Last Updated： Aggregation Period:Apr 01, 2026～Apr 28, 2026
This ranking is based on the number of page views on our site.
Last Updated： Aggregation Period:Apr 01, 2026～Apr 28, 2026
This ranking is based on the number of page views on our site.
Last Updated： Aggregation Period:Apr 01, 2026～Apr 28, 2026
This ranking is based on the number of page views on our site.
61～90 item / All 122 items
8th Generation Intel Xeon/Core Processor COM Express
8th Generation Intel Xeon/Core Processor COM Express ● 6C CPU with 48GB of large capacity memory ● 4 * USB3.1 Gen 2 (10Gbps) / PEG x16 & 8 * PCIe Gen3 (8Gbps) ● 3 * DDI (Digital Display Interface) 4k resolution
Intel Xeon Processor D-1500 Product Family
Intel Xeon Processor D-1500 Product Family COM Express Basic Module Type 6 ● Supports iManager, embedded software API, Wise-PaaS / RMM ● 1 PCIe x16, 8 PCIe x1, 2 x 10GBASE-KR interfaces ● Dual DDR4 2400, 1.2V low power consumption memory, up to 32GB ● Up to 16 cores with a TDP of 45W ● COM Express R2.1 Basic Module Type 6 pin output compatible ● Intel® Xeon® Processor D-1500 Product Family
Intel Pentium N4200, Celeron N3350, Atom E3900 series
Intel Pentium N4200, Celeron N3350, Atom E3900 series ● iManager, WISE-PaaS / RMM, and embedded software API ● Supports a wide operating temperature range / power input of 4.75 to 20 V ● Supports H.264 / AVC, H.265 / HEVC, VP9, VP8 HW DECODE ● Supports up to 3 simultaneous displays: LVDS / eDP, VGA, HDMI / DisplayPort ● Up to 8GB, dual-channel 1866 DDR3L memory (A1: non-ECC, B1: ECC) ● Intel Atom E3900 & Pentium and Celeron N series processors ● PICMG COM Express R2.1 compact module type 6 pin output
Intel Atom E3900 & Pentium/Celeron processors
Intel Atom E3900 & Pentium/Celeron Processors ● COM R.2.1 Type 10 Mini Module ● Intel Atom E3900 & Pentium/Celeron Processors ● Up to 8GB DDR3L Memory Onboard (ECC, supported only for E3900 SKU) ● Dual Display: LVDS, HDMI/DisplayPort ● eMMC Onboard (standard 32GB), TPM 2.0 (only for B1 version) ● Supports H.264/AVC, H.265/HEVC, VP9, VP8 HW DECODE ● Wide operating temperature range / Supports wide power input range of 4.75-20V ● iManager and embedded software API
Intel Pentium and Celeron N3000 series SoC COM Express mini module
● Intel Pentium and Celeron N3000 series SoC COM Express mini-module ● PICMG COM.0 R2.1 Type 10 mini-module ● Intel Pentium and Celeron N3000 series SoC ● Dual-channel DDR3L 1600 non-ECC onboard memory (up to 4GB) ● Dual display: LVDS, HDMI / DisplayPort ● 4GB to 32GB eMMC onboard storage ● iManager, SUSIAccess, and embedded software API ● Intel Pentium and Celeron N3000 series SoC COM Express mini-module
Intel Pentium Celeron N3000 series and Atom SoC COM Express
- iManager, WISE-PaaS / RMM, and embedded software API - Supports a wide range of power input from 4.75 to 20V - Rich display interfaces: LVDS / eDP, HDMI / DP, up to 3 independent displays - Supports 5 PCIex1, 4 USB3.0, and 8 USB2.0 - PICMG COM Express R2.1 compact module type 6 pin output - Intel Pentium/Celeron N3000 series and Atom SoC
High specifications with Tiger Lake! Computer-on-module with 8 cores/16 threads of 11th generation CPU and QFCS technology support.
