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  6. COM Express【Express-RLP】

COM Express【Express-RLP】

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Express-RLP

last updated:Jan 11, 2023

ADLINKジャパン 東京本社
ADLINKジャパン 東京本社
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COM Express Rev.3.1 Type 6 basic size module equipped with 13th generation Intel Core mobile processor.

The ADLINK Express-RLP COM Express Type 6 basic size module is the first COM Express based on the 13th generation Intel Core mobile processor, utilizing Intel's advanced hybrid architecture (with up to 6 performance cores and 8 efficient cores) offered with industrial options, providing excellent performance for edge IoT innovation across a variety of power ranges (TDP 15W/28W/45W). This module supports PCIe 4.0 and DDR5 memory with speeds of up to 4800 MT/s, as well as 4 displays via DDI/LVDS or USB4/TBT4, and features integrated Intel Iris Xe graphics with up to 96 execution units, enabling on-device AI performance instantly.

    Embedded Board Computers
Express-RLP-F_web.jpg

COM Express【Express-RLP】

Express-RLP-F_web.jpg
Express-RLP-F_web.jpg
  • Express-RLP Product Page
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COM Express Rev. 3.1 Type 6 Basic Size Module with 13th Generation Intel Core Mobile Processor 【Features】 - COM Express Rev. 3.1 - Up to 14 cores, 20 threads, TDP 15W/28W/45W - Up to 64GB DDR5 SO-DIMM, 4800 MT/s, IBECC - AI inference (AVX-512 VNNI, Intel Iris Xe) - PCIe Gen4, four displays / two USB4 - Extreme rugged operating temperature (optional)

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The Express-RLP, equipped with support for Intel TCC (Time-Coordinated Computing) and TSN (Time Sensitive Networking), can execute hard real-time workloads with ultra-low latency in a timely manner, making it suitable for mission-critical AIoT use cases such as industrial automation, AMR (autonomous mobile robots), autonomous driving, medical imaging, and video broadcasting.

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ADLINK and Intel release COM Express and COM-HPC modules equipped with the 13th generation Core processors – offering industrial-grade stability and an extended power range of up to 24 cores.

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ADLINK's two new modules equipped with Intel's 13th generation Core processors feature an advanced hybrid architecture with performance cores and efficient cores optimized for power usage. ◎Express-RLP: A COM.0 R3.1 Type 6 module offering up to 14 cores, 20 threads, 64GB DDR5 SO-DIMM, PCIe Gen4, and ultra-high durability options with TDP of 15/28/45W. ◎COM-HPC-cRLS: A COM-HPC size C module with up to 24 cores, 128GB DDR5 SO-DIMM, PCIe Gen5, two 2.5GbE LAN ports, and high durability options. Supports Intel TCC and Time Sensitive Networking (TSN), addressing hard real-time computing workloads required in applications such as industrial automation, autonomous driving, AI robotics, and aerospace.

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ADLINKジャパン

ADLINKジャパン 東京本社

Industrial Electrical Equipment

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【ADLINK Japan's Concept】 To let more Japanese customers know about the quality of Taiwanese products and to encourage their adoption. In order to provide the highest quality and high-performance products, we are committed to thorough CQD (Cost, Quality, Delivery) practices to meet our customers' needs. Thus, we established ADLINK Japan Co., Ltd. with the aim of providing customer-first services and support. 【ADLINK Japan's Quality Policy】 - Customer First Principle - Complaint First - Zero Defect Rate We aim for these goals. 【Why Choose ADLINK】 - Stable long-term supply (over 5 years) - Regular quality improvement plans (CCC) - Diverse standard products and contract development available - Speedy analysis capabilities - Japanese language support (both sales and technical) - Local support - Environmental compliance (e.g., ROHS) 【About Our Privacy Policy】 https://www.adlinktech.com/jp/PrivacyPolicy

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