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FPC(フレキシブル) - List of Manufacturers, Suppliers, Companies and Products | IPROS GMS

Last Updated: Aggregation Period:Sep 09, 2026~Oct 06, 2026
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FPC Product List

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Flexible substrate design, manufacturing, and assembly - Flexible circuit boards (FPC)

Prototype/Flexible Circuit Board Design Expert

- LED bear chip mounted transparent polyimide substrate - Fine, narrow pitch flexible substrate - Ultra-thin high bend flexible substrate - Shielded noise-resistant flexible substrate - Flying lead flexible substrate - Bump-equipped flexible substrate - Liquid crystal polymer (LCP) flexible substrate - Long flexible substrate - Blind via hole (BVH) connection FPC

  • Printed Circuit Board
  • Circuit board design and manufacturing
  • Contract manufacturing
  • FPC

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Support for the launch of flexible printed circuit boards (FPC).

Pattern Width VS Temperature Rise Test FPC

●Setting design and evaluation criteria Creating flexible printed circuits (FPC) with multiple pattern widths, applying several patterns of current, and measuring temperature distribution and pattern voltage drop using a thermal viewer. FPC

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Bump-mounted flexible circuit board, FPC, flexible circuit board FPC

It is a flexible circuit board, flexible substrate, and FPC for continuity testing. FPC

A Ci-Ni bump has been formed on the FPC wiring. It is mainly used for bare chip mounting such as flip chip mounting, continuity testing of fine pitch terminals, and as a test jig. FPC

  • Circuit board design and manufacturing
  • Contract manufacturing
  • Contract Analysis
  • FPC

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chemSHERPA Creation Service FPC

Proposal for outsourcing the investigation of environmental burden substances to reduce operational burden: chemSHERPA RoHS REACH TSCA non-use certificate FPC.

At Satec, we handle everything from investigating the chemical substances contained in used parts to creating environmental impact data for products. We conduct survey requests to suppliers (agents/manufacturers) on behalf of our customers and create chemSHERPA data. We assist developers in reducing their workload, which they manage alongside their primary tasks (circuit design and operation verification). FPC Flexible circuit boards, flex boards, FPC, flex, rigid-flex High heat resistance, membrane switches, flexible circuit boards, flex, FPC, printed circuit boards, Flexible circuit boards, flex boards, FPC, flex, Hamamatsu City, Board design, boards, printed circuit boards, pattern design, assembly, SMD assembly, board analysis, circuit design, software, hardware, Electronic circuit design, rigid-flex, heat dissipation boards, Specialty boards, stretchable boards, transparent polyimide, polyimide, MEMS, chemSHERPA

  • Circuit board design and manufacturing
  • Other contract services
  • Catalog and manual creation
  • FPC

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Printed Circuit Board Pattern Design, Production, Manufacturing - Flexible Circuit Boards (FPC)

We can accommodate the production of printed circuit boards with various specifications! FPC

- Rigid substrate - Flexible substrate (flexible PCB, FPC) - Rigid-flexible substrate - Impedance controlled substrate - Heat dissipation substrate (thick copper substrate, copper inlay substrate, metal base substrate) - Ceramic substrate (alumina substrate) - Glass substrate - Teflon substrate - Edge through-hole - Cavity substrate - Embedded component substrate - Stretchable flexible substrate FPC

  • Circuit board design and manufacturing
  • Printed Circuit Board
  • Contract manufacturing
  • FPC

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[Support for Improving Development Capability] Flexible Circuit Boards, FPC, Flexible Boards FPC

We will support and propose ideas to the development technology personnel to further enhance development capabilities! FPC

- Circuit board analysis services (circuit investigation, component investigation, specification investigation, etc.) - Reliability and environmental testing services - Consulting services (thermal analysis and countermeasure development, FPC startup support) - Proposal and sales of development and production support tools (JTAG boundary scan test system) - Proposal for test coupon development for FPC Resin, metal cutting,

  • Circuit board design and manufacturing
  • Contract manufacturing
  • Contract Analysis
  • FPC

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Design and manufacture of manufacturing tools, flexible circuit boards, flexible substrates, FPC.

