating depositions) (NSG) 　・Optical Waveguide (NSG/BPSG) *For more details, please contact us or download the catalog for further information.

  • CVD Equipment

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High-productivity Continuous Atmospheric Pressure CVD (APCVD) System (AMAX800V)

High-productivity Continuous Atmospheric Pressure CVD (APCVD) System (AMAX800V)

Mass Production / NSG(SiO2)/PSG/BPSG deposition　 High-productivity/Continuous atmospheric pressure CVD (APCVD) system (for up to 8-inch wafers)

The AMAX series is a continuous atmospheric pressure CVD system (APCVD system) for silicon oxide (SiO2) deposition, such as interlayer insulator deposition, passivation deposition (protective deposition), and back seal (for epitaxial wafers). 【Features】 　・High productivity of up to 100 wafers/hr. (wafer size: up to 8 inches) 　・No vacuum or plasma is required (thermal CVD) 　・SiC trays are used to prevent heavy metal contamination. 　・Simple maintenance. 　・Low CoO (low running cost) 【Applications】 　・Back seal for epitaxial wafers (NSG) 　・Interlayer insulator deposition for power semiconductors (NSG/PSG/BPSG) 　・Hard mask for diffusion/Ion implantation, Sacrificial deposition (NSG) 　・Passivation deposition (protective deposition, insulating deposition) (NSG) *For more details, please contact us or download the catalog for further information.

  • CVD Equipment

ブックマークに追加いたしました

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High-productivity Continuous Atmospheric Pressure CVD (APCVD) System (AMAX1200)

High-productivity Continuous Atmospheric Pressure CVD (APCVD) System (AMAX1200)

Mass production / NSG(SiO2)/PSG/BPSG deposition High-productivity / Continuous atmospheric pressure CVD (APCVD) system (for 12-inch wafers)

The AMAX series is a continuous atmospheric pressure CVD system (APCVD system) for silicon oxide (SiO2) deposition, such as an interlayer insulator deposition, passivation deposition (protective deposition), and back seal (for epitaxial wafers). 【Features】 　・High productivity of up to 56 wafers/h (wafer size: up to 12 inches) 　・No vacuum or plasma is required (thermal CVD) 　・SiC trays are used to prevent heavy metal contamination. 　・Simple maintenance. 　・Low CoO (low running cost) 【Applications】 　・Back seal for epitaxial wafers (NSG) 　・Passivation deposition (protective deposition, insulating deposition) (NSG) *For more details, please contact us or download the catalog to view.

  • CVD Equipment

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これ以上ブックマークできません

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