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No need for heat-resistant tape application process!
"Magic Resin Carrier" is a new type of carrier that securely adheres to the substrate. It is ideal for transporting flexible substrates and thin substrates, such as FPC mounting, COF mounting, TCP mounting, and thin PWB.
A flex carrier suitable for transporting thin glass-epoxy substrates that are difficult to transport by self-delivery.
The "flex carrier(R)" is a transport board that eliminates the need for fixing tape and regulatory jigs when performing surface mounting (SMD <Surface Mount Device>) on flexible printed circuit boards. We can support the selection of adhesive types and substrates. We will conduct preliminary verification in-house and propose conditions suitable for your products (workpieces). 【Features】 ■ Enables SMD, COF, and COG on flexible substrates ■ No need for heat-resistant tape application *For more details, please download the PDF or feel free to contact us.
Essential item for FPC implementation process! Temporary fixation of the circuit board is possible without the need for tapes!
We offer the 'SMT Board,' a carrier for substrate transport that achieves high heat resistance and excellent adhesion through our unique construction method. It allows for temporary fixation of substrates on the carrier without using tapes typically employed in the assembly process. Additionally, the board materials can be widely selected from heat-resistant glass epoxy, aluminum, and stainless steel. 【Features】 ■ A wide selection of board materials including heat-resistant glass epoxy, aluminum, and stainless steel ■ Adhesive strength can be adjusted to accommodate FPC materials and component conditions ■ Can be selected with bake materials or aluminum materials, enhancing pin reference accuracy to achieve multiple placements with a 0.4mm pitch ■ Custom design and manufacturing according to the customer's production method, with the possibility of combining with metal masks for supply *For more details, please download the PDF or feel free to contact us.
After repeated reflow, it's easy to peel off! Leave the transport of small components and thin materials to us!
"MagiCarrier" is a adhesive-type micro component transport carrier. It can be cleaned with ethanol, and partial adhesion is possible on flat surfaces and recesses. The peel strength does not change after heating and cooling, and the adhesive strength remains the same. Additionally, we offer three types of adhesive strength: weak, strong, and super strong, and adjustments to the adhesive strength can be made upon request. Please feel free to consult us when placing an order. 【Features】 ■ Easy to peel off after repeated reflow ■ Partial adhesion is possible (flat surfaces and recesses) ■ Can be cleaned with ethanol ■ Three types of adhesive strength (weak, strong, super strong) ■ Adhesive strength can be adjusted upon request *For more details, please refer to the PDF document or feel free to contact us.
