A flex carrier suitable for transporting thin glass-epoxy substrates that are difficult to transport by self-delivery.
The "flex carrier(R)" is a transport board that eliminates the need for fixing tape and regulatory jigs when performing surface mounting (SMD <Surface Mount Device>) on flexible printed circuit boards. We can support the selection of adhesive types and substrates. We will conduct preliminary verification in-house and propose conditions suitable for your products (workpieces). 【Features】 ■ Enables SMD, COF, and COG on flexible substrates ■ No need for heat-resistant tape application *For more details, please download the PDF or feel free to contact us.
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basic information
【Basic Performance】 ■Heat Resistance: Silicone Rubber (200℃) / Viton (250℃) ■Cleaning: Compatible with surface cleaning using ethanol, IPA, and water ■Base Materials: Compatible with various materials such as heat-resistant glass epoxy, aluminum, stainless steel, magnesium, etc. ■Adhesive Layer ・Silicone Rubber (treated to reduce low molecular weight siloxanes) ・Fluoro Rubber [Viton] (siloxane-free) ・Various types, conductive and non-conductive *For more details, please download the PDF or feel free to contact us.
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Applications/Examples of results
【Applications】 ■FPC (Film Substrate) ■Thin Glass/Wafers ■Chip Components ■Carrier for Film Products, etc. *For more details, please download the PDF or feel free to contact us.
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Company information
Our company manufactures precision machine parts and performs cutting processing of materials such as resin, rubber, and metal, as well as the development and sales of rubber products (our own brand). Regardless of the material or shape, we have the mindset that "there is nothing we cannot do," and we are constantly challenging ourselves to establish technologies and know-how that cannot be matched by other companies, known as black box technologies. Please feel free to contact us if you have any requests.
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