Contracted Service "Circuit Board Assembly"
Leveraging 30 years of experience in OEM manufacturing of security equipment, we support everything from prototyping to mass production!
Printed Circuit Board Assembly 【SMT Assembly】 We can assemble components ranging from tiny parts to large irregular parts. We can handle CSP, BGA (0.25mm pitch), QFP (0.2mm pitch), 0603 chips, and PLCC irregular parts. Nitrogen-compatible reflow is used. *0402 chips are currently a challenge! 【Lead Component Assembly】 We can assemble large components such as transformers, coils, electrolytic capacitors, cement resistors, and current sensors. 【Moisture-Proof Insulation Coating】 Coating agents (moisture-proof insulation materials) can be applied to both the front and back surfaces of the board. 【Board Aging】 Aging of printed circuit boards and assembled boards is possible. We can accommodate constant temperature chambers and temperature cycle testing machines.
- Company:ビオラ
- Price:Other