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Introduction to Glass Etching Processing Technology

Introduction to Glass Etching Processing Technology

Corrode the surface of the glass with chemicals such as hydrofluoric acid!

"Glass etching" is a processing technique that involves corroding the surface of glass with chemicals such as hydrofluoric acid to create grooves and relief patterns. Quartz and borosilicate glass such as BK7 are used as substrate materials. Additionally, a metal thin film patterned by photolithography is used as a mask, allowing for the formation of high-precision patterns. [Features] - Uses quartz and borosilicate glass such as BK7 as substrate materials - Utilizes a metal thin film patterned by photolithography as a mask - Capable of forming high-precision patterns - Allows for dimensional control in the depth direction - The surface is relatively smooth finished *For more details, please refer to the catalog or feel free to contact us.

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Introduction to Silicon Etching Processing Technology

Introduction to Silicon Etching Processing Technology

By selecting the type of crystal orientation, you can choose the type of groove processing!

"Silicon etching" is a processing technology that corrodes the silicon substrate itself to form three-dimensional structures. There are two types of silicon corrosion: one that progresses in a specific direction (anisotropic) and one that progresses in all directions (isotropic). When performing anisotropic etching, single-crystal silicon is used for the substrate, and an etching solution such as KOH aqueous solution is employed. Single-crystal silicon wafers are categorized by crystal direction, and by selecting this, it is possible to choose the type of groove processing. Additionally, isotropic etching can also be performed depending on the type of etching solution used. [Features] - Corrodes the silicon substrate itself to form three-dimensional structures - Allows selection of groove processing types by choosing the type of crystal direction - Isotropic etching is possible depending on the type of etching solution *For more details, please refer to the catalog or feel free to contact us.

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Silicon etching

Silicon etching

Silicon etching

Introducing Photo Precision Co., Ltd., which contributes to prototyping and development in various fields, including microelectronics and optical products, with photofabrication as its core technology. "Silicon Etching" Overview A technology that etches the silicon substrate itself to form three-dimensional structures. ■□■ Features ■□■ ■ Utilizing the crystal orientation of silicon, it enables groove processing with flat groove walls (anisotropic etching). V-shaped and rectangular grooves can be formed. ■ Depending on the type of etching solution, rounded edges can be created on the groove walls, allowing for isotropic etching as well. ■□■ Types of Processing ■□■ ■ V-Groove Processing - Using silicon material with a <100> surface orientation, V-shaped grooves are formed. - The angle of the slope is always the same (54.7°). ■ Rectangular Groove Processing - Using silicon material with a <110> surface orientation, rectangular grooves are formed. - Due to the crystal structure, the direction of the grooves tilts at 54.7° relative to the side surface. ■ Isotropic - Etching progresses uniformly in all directions. For more details, please download the catalog or contact us.

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