[Analysis Case] Evaluation of Flux Cleaning Residue
We capture the minute and ultra-thin residue as an image.
In recent years, with the introduction of lead-free solder, the flux components have also been improved (with higher activity and heat resistance, etc.), leading to increased corrosiveness and a growing importance of residue issues. Therefore, the removal of flux is required. An analysis of foreign substances in the electrode parts of printed circuit boards using TOF-SIMS revealed the presence of flux components.
- Company:一般財団法人材料科学技術振興財団 MST
- Price:Other