Last Updated： Aggregation Period:Sep 09, 2026～Oct 06, 2026
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It is a flexible circuit board, flexible substrate, and FPC for continuity testing. FPC
A Ci-Ni bump has been formed on the FPC wiring. It is mainly used for bare chip mounting such as flip chip mounting, continuity testing of fine pitch terminals, and as a test jig. FPC
One-stop service for FPC design, manufacturing, implementation, and finished product assembly all provided by Taiyo Technorex!
We will support the resolution of challenges in your product development and manufacturing in a broader and more flexible manner. ★.。.:*+゜★.。.:*+゜★.。.:*+゜★.。.:*+゜★.。.:*+゜★.。.:*+゜★.。.:*+゜ ☆ ～ ☆ ～ Do you have any of the following concerns? ～☆ ～ ☆ • Looking for a reliable manufacturing partner for new product development • Considering outsourcing as you do not have a manufacturing line • Wanting to request complex board assembly and enclosure assembly, including FPC ★.。.:*+゜★.。.:*+゜★.。.:*+゜★.。.:*+゜★.。.:*+゜★.。.:*+゜★.。.:*+゜ Our company has established a system that can consistently handle everything from design to implementation, assembly, inspection, and shipping, and we support the resolution of challenges in your product development and manufacturing in a broader and more flexible manner. You will be able to focus on development while efficiently bringing high-quality products to market. If you would like detailed materials or case studies about our EMS business, please feel free to contact us. We also welcome those who just want to take a look at the materials!
Prototype/Flexible Circuit Board Design Expert
- LED bear chip mounted transparent polyimide substrate - Fine, narrow pitch flexible substrate - Ultra-thin high bend flexible substrate - Shielded noise-resistant flexible substrate - Flying lead flexible substrate - Bump-equipped flexible substrate - Liquid crystal polymer (LCP) flexible substrate - Long flexible substrate - Blind via hole (BVH) connection FPC
Proposal for outsourcing the investigation of environmental burden substances to reduce operational burden: chemSHERPA RoHS REACH TSCA non-use certificate FPC.
At Satec, we handle everything from investigating the chemical substances contained in used parts to creating environmental impact data for products. We conduct survey requests to suppliers (agents/manufacturers) on behalf of our customers and create chemSHERPA data. We assist developers in reducing their workload, which they manage alongside their primary tasks (circuit design and operation verification). FPC Flexible circuit boards, flex boards, FPC, flex, rigid-flex High heat resistance, membrane switches, flexible circuit boards, flex, FPC, printed circuit boards, Flexible circuit boards, flex boards, FPC, flex, Hamamatsu City, Board design, boards, printed circuit boards, pattern design, assembly, SMD assembly, board analysis, circuit design, software, hardware, Electronic circuit design, rigid-flex, heat dissipation boards, Specialty boards, stretchable boards, transparent polyimide, polyimide, MEMS, chemSHERPA
Ultra-fine lines, high density, and high-resolution flexible printed circuit boards have made it possible to form ultra-fine circuits through the integration of MSAP technology and via filling techniques!
The miniaturization and high functionality of electronic devices are advancing, and along with this, there is a demand for finer circuit formation. One method for forming wiring by etching copper foil (subtractive method) and a high-resolution circuit formation method involves forming wiring on ultra-thin copper foil through plating (semi-additive method). The method we are introducing this time is one of the semi-additive processes called "MSAP (Modified Semi Additive Process)." By using the MSAP method, it has become possible to form ultra-fine and high-density patterns that are difficult to achieve with the subtractive method. Additionally, by combining it with the "via filling technology" that fills through-hole holes with copper plating, it becomes possible to create wiring on the through-holes as well, further increasing wiring density. **Features of the MSAP Method** - Circuit formation through plating deposition enables high-precision fine wiring. - Excellent rectangularity of wiring cross-sections contributes to reduced transmission loss. - Superior for high-frequency substrates/IC mounting. By merging these two processing technologies, we have realized "ultra-fine high-density FPC." #FlexibleSubstrate #Substrate #HighPrecisionSubstrate #Flex #FlexiblePrintedCircuitBoard
We accommodate everything from small lots to a wide variety of products!