The "SOM-5883" is a COM Express Type 6 Basic module specification that features a TDP of 45W or less, supports up to 8 cores, and incorporates the 11th generation Intel Core processor (Tiger Lake-H) with Iris Xe graphics. When used in conjunction with Advantech's software toolkit "Edge AI Suite," it becomes an optimal product for AI applications such as medical image processing. 【Main Features of the Product】 ◆ COM Express R 3.0 Basic Type 6 module ◆ Equipped with 11th generation Intel Xeon, Core i7/i5/i3/Celeron processors ◆ Size: 125 x 95 mm ◆ DDR4 up to 128GB, 3200MT/s, ECC ◆ Equipped with 3x DDI, LVDS/eDP, or VGA. Supports four independent display outputs ◆ 1x PCIe x16 Gen 4, 8x PCIe Gen 3, 4x USB 3.2 Gen 2, 2.5G LAN (TSN compatible), 2x SATA3 ◆ Operating temperature Standard: 0–60℃, Extended: -40–85℃
A module ideal for transmitting and receiving ASI signals, recording, and monitoring MPEG2-TS.
[DVB-ASI] - Four independent BNC connectors with switchable input/output - Status display via LED for each connector - Switchable between ASI mode and SDI mode - TR101 209 error monitoring with timestamp, packet count, and sync error passthrough functionality - Automatic cable equalization - Inverted ASI support - Hardware counter for bitrate measurement [SD-SDI] - 10-bit SD-SDI support (270Mbit/s) - Uncompressed SDI signal (Huffman compressed/uncompressed) - PCI Express x4 (Rev.1.1) - Free SDK provided (Windows, Linux) - Simple transmission and recording software sample code available
Intel 5th Generation Core i (Broadwell ULT) compatible Type 6 Compact COM Express
The COM Express module "PCOM-B633VG" supports Intel's 5th generation Core i (Broadwell-ULT) and allows for system memory expansion up to 8GB with DDR3L-1333/1600 SoDIMM. It supports 4K resolution and triple display. For more details, please download the catalog.
Type 6 COM Express compatible with Intel ATOM N3000 series
The COM Express module "PCOM-B636VG" is compatible with the Intel ATOM N3000 series and supports system memory expansion up to 8GB with DDR3L 1333/1600 SoDIMM. It supports 4K resolution and triple display. For more details, please download the catalog.
Matches various embedded and industrial applications, such as mission-critical uses!
The 『PCOM-B65A』 is a COM-Express Type-6 Basic module equipped with the Intel Core Ultra series (codename: Meteor Lake). This generation features a newly integrated NPU, significantly enhancing AI acceleration capabilities. Additionally, products from this generation are equipped with Arc Graphics for graphics processing, achieving a 50% improvement in AI performance compared to the previous generation. In addition to up to 24 lanes of PCI-Express Gen4, it offers various interfaces such as USB3.2 Gen2, allowing for flexible utilization of diverse interfaces. 【Features】 ■ Equipped with the new generation Intel Core Ultra series processor ■ Supports up to 96GB of DDR5-5600 memory ■ Abundant high-speed interfaces including PCI-Express Gen4 and USB4 ■ Optionally supports onboard PCIe NVMe SSD *For more details, please download the PDF or feel free to contact us.
Supports up to 64GB of DDR4 memory! Compatible with temperature expansion from -40℃ to 85℃ (for some CPUs).
The PCOM-B702G is a COM-Express Type 7 module equipped with an Intel Atom processor. Compared to the COM-Express Type 6, the pin configuration of COM-Express 3.0 Type 7 replaces all graphic interfaces with 10GbE and additional PCI-Express. As a result, it is suitable for network devices, microservers, and applications that require low power consumption along with high computing capability and communication throughput. **Features** - Intel Atom C3000 series processor (Denverton) - Supports up to 64GB of DDR4 memory - Up to 12 HSIO (High Speed I/O) lanes - Up to 4 x 10GbE - Supports temperature expansion from -40°C to 85°C (for some CPUs) *For more details, please download the PDF or feel free to contact us.*
Bringing server-level processing power! Designed for harsh environments, supporting operating temperatures from -40°C to 80°C (for some CPUs).
The 『PCOM-B705GT』 is a COM-Express Type 7 basic module equipped with an Intel Xeon D-1700 series processor. With its built-in Ethernet and a variety of I/O options, this high-performance SoC brings server-level processing power to the IoT field. The compact module supports a minimum of 4 cores to a maximum of 10 cores, 3-channel DDR4 memory, and fully supports COM-Express Type 7 I/O. 【Features】 ■ Equipped with Intel Xeon D-1700 processor for edge IoT ■ Intel Deep Learning Boost, Time Coordinated Computing ■ Supports operating temperatures from -40℃ to 80℃ for harsh environments (for some CPUs) *For more details, please download the PDF or feel free to contact us.