We handle the design, manufacturing, and procurement of peripheral components for printed circuit boards, saving development personnel time! FPC

- High heat-resistant membrane switch - Procurement of various tools used in the manufacturing process - Procurement of electronic components - Design and procurement of assembly jigs (inspection jigs/pallets, etc.) - Design and procurement of resin and metal cases (machining/3D printing) - Proposal and sales of JTAG boundary scan test systems - Manufacturing and sales of membrane switches - Manufacturing and sales of dedicated function testers - Manufacturing and sales of custom sockets - Manufacturing and sales of cables FPC

  • Circuit board design and manufacturing
  • Contract manufacturing
  • Contract Analysis
  • FPC

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[CT.Lab] Research and Development Support Flexible Substrates, Flexible Boards, FPC

Combining specialized design, next-generation materials, and the latest wiring technology to create new added value.

- Thin film formation and contract processing services - Special metal material patterning technology (Ag, Sn, Pt, Nb, Ni-Pd-Au, etc.) - Ultra-fine processing for MEMS/semiconductors - Research and development of high heat-resistant membrane switches - Development of flexible substrates using transparent polyimide and stretchable materials - Material development using fluororesin

  • Circuit board design and manufacturing
  • Printed Circuit Board
  • Contract manufacturing
  • FPC

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FPC (Flexible Printed Circuit)

Leave it to us for anything related to FPC, including small quantities, a variety of products, short delivery times, prototypes, and mass production!

We would like to introduce our domestic factory's response to FPC (Flexible Printed Circuit Board). Our factory features a fully integrated production line for rapid manufacturing. In "Pattern Design," professionals in implementation technology provide pattern designs suitable for the required specifications, while in "Manufacturing Design," we verify all design data before production. Additionally, in our "Manufacturing Line," we produce all types of flexible, rigid boards, and rigid-flex boards in-house. We also provide assembly services for printed boards in-house. 【Features】 ■ Super-fast delivery with an in-house integrated line ■ Supports small lots and a variety of products, accepting orders from a single repeat ■ Cost reduction through efficient manufacturing processes for small lots ■ High reliability achieved with over 20 years of manufacturing know-how ■ Flexibility and responsiveness made possible by a small, elite team *For more details, please refer to the related links or feel free to contact us.

  • Circuit board design and manufacturing
  • Printed Circuit Board
  • FPC

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FPC (Flexible Printed Circuit Board)

We accommodate everything from small lots to a wide variety of products!

Our company handles FPC (Flexible Printed Circuit Boards) and provides a consistent production system from design to prototyping and mass production. We can supply products to China and overseas with single-sided, double-sided, printed punch, double access, multilayer (4 layers), long-length (up to 700mm) flexible boards, and manual assembly. Please feel free to contact us if you have any requests. 【Features】 ■ SMT assembly (handled by subcontractors) ■ In-house mold manufacturing ■ Halogen-free substrate support ■ Lead-free solder plating/Au plating (electrolytic/non-electrolytic) *For more details, please download the PDF or feel free to contact us.

  • Company:JOIE
  • Price:Other
  • Printed Circuit Board
  • Circuit board design and manufacturing
  • FPC

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Multilayer FPC (multilayer substrate, multilayer flexible printed circuit board)

We will manufacture multi-layer flexible printed circuit boards (3 to 6 layers) entirely from polyimide. Please look forward to our quick delivery response! (Multi-layer boards, FPC)

Taiyo Industry supports everything from prototyping to mass production. ■ Achieves high density through pad-on-bead technology. ■ Compatible with 400μm pitch BGA. ■ Improved design flexibility with multilayer structures for high-density wiring. ■ Also supports impedance management. For more detailed information, please feel free to contact our representative. #Flex #FPC #FlexibleCircuitBoard #FlexiblePrintedCircuitBoard #CircuitBoard #PrintedCircuitBoard #HighFrequency #Impedance

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  • Other electronic parts
  • Printed Circuit Board
  • Circuit board design and manufacturing
  • FPC

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MSAP FPC (Ultra-fine Circuit High-Frequency Flexible Substrate)

Formation of fine circuits using the MSAP method.