Our company handles FPC (Flexible Printed Circuit Boards) and provides a consistent production system from design to prototyping and mass production. We can supply products to China and overseas with single-sided, double-sided, printed punch, double access, multilayer (4 layers), long-length (up to 700mm) flexible boards, and manual assembly. Please feel free to contact us if you have any requests. 【Features】 ■ SMT assembly (handled by subcontractors) ■ In-house mold manufacturing ■ Halogen-free substrate support ■ Lead-free solder plating/Au plating (electrolytic/non-electrolytic) *For more details, please download the PDF or feel free to contact us.
Implement wiring applications with new unique functionality and achieve style!
The conventional FPC has undergone a new and remarkable evolution. With its unique new functionality, it realizes implementation wiring applications and styles. Starting with the "Power FPC," which has high current capacity and excellent heat dissipation, there are also options like the "3D Shape FPC," which enables new movable forms. 【Lineup】 ■ Power FPC ■ 3D Shape FPC ■ Heat-resistant FPC ■ Stretchable FPC *For more details, please refer to the PDF document or feel free to contact us.
We handle the design, manufacturing, and procurement of peripheral components for printed circuit boards, saving development personnel time! FPC
- High heat-resistant membrane switch - Procurement of various tools used in the manufacturing process - Procurement of electronic components - Design and procurement of assembly jigs (inspection jigs/pallets, etc.) - Design and procurement of resin and metal cases (machining/3D printing) - Proposal and sales of JTAG boundary scan test systems - Manufacturing and sales of membrane switches - Manufacturing and sales of dedicated function testers - Manufacturing and sales of custom sockets - Manufacturing and sales of cables FPC
Pattern Width VS Temperature Rise Test FPC
●Setting design and evaluation criteria Creating flexible printed circuits (FPC) with multiple pattern widths, applying several patterns of current, and measuring temperature distribution and pattern voltage drop using a thermal viewer. FPC
Leave it to us for anything related to FPC, including small quantities, a variety of products, short delivery times, prototypes, and mass production!
We would like to introduce our domestic factory's response to FPC (Flexible Printed Circuit Board). Our factory features a fully integrated production line for rapid manufacturing. In "Pattern Design," professionals in implementation technology provide pattern designs suitable for the required specifications, while in "Manufacturing Design," we verify all design data before production. Additionally, in our "Manufacturing Line," we produce all types of flexible, rigid boards, and rigid-flex boards in-house. We also provide assembly services for printed boards in-house. 【Features】 ■ Super-fast delivery with an in-house integrated line ■ Supports small lots and a variety of products, accepting orders from a single repeat ■ Cost reduction through efficient manufacturing processes for small lots ■ High reliability achieved with over 20 years of manufacturing know-how ■ Flexibility and responsiveness made possible by a small, elite team *For more details, please refer to the related links or feel free to contact us.
We can accommodate the production of printed circuit boards with various specifications! FPC
- Rigid substrate - Flexible substrate (flexible PCB, FPC) - Rigid-flexible substrate - Impedance controlled substrate - Heat dissipation substrate (thick copper substrate, copper inlay substrate, metal base substrate) - Ceramic substrate (alumina substrate) - Glass substrate - Teflon substrate - Edge through-hole - Cavity substrate - Embedded component substrate - Stretchable flexible substrate FPC
We will manufacture multi-layer flexible printed circuit boards (3 to 6 layers) entirely from polyimide. Please look forward to our quick delivery response! (Multi-layer boards, FPC)
Taiyo Industry supports everything from prototyping to mass production. ■ Achieves high density through pad-on-bead technology. ■ Compatible with 400μm pitch BGA. ■ Improved design flexibility with multilayer structures for high-density wiring. ■ Also supports impedance management. For more detailed information, please feel free to contact our representative. #Flex #FPC #FlexibleCircuitBoard #FlexiblePrintedCircuitBoard #CircuitBoard #PrintedCircuitBoard #HighFrequency #Impedance
![[Support for Improving Development Capability] Flexible Circuit Boards, FPC, Flexible Boards FPC](https://image.mono.ipros.com/public/product/image/3e1/2000509617/IPROS71846780305768154871.jpeg?w=280&h=280)
We will support and propose ideas to the development technology personnel to further enhance development capabilities! FPC
- Circuit board analysis services (circuit investigation, component investigation, specification investigation, etc.) - Reliability and environmental testing services - Consulting services (thermal analysis and countermeasure development, FPC startup support) - Proposal and sales of development and production support tools (JTAG boundary scan test system) - Proposal for test coupon development for FPC Resin, metal cutting,
![[CT.Lab] Research and Development Support Flexible Substrates, Flexible Boards, FPC](https://image.mono.ipros.com/public/product/image/04e/2000509891/IPROS14150629607051954324.jpeg?w=280&h=280)
Combining specialized design, next-generation materials, and the latest wiring technology to create new added value.
