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Pattern Width VS Temperature Rise Test FPC
●Setting design and evaluation criteria Creating flexible printed circuits (FPC) with multiple pattern widths, applying several patterns of current, and measuring temperature distribution and pattern voltage drop using a thermal viewer. FPC
We can accommodate the production of printed circuit boards with various specifications! FPC
- Rigid substrate - Flexible substrate (flexible PCB, FPC) - Rigid-flexible substrate - Impedance controlled substrate - Heat dissipation substrate (thick copper substrate, copper inlay substrate, metal base substrate) - Ceramic substrate (alumina substrate) - Glass substrate - Teflon substrate - Edge through-hole - Cavity substrate - Embedded component substrate - Stretchable flexible substrate FPC
![[Support for Improving Development Capability] Flexible Circuit Boards, FPC, Flexible Boards FPC](https://image.mono.ipros.com/public/product/image/3e1/2000509617/IPROS71846780305768154871.jpeg?w=280&h=280)
We will support and propose ideas to the development technology personnel to further enhance development capabilities! FPC
- Circuit board analysis services (circuit investigation, component investigation, specification investigation, etc.) - Reliability and environmental testing services - Consulting services (thermal analysis and countermeasure development, FPC startup support) - Proposal and sales of development and production support tools (JTAG boundary scan test system) - Proposal for test coupon development for FPC Resin, metal cutting,
![[CT.Lab] Research and Development Support Flexible Substrates, Flexible Boards, FPC](https://image.mono.ipros.com/public/product/image/04e/2000509891/IPROS14150629607051954324.jpeg?w=280&h=280)
Combining specialized design, next-generation materials, and the latest wiring technology to create new added value.
- Thin film formation and contract processing services - Special metal material patterning technology (Ag, Sn, Pt, Nb, Ni-Pd-Au, etc.) - Ultra-fine processing for MEMS/semiconductors - Research and development of high heat-resistant membrane switches - Development of flexible substrates using transparent polyimide and stretchable materials - Material development using fluororesin