Intelligent PCI Express EtherCAT Master Board
AdEXP1572 is a PCI Express board with EtherCAT master communication capabilities. It uses the ARM Cortex-A9 processor embedded in the Xilinx Zynq and functions as an intelligent PCI Express bus slave board. The EtherCAT master protocol stack is equipped with "EC Master" from acontis technologies and is Class A compliant. It also supports cable redundancy and hot connect as a feature pack. This board is controlled by the PCI Express bus master (host CPU). Data transfer is conducted via shared memory installed on this board. As it functions as an intelligent slave, it enables EtherCAT master communication without burdening the host CPU. For more details, please contact us or download the catalog.
Atom-equipped compact size COM Express Type 2 module
ADLINK's COM Express modules, the cExpress-BT2, cExpress-BT, and nanoX-BT, comply with the PICMG COM.0 Rev.2.1 Type 2, Type 6, and Type 10 form factors, respectively. They feature typical x86 architecture characteristics, equipped with I/O, up to 3 lanes of PCIe, 2 SATA, and 8 USB ports, offering excellent scalability beneficial for application system design. Furthermore, to ensure reliability and stability, all modules have been verified through international standards for shock and vibration testing, achieving a robust design guaranteed to operate within an extended temperature range of -40°C to +85°C.
Bay Trail equipped with COM Express Type 10 Mini module
The nanoX-BT is a COM Express COM.0 R2.1 Type 10 module that supports the Intel Atom processor E3800 series and Intel Celeron N2930/J1900 processor SoC (formerly code-named: Bay Trail). It is specially designed for customers who require long product life, low power consumption, and high levels of processing and graphics performance. The nanoX-BT features the Intel Atom processor E3800 and Intel Celeron N2930/J1900 processor, supporting 1066/1333MHz non-ECC type DDR3L dual-channel memory, providing excellent overall performance. The integrated Intel Gen7 HD graphics include features such as support for OpenGL 3.1, DirectX 11, OpenCL 1.1, H.264, MPEG2, VC1, and VP8 hardware decoding. For graphics output, it has DDI ports supporting HDMI/DVI/DisplayPort and a single-channel 18/24-bit LVDS (eDP is optional).
Compact size COM Express Type 6 module equipped with Pentium and Celeron.
ADLINK's cExpress-BW, a computer-on-module, is equipped with SEMA Cloud functionality and supports IoT applications. The cExpress-BW can connect legacy industrial equipment and other IoT systems to the cloud, allowing it to locally store extracted raw data from these devices and determine which data to send to the cloud for further analysis. These analytical results can provide valuable information for policy decision-making and generate innovative business opportunities.
Compact-size COM Express Type 6 module equipped with 6th generation Intel Core and Celeron processors.
ADLINK's new Mini-ITX embedded boards and COM Express products feature the 6th generation Intel Core i7/i5/i3 processors (code name Skylake), the latest Xeon, and Celeron processors. These latest Intel processor-equipped products utilize cutting-edge 14nm microarchitecture and support ultra HD 4K resolution displays. ADLINK's cExpress-SL, which supports SEMA Cloud functionality, is a product specialized for IoT (Internet of Things) applications. The cExpress-SL connects existing industrial devices and other IoT systems to the cloud, allowing it to extract raw data from those devices and determine which data to store locally and which data to send to the cloud for detailed analysis. The results of data analysis can be utilized as valuable information for policy decision-making and the creation of innovative business opportunities.
6th generation Intel Xeon, Core, Celeron equipped basic size COM Express Type 6 module
ADLINK's new COM Express products feature the 6th generation Intel Core i7/i5/i3 processors (codenamed Skylake), the latest Xeon, and Celeron processors. These products equipped with the latest Intel processors adopt cutting-edge 14nm microarchitecture and support ultra HD 4K resolution displays. ADLINK's Express-SL/SLE, which supports SEMA Cloud functionality, is designed specifically for IoT (Internet of Things) applications. The Express-SL/SLE connects existing industrial devices and other IoT systems to the cloud, allowing for the extraction of raw data from these devices and determining which data to store locally and which to send to the cloud for detailed analysis. The results of data analysis can be utilized as valuable information for policy decision-making and the creation of innovative business opportunities.
