Last Updated： Aggregation Period:Nov 05, 2025～Dec 02, 2025
This ranking is based on the number of page views on our site.
Last Updated： Aggregation Period:Nov 05, 2025～Dec 02, 2025
This ranking is based on the number of page views on our site.
Last Updated： Aggregation Period:Nov 05, 2025～Dec 02, 2025
This ranking is based on the number of page views on our site.
16～30 item / All 105 items
COM Express Basic Size Type 2 module equipped with 6th generation Intel Core/Xeon/Celeron processors.
ADLINK announces a new COM Express Type 2 computer-on-module based on the highly popular Intel Core processors (formerly codenamed Skylake and Kabylake). The Express-SL/KL supports all Type 2 related legacy I/O, allowing customers to extend the production lifespan of their existing Type 2-based systems by at least 10 years.
COM Express compact size Type 6 module equipped with the largest quad-core Intel Core and Celeron processors.
ADLINK has announced its latest COM Express Type 6 module to meet the needs of edge computing applications constrained by size, weight, and power consumption (SWaP). The ADLINK cExpress-WL module features 8th generation Intel Core and Celeron processors (formerly codenamed Whiskey Lake-U) with up to 4 cores and a maximum memory capacity of 64GB, delivering performance and responsiveness without compromise despite SWaP constraints. The cExpress-WL is suitable for applications such as data acquisition and analysis, image processing, 4K video transcoding, and edge streaming.
COM Express compact size Type 6 module equipped with AMD Ryzen Embedded V2000 APU.
The cExpress-AR, equipped with the new AMD Ryzen V2000 APU and high-performance integrated Radeon graphics, is the first Type 6 module in the market to support up to 16 threads of octa-core (8 cores) embedded SoC, achieving significant turbo boost up to 4.2 GHz. Compared to the previous embedded quad-core V1000 processor, the combination of additional cores and AMD's Zen 2 architecture has more than doubled performance and improved efficiency per watt by twofold. ADLINK's cExpress-AR standardly supports up to 64GB of DDR4 with two SO-DIMM slots. It offers ECC error correction and configurable TDP (up to 10W) based on the selected SKU, while providing 6 to 8 cores and passive cooling, making it suitable for mission-critical applications in harsh environments.
Next-generation Intel Atom processor SoC equipped COM Express compact size Type 6 module.
The ADLINK cExpress-EL supports the next-generation Intel Atom x6000 processor (Elkhart Lake) combined with Intel UHD graphics in a low-power envelope and high-speed interfaces. The cExpress-EL module supports up to 32GB of in-band ECC dual-channel DDR4 memory and is available in a robust operating temperature range and low-power envelope, making it ideal for mission-critical fanless edge computing applications that always require safety and reliability.
Basic Size COM Express Type 6 Module
The Express-CFR is a COMExpress COM.0R3.0 basic size Type 6 module that supports hexacore (6-core) 64-bit 9th generation Intel Core and Xeon processors (codename "Coffeelake Refresh-H"). It is equipped with Mobile Intel QM370, HM370, and CM246 chipsets. The Express-CFR features up to three SODIMM sockets that support a maximum of 96GB of DDR4 memory (with two on the top by default and one on the bottom as a build option). It fully complies with the mechanical specifications of PICMG COM.0. Modules with Xeon processors and the CM246 chipset support both ECC SODIMM and non-ECC SODIMM.
Elkhart Lake equipped with COM Express Type 10 Mini module.
The ADLINK nanoX-EL is a COM Express Type 10 module that supports Intel Atom x6000 series processors (x6425E, x6413E, x6211E, x6200FE, x6425RE, x6414RE, x6412RE), Intel Pentium, and Celeron N/J series processors (formerly codenamed Elkhart Lake), and features a high-speed interface with integrated Intel UHD graphics. The nanoX-EL module supports up to 16GB of in-band ECC LPDDR4 memory and is designed for robust operating temperature ranges and low power consumption, making it ideal for mission-critical fanless edge computing applications where safety and reliability are always required.
COM Express Rev.3.1 Type 6 basic size module equipped with 13th generation Intel Core mobile processor.
The ADLINK Express-RLP COM Express Type 6 basic size module is the first COM Express based on the 13th generation Intel Core mobile processor, utilizing Intel's advanced hybrid architecture (with up to 6 performance cores and 8 efficient cores) offered with industrial options, providing excellent performance for edge IoT innovation across a variety of power ranges (TDP 15W/28W/45W). This module supports PCIe 4.0 and DDR5 memory with speeds of up to 4800 MT/s, as well as 4 displays via DDI/LVDS or USB4/TBT4, and features integrated Intel Iris Xe graphics with up to 96 execution units, enabling on-device AI performance instantly.
Intel 12th Generation Core i5-12600HE-based COM Express Type 6 Prototyping Kit
The COM Express Type 6 Alder Lake-P is a powerful IoT solution development kit based on COM Express Type 6, featuring the Intel 12th generation i5-12600HE 12-core (4 P-cores + 8 E-cores) SoC, integrated with Intel Iris Xe GPU graphics (80 execution units) and comprehensive high-speed interfaces. This kit, focused on performance and power efficiency, incorporates a COM Express module that utilizes Intel's advanced hybrid architecture, leveraging four performance cores for IoT workloads and eight efficient cores for background task management. It provides excellent performance and power per watt, offering high flexibility to enable a wide range of smart edge innovations with a TDP of 35/45W. This module and development kit, equipped with 64GB of memory and integrated Intel Iris Xe graphics with 80 execution units, will be key for the development and prototyping of various industrial IoT applications specialized in graphics and AI.