Yamashita Material's MSAP (Modified Semi-Additive Process) is a high-precision method for forming fine copper wiring on polyimide substrates. Compared to traditional subtractive methods, it has less distortion in pattern shapes due to etching, allowing for the formation of higher-density circuits. It is suitable for FPC applications that require miniaturization, high density, and fine wiring.

  • Circuit board design and manufacturing
  • FPC

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Production of ultra-long flexible circuit boards 20M sensor FPC [Board manufacturing achievements]

Pattern exposure corresponding to 20m! Achieving low-cost production through innovative manufacturing methods.

We would like to introduce our achievements in substrate manufacturing. We optimized each device to handle materials in roll form and produced ultra-long substrates with a product size of 20m. We perform exposure, development, and etching processes, using polyester materials to reduce costs. We achieved low-cost production through suggestions during the manufacturing method and product design stages, as well as innovations in the manufacturing process. 【Basic Specifications】 ■ Material: Polyester/0.075 Cu35/0μ ■ Processes: Etching, simple shape processing ■ Substrate Size: 20000×59 ■ Others: Flying checker not available *For more details, please refer to the PDF document or feel free to contact us.

  • Printed Circuit Board
  • Circuit board design and manufacturing
  • FPC

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Liquid Leak Testing Device - A "new" solution to make liquid leaks visible.

Are you aiming for "zero missed leaks" in liquid filling processes? A new liquid leak inspection device utilizing flexible printed circuit boards (FPC)!

An FPC is installed at the mouth of "liquid-filled containers" flowing on production lines such as conveyor belts, enabling instant detection of minute liquid leaks. This contributes to the automation of line stoppages and the elimination of defective products. It is a new inspection solution that realizes "visualization" for quality improvement, cost reduction, and standardization of inspection processes. 【Features】 - High-precision surface detection that surpasses visual inspection capabilities - Inline installation on existing lines is possible (retrofit compatible) - Compatible with various shapes such as bottles, pouches, and nozzles - Eliminates reliance on specific personnel, enabling unmanned operation without the need for training - Automation and standardization of inspection processes through the supplementation of visual inspections - Addresses labor shortages with 24-hour unmanned inspections 【Benefits of Implementation】 - Increased efficiency and improved yield in pre-shipment inspections - Reduced risk of returns and recalls - Lower labor and training costs - Standardization of quality across overseas locations The FPC can be customized according to container shapes through in-house design and manufacturing.

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  • Sensors
  • Liquid and beverage filling machines
  • Filling and bottling machines
  • FPC

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Ultra-fine line high-density FPC (high-precision flexible printed circuit board)

Ultra-fine lines, high density, and high-resolution flexible printed circuit boards have made it possible to form ultra-fine circuits through the integration of MSAP technology and via filling techniques!

The miniaturization and high functionality of electronic devices are advancing, and along with this, there is a demand for finer circuit formation. One method for forming wiring by etching copper foil (subtractive method) and a high-resolution circuit formation method involves forming wiring on ultra-thin copper foil through plating (semi-additive method). The method we are introducing this time is one of the semi-additive processes called "MSAP (Modified Semi Additive Process)." By using the MSAP method, it has become possible to form ultra-fine and high-density patterns that are difficult to achieve with the subtractive method. Additionally, by combining it with the "via filling technology" that fills through-hole holes with copper plating, it becomes possible to create wiring on the through-holes as well, further increasing wiring density. **Features of the MSAP Method** - Circuit formation through plating deposition enables high-precision fine wiring. - Excellent rectangularity of wiring cross-sections contributes to reduced transmission loss. - Superior for high-frequency substrates/IC mounting. By merging these two processing technologies, we have realized "ultra-fine high-density FPC." #FlexibleSubstrate #Substrate #HighPrecisionSubstrate #Flex #FlexiblePrintedCircuitBoard

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  • Printed Circuit Board
  • Circuit board design and manufacturing
  • FPC

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