Intel Atom E3900/Pentium/Celeron SoC Compact Size COM Express Type 6 Module
The ADLINK cExpress-AL computer-on-module, equipped with SEMA Cloud functionality, is ready for Internet of Things (IoT) applications. The cExpress-AL can connect traditional industrial devices and other IoT systems to the cloud, allowing it to extract raw data from these devices and determine which data to store locally and which to send to the cloud for further analysis. These analytical results can provide valuable information for policy-making and create innovative business opportunities.
Basic size COM Express Type 7 module equipped with up to 16 cores of Intel Xeon D and Pentium.
The ADLINK Express-BD7 computer-on-module, equipped with SEMA Cloud functionality, is a product specialized for Internet of Things (IoT) applications. The Express-BD7 connects traditional industrial devices and other IoT systems to the cloud, allowing it to extract raw data from these devices, determine which data to store locally, and decide which data to send to the cloud for further analysis. These analytical results can provide valuable information for policy-making and create innovative business opportunities.
Apollp Lake equipped with COM Express Type 10 module
The nanoX-AL is a COM Express COM.0 R2.1 Type 10 module compatible with the Intel Atom Processor E3900 series SoC. The nanoX-AL is designed for customers seeking a low-power, long-life solution that emphasizes optimized processing capabilities and graphic performance. The nanoX-AL features a dual/quad-core Intel Atom Processor E3900 series and supports non-ECC type DDR3L single-channel or dual-channel memory at 1600/1867 MHz, offering exceptionally excellent overall performance. The integrated Intel 9th generation LP graphics include support for OpenGL 4.3, DirectX 12, OpenCL 2.0, and hardware decoding for H.265/HEVC, H.264, MPEG2, VC1, VP9, MVC, and JPEG/MJPEG.
Basic size Type 6 module equipped with 11th generation Intel Core/Xeon W/Celeron 6000 processors.
The ADLINK Express-TL COM Express Type 6 Basic size module is based on the 11th generation Intel Core, Xeon W, and Celeron 6000 processors, and is the first COM Express module to support PCI Express x16 Gen4, effectively doubling the bandwidth of previous generation COM Express modules. With 8 cores, 16 threads, and up to 128GB of memory, the Express-TL delivers uncompromising system performance and responsiveness for your solutions. The Express-TL features 12th generation Intel Iris Xe graphics and Intel AVX-512 Vector Neural Network Instructions (VNNI), achieving three times the AI inference performance compared to previous generation platforms without VNNI.
COM Express Type 6 equipped with 12th generation Intel Core processors (formerly code-named: Alder Lake-P)
The ADLINK Express-ADP COM Express Type 6 basic size module is the first COM Express module to support an advanced hybrid architecture based on the 12th generation Intel Core processors, featuring up to 6 performance cores (P-core) for IoT workloads and up to 8 efficient cores (E-core) for background task management, promoting productivity and IoT innovation across a wide range of deployments. This module provides support that combines PCIe 4.0 with increased DDR5 memory and cache of up to 4800MT/s, as well as security and manageability features, AI capabilities for intelligent workload optimization, and enhancements in graphics, AI, computer vision, peripheral connectivity, and high-speed memory access.
COM Express Type 7 module equipped with Intel Xeon D-1700 processor (codename: Ice Lake-D)
The ADLINK Express-ID7 COM Express Type 7 Basic Size module is characterized by its integration of the Intel Xeon D-1700 processor, combining up to 4x 10G integrated high-speed Ethernet and 16 PCIe Gen4 lanes, enabling instant responsiveness and performance. It features Intel TCC, Deep Learning Boost (VNNI), and AVX-512 technology to optimize and accelerate AI performance, supports Time Sensitive Networking (TSN), and allows for precise control of hard real-time workloads across all network devices.