AMD Embedded Ryzen V3000 equipped COM Express Rev.3.1 Basic Type 7 module
The ADLINK COM Express Type 7 Basic size module "Express-VR7" is based on the AMD Embedded Ryzen V3000 series processor. With up to 8 cores and 16 threads, and a TDP of 15W/45W, it delivers the best performance per watt in its class, featuring 14 PCIe Gen4 lanes, enterprise-level reliability, and extremely robust temperature options (-40℃ to 85℃). This module offers dual-channel DDR5 memory with ECC at 4800MT/s, equipped with 2x 10G Ethernet and 1x 2.5GB Ethernet, making it ideal for various next-generation network applications at the edge.
![Industrial COM Express Module [HPC-RPSC]](https://image.mono.ipros.com/public/product/image/160/2001113181/IPROS14086677527159452284.jpg?w=280&h=280)
AAEON 12th/13th Generation HPC Client Size C Standard Industrial COM Express Module
Features ● DDR5 4800 MHz SO-DIMM x2 (up to 64GB) ● USB 2.0 x8, USB 3.2 x6 ● PCIe [x1] x8, PCIe [x4] x3, PEG [x16] x1 ● Intel I226-LM 2.5GbE x2 ● M.2 2280 M-Key x1 ● COM HPC Client Type, Size C (160 x 120mm)
![Industrial COM Express Module [COM-RAPC6]](https://image.mono.ipros.com/public/product/image/e18/2001206114/IPROS14697392952784888461.jpg?w=280&h=280)
AAEON Industrial COM Express Module Type 6 Compact Size
Features ● 13th Generation Intel Core i7-13800HE/i7-13800HRE/i5-13600HE/i3-1320PE/Processor U300E SoC (maximum TDP 45W) ● DDR5 SODIMM x 2 (maximum 64GB, non-ECC) ● Intel i226 GbEx 1 ● SATA 6.0Gbps x 2 ● USB3.2 Gen2 x 4, USB2.0 x 8 ● Maximum PCIe x 6 ● DC 12V input ● COM Express Type 6, compact size (95 x 95mm)
![Industrial COM Express Module [COM-ADNC6]](https://image.mono.ipros.com/public/product/image/19e/2001206126/IPROS3598720151565604899.jpg?w=280&h=280)
AAEON Industrial COM Express Module Type 6 Compact Size
Features ● Intel Atom x7425E/N50/N97/Core i3-N305 CPU (maximum TDP 15W) ● DDR5 SODIMM x 1 (maximum 16GB, non-ECC) ● Intel I226-V/I226-IT Gigabit Ethernet x 1 ● SATA 6Gb/s x 2 ● USB 2.0 x 8, USB 3.2 Gen 2 x 2 ● PCIe [x4] (PCIe [x1] x 4 or [x2] x 2) (maximum PCIe x 4) ● COM Express Type 6, compact size (95 x 95mm)
![Industrial COM Express Module [NANOCOM-RAP]](https://image.mono.ipros.com/public/product/image/443/2001252013/IPROS11414520381733628070.jpg?w=280&h=280)
AAEON Industrial COM Express Module Type 10 Compact Size
Features: ● Equipped with 13th generation Intel Core i7-1365UE / i5-1335UE / i3-1315UE / U300E ● Onboard LPDDR5 x 1 (up to 16GB) ● eDP x 1, DDI x 1 ● USB 2.0 x 8, USB 3.2 Gen 2 x 2 ● PCIe [x1] x 4 ● Intel I226-IT GbE x 1 ● COM Express Type 10 (84mm x 55mm)
![Industrial COM Express Module [AQ7-ADN]](https://image.mono.ipros.com/public/product/image/375/2001464546/IPROS13740570937515782486.jpg?w=280&h=280)
AAEON Industrial COM Express with Intel Core i3-N305/N97/N50/Atom x7425E
Features: ● Equipped with Atom x7425E/N50/N97/Core i3-N305, maximum TDP of 15W ● Onboard LPDDR5 memory of 4/8GB (maximum 8GB) ● Onboard eMMC of 32/64GB (maximum 64GB) ● Realtek RTL8111H-CG 1GbE x 1 ● SATA 6Gb/s x 1 ● USB 2.0 x 6, USB 3.2 x 2 ● PCIe [x1] x 4 ● DC +5V ● Qseven standard: 70mm x 70mm
![Industrial COM Express Module [NANOCOM-ADN]](https://image.mono.ipros.com/public/product/image/84b/2001488846/IPROS10198530026597518486.jpg?w=280&h=280)
AAEON Industrial COM Express with Intel Core i3-N305/N97/N50/Atom x7425E equipped.
Features: ● Equipped with Atom x7425E/N50/N97/Core i3-N305 ● LPDDR5 4800 MHz 8GB/16GB onboard (up to 16GB) ● eMMC 32GB/64GB onboard (up to 64GB) ● LVDS colay eDP x 1, DDI x 1 ● USB 2.0 x 8, USB 3.2 Gen 2 x 2 ● PCIe [x1] x 4 ● Intel I226-V/IT 2.5GbE x 1 ● COM Express Type 10 (Dimensions: 84mm x 55mm)
