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  6. COM Express Type7【Express-BD7】

COM Express Type7【Express-BD7】

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Express-BD7

last updated:Jan 06, 2017

ADLINKジャパン 東京本社
ADLINKジャパン 東京本社
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Basic size COM Express Type 7 module equipped with up to 16 cores of Intel Xeon D and Pentium.

The ADLINK Express-BD7 computer-on-module, equipped with SEMA Cloud functionality, is a product specialized for Internet of Things (IoT) applications. The Express-BD7 connects traditional industrial devices and other IoT systems to the cloud, allowing it to extract raw data from these devices, determine which data to store locally, and decide which data to send to the cloud for further analysis. These analytical results can provide valuable information for policy-making and create innovative business opportunities.

    Embedded Board Computers
Express-BD7_simg_en_2.jpg

COM Express Type7【Express-BD7】

Express-BD7_simg_en_2.jpg
Express-BD7_simg_en_2.jpg
  • Express-BD7 Product Page
  • Special site - Product/service details - https://pr.mono.ipros.com/adlinktech/product/

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basic information

Basic size COM Express Type 7 module equipped with up to 16-core Intel Xeon D and Pentium 【Features】 - Up to 16-core Intel Xeon D series SoC (formerly codenamed: Broadwell-DE) - Up to 32GB of dual-channel DDR4 ECC at 1867/2133/2400MHz (dependent on SoC SKU) - Support for two 10G Ethernet and NC-SI - Up to 8 PCIe x1 (Gen2), 1 PCIe x16 (Gen3) - GbE, two SATA 6 Gb/s, four USB 3.0/2.0 - Compatible with Smart Embedded Management Agent (SEMA) functionality - Extreme rugged operating temperature: -40℃ to 85℃ (build option)

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Applications/Examples of results

- Machine Automation - Inspection, Measurement, Control - Intelligent Building Automation - Medical Devices, etc.

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Express-BD7

Express-BD7

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The most robust, highest support (COM module comprehensive catalog 2019)

The most robust, highest support (COM module comprehensive catalog 2019)

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Express-ID7

Express-ID7

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COM-HPC

COM-HPC: Latest PICMG Computer-on-Module for High-Performance Edge Computing

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PICMG (PCI Industrial Computer Manufacturers Group) is in the final stages of developing the latest COM-HPC computer-on-module specification to meet the needs of the highly advanced industrial edge computing market. The COM-HPC specification is intended not to replace COM Express but to expand upon its success, with a release planned by the second quarter of 2020. Edge computing is a rapidly growing field that demands unprecedented levels of performance. The system memory requirements for current and future high-end embedded multicore processors are increasing very sharply. As memory requirements approach 128 GB or 256 GB, current common form factors like COM Express can no longer provide a cost-effective solution. This is why COM HPC is needed. Five sizes have been defined that can be used as server modules capable of accommodating up to eight DIMM sockets onboard.

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ADLINKジャパン

ADLINKジャパン 東京本社

Industrial Electrical Equipment

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【ADLINK Japan's Concept】 To let more Japanese customers know about the quality of Taiwanese products and to encourage their adoption. In order to provide the highest quality and high-performance products, we are committed to thorough CQD (Cost, Quality, Delivery) practices to meet our customers' needs. Thus, we established ADLINK Japan Co., Ltd. with the aim of providing customer-first services and support. 【ADLINK Japan's Quality Policy】 - Customer First Principle - Complaint First - Zero Defect Rate We aim for these goals. 【Why Choose ADLINK】 - Stable long-term supply (over 5 years) - Regular quality improvement plans (CCC) - Diverse standard products and contract development available - Speedy analysis capabilities - Japanese language support (both sales and technical) - Local support - Environmental compliance (e.g., ROHS) 【About Our Privacy Policy】 https://www.adlinktech.com/jp/PrivacyPolicy

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