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Ceramics×共立エレックス - List of Manufacturers, Suppliers, Companies and Products

Ceramics Product List

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Package technology for high-brightness LEDs - ceramics

Package technology for high-brightness LEDs - ceramics

We want to respond to our customers' needs for diverse LED packages by leveraging our integrated manufacturing process from ceramic substrate production to printed circuit formation.

Ceramic packaging technology that responds to advances in LED technology LEDs, as light-emitting devices, are increasingly being adopted not only for lighting applications but also in a wide range of fields such as home appliances, information devices, and medical equipment, with rapid advancements in high brightness and short wavelength. Consequently, various demands are being placed on LED package materials. Our company is advancing development to meet the "diverse customer needs for various LED packages" by leveraging our integrated manufacturing process from ceramic substrate production to printed circuit formation. We are preparing a "diverse lineup" for various applications of LED devices and "heat dissipation measures" aimed at the rapidly advancing high-power LEDs. We are progressing with technology development that can respond to various application possibilities, and we look forward to your inquiries.

  • Printed Circuit Board
  • Fine Ceramics

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In-house integrated manufacturing process Kyoritsu Elex high-performance ceramics

In-house integrated manufacturing process Kyoritsu Elex high-performance ceramics

For high-performance ceramic substrates, please consult our specialized manufacturer.

Our company has a consistent in-house manufacturing process that includes the formulation of ceramic raw materials, green sheet coating, high-temperature sintering, and the subsequent circuit formation, all managed under our own quality and delivery standards. We have a wealth of experience in providing various ceramic components, primarily for electronic device applications such as LED packages, and we are advancing new technology development to meet the diverse needs of our customers. Here are some of our "strength points" from a technical perspective: 1. Forming technology for ultra-thin ceramic sheets 2. Mold pressing technology with high dimensional accuracy 3. High-temperature stable sintering technology with precise temperature control 4. Fine circuit printing technology and uniform film formation technology within through-holes 5. Leveraging our extensive accumulated technology to meet customer requirements.

  • technology_substrate-ultra-thin-KZ3_1.png
  • Printed Circuit Board
  • Fine Ceramics

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A must-see for automobile manufacturers! Alumina ceramics, high-performance ceramics.

A must-see for automobile manufacturers! Alumina ceramics, high-performance ceramics.

A specialized manufacturer of high-performance ceramic substrates produces alumina ceramic substrates that are widely recognized, using its unique production system.

■Alumina Ceramic Substrates Born from Our Unique Production System■ In recent years, the electronics industry, which is accelerating the pace of evolution, has developed chip components that are now small enough to fit on a fingertip, advancing the information society. Among these, chip resistors are essential basic electronic components that make up electronic circuits. Our alumina ceramics use high-purity alumina raw materials with excellent electrical and thermal properties, and through advanced processing technology, we achieve outstanding dimensional accuracy and divisibility. For other alumina ceramic products as well, we use high-purity alumina raw materials tailored to their applications, maintaining stable quality and excellent characteristics while producing under a strict quality control system.

  • Fine Ceramics
  • Other electronic parts

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Circuit formation technology by printing method - Ceramics

Circuit formation technology by printing method - Ceramics

Printing materials are not limited to wiring materials (metal pastes); printing formation is also possible with insulating glass materials and ceramic materials.

Technology for Forming Printed Circuits on Ceramic Substrates Our company utilizes technology for forming printed circuits for electronic component applications on ceramic substrates manufactured in-house, all handled through an integrated in-house process. By using screen printing methods, we can offer custom solutions with shorter lead times compared to etching methods. Additionally, since the printed materials undergo high-temperature baking (850°C), they provide stable performance and high reliability. The printed materials are not limited to wiring materials (metal pastes) but also include insulating glass materials and ceramic materials, which can also be printed. Furthermore, we have achieved not only circuit formation but also "through-hole via formation" and "multilayer circuit structures." We are advancing technology development to meet various application possibilities, and we look forward to your inquiries.

  • Printed Circuit Board
  • Fine Ceramics

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Laminated processing, alumina substrate, high-performance ceramics.

Laminated processing, alumina substrate, high-performance ceramics.

For high-performance ceramic substrates, please consult our specialized manufacturer.

Laminated processing allows for the thickening of ceramic substrates. The photo above shows a 2mm thick ceramic substrate created by stacking two 1mm thick green sheets that were formed and coated, followed by firing.

  • Printed Circuit Board
  • Fine Ceramics

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Fired setter ceramic substrate with protrusions on the surface and porous ceramics.

Fired setter ceramic substrate with protrusions on the surface and porous ceramics.

Non-stick, does not hinder contraction, no need for processing with release powder, efficiency is significantly improved.

"Setter Ceramic Base Plate with Micro-Convex Shape Processing" We often hear requests regarding the production efficiency and manufacturing quality of ceramic base plates used for setters in the firing process. For example, requests include "I want to improve the debinding performance," "I want to suppress sticking against the shrinkage of the fired items (work)," and "The work sticks after firing!" among various others. By using this "Setter Ceramic Base Plate with Micro-Convex Shape Processing," we contribute to improving the production efficiency and manufacturing quality of the firing process. Additionally, we have received feedback from customers who previously used "filling powder" on the setter, stating not only improvements in "workability" but also that "the clogging in the vacuum furnace piping has improved." If you are a user facing such issues in the firing process, please feel free to reach out to us.

  • Ceramics

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