- Thin film formation and contract processing services - Special metal material patterning technology (Ag, Sn, Pt, Nb, Ni-Pd-Au, etc.) - Ultra-fine processing for MEMS/semiconductors - Research and development of high heat-resistant membrane switches - Development of flexible substrates using transparent polyimide and stretchable materials - Material development using fluororesin
FPC with a structure that has both Rigid and Flexible properties!
"RIGID FPCB" is a type of FPC that combines the characteristics of Rigid (hard) and Flexible (soft), making it easy to implement SMD (Surface Mount Device) components. It is suitable for applications requiring high connection reliability between circuit boards. Additionally, we offer two types of lineups to suit different applications. Please feel free to contact us. 【Features】 ■ Combines Rigid (hard) and Flexible (soft) characteristics ■ Ideal for inter-board connection applications *For more details, please contact us or download the catalog.
FPC is ideal for curved areas that require anti-fogging and thermal insulation.
【Features】 ■ Generates heat by passing electricity through the conductor. (The conductors are made of two types: stainless steel and copper) ■ Supports flexible shapes ■ Heat distribution according to application ■ Lead wire installation possible ■ Components such as thermistors and fuses can be mounted.
The upper limit of operating temperature has significantly increased from 105°C to 150°C, enabling use in high-temperature environments such as automotive and industrial equipment applications.
In recent years, the demand for FPC (Flexible Printed Circuit) has been increasing in high-temperature processing applications such as automotive uses. To withstand higher temperature environments, it was necessary to improve the adhesive joints of the insulating layer that protects the circuit board, in order to prevent delamination of the insulating layer. High-temperature resistant FPC has achieved long-term reliability even in environments of 150°C by enhancing the heat resistance of the adhesive layer in the coverlay film that protects the surface of the FPC. Additionally, when combined with our 150°C compatible FPC connector HF601 series, it enables use in high-temperature environments of up to 150°C. ■ Features - Long-term reliability secured at 150°C for 3,000 hours - FPC layer configuration: single-sided (1 layer), double-sided (2 layers) - Compatible with two types of substrates: LCP material (YFA: single-sided, YFB: double-sided), PI material (YFH: single-sided) - Component mounting possible - With a GND reinforcement design, it can be used not only for high-temperature FPC applications but also as noise resistance. - Both FPC and connectors can be provided as a set of 150°C compatible products.
Flexible handling up to 3 meters long, easy to insert even multiple thin catheters. Excellent cost performance and noise reduction measures are also achieved.
A catheter is a thin tube used in medical applications that is inserted into the body. In next-generation catheters, there has been a challenge with an increase in signal lines, which cannot be accommodated within traditional ultra-fine wire cables. Our company has addressed this challenge by developing a low-resistance long-length FPC for catheters. By using FPC, it becomes possible to fit many signal lines within the catheter. This product, with its long length, fine wiring, and ultra-thin characteristics, is ideal for use in medical devices, including catheters. ■Features - Long-length × fine wiring × ultra-thin FPC - Single-sided / double-sided (without TH) - L = 2500mm, L/S = 50µm, FPC width 0.6mm (subject to consultation) - No adhesive layer, thin, and very flexible - Low resistance due to the selection of Cu 35mm, good etching precision even in long lengths, and high signal quality - Capable of mounting components