COM Express R3.1 Compact Size Type 6 Module with Intel Core Ultra Processor
The cExpress-MTL, equipped with Intel's latest Intel Core Ultra processor (formerly Meteor Lake-U/H), is a COM Express COM.0 R3.1 Type 6 Compact-sized module that offers Intel's modular architecture integrating CPU, GPU, and NPU to the embedded market. It provides up to 8 GPU Xe cores (128 EU), an NPU with 11pTOPS/8.2eTOPS, and 14 CPU cores with a TDP of 28W. By leveraging skilled GPUs, hardware acceleration for AV1 encoding/decoding, and a dedicated NPU for AI acceleration, as well as upgrading all PCIe signals to Gen4 and supporting USB4 for increased flexibility, the cExpress-MTL effectively simplifies solution designs that would otherwise require additional external processing units.
COM Express R3.1 Type 6 Compact Size Module
The cExpress-ASL is a COM Express COM.0 R3.1 Type 6 Compact-sized module that features Intel Atom x7000RE processors (x7211RE, x7213RE, x7433RE, x7835RE) and x7000C processors (x7203C, x7405C, x7809C) with up to 8 cores and 64-bit real-time support (compatible with Intel TCC and TSN). The cExpress-ASL combines soldered memory and extreme temperature options, specifically designed for customers requiring entry-level computing with real-time performance, a balanced cost structure, and extended product lifecycle support for robust edge solutions that operate 24/7.
Intel Core Ultra Processor Series 3 COM Express R3.1 Type 6 Basic Size Module
ADLINK's Express-PTL is a next-generation COM Express Type 6 computer-on-module equipped with the Intel Core Ultra Series 3 (Panther Lake-H) processor, achieving a significant leap in performance for edge AI and advanced embedded systems. It features a powerful hybrid CPU architecture with P, E, and low-power LPE cores, supporting up to 128GB of DDR5 memory and IBECC, ensuring high reliability and efficiency. The Express-PTL integrates the next-generation Intel Arc Xe3 GPU, which delivers up to 1.5 times the graphics performance, and an NPU with up to 180 TOPS, enabling fast and efficient AI inference, computer vision, and graphics-intensive workloads within a compact, standard-based COM Express form factor. The Express-PTL supports a rich array of high-speed I/O, including industrial features such as PCIe Gen4, multiple display options, USB4/Thunderbolt capabilities (build options), TSN Ethernet, TPM 2.0, and advanced power management.
Equipped with Intel Atom Processor x6000E series! Ultra-low power consumption Computer On Module standard.
The "HFCE-35" is a COM Express module equipped with 2 slots for DDR4 SO-DIMM, supporting a maximum of 32GB of memory. It supports In-Band ECC and is equipped with a rich array of interfaces including SATA, USB, and PCI Express. The form factor is COM Express Type 6 Compact. The power supply supports DC 9-19V, and the operating ambient temperature ranges from -20 to 55°C. The external dimensions are 95(W) × 95(D) mm. 【Features】 ■ Ultra-low power consumption COM Express module (Computer On Module standard) ■ Equipped with Intel Atom Processor x6000E series ■ DDR4 SO-DIMM 2 slots (Dual channel support) maximum 32GB ■ In-Band ECC support ■ Equipped with a variety of I/F (SATA, USB, PCI Express, LAN, Video) *For more details, please refer to the related links or feel free to contact us.
Equipped with 6th generation Intel Core i7/i5/i3 processors! Low power consumption Computer On Module standard.
The 『HFCE-82』 is a COM Express module equipped with 2 slots for DDR4 SO-DIMM, supporting a maximum of 32GB of memory. It uses ECC-compatible memory and is equipped with a rich array of interfaces including 4 SATA ports, USB 3.2, USB 2.0, and PCI Express. The form factor is COM Express Type 6 Basic, with external dimensions of 125(W) × 95(D) mm. The power supply supports DC 9-19V. 【Features】 ■ Low power consumption COM Express module (Computer On Module standard) ■ DDR4 SO-DIMM 2 slots (Dual channel compatible) maximum 32GB (ECC compatible) ■ 4 SATA ports, USB 3.2/USB 2.0 compatible ■ PCI Express 2.0 compliant x1 Lane 8 Slot / x8 Lane 1 Slot ■ Video: VGA, LVDS, HDMI compatible *For more details, please refer to the related links or feel free to contact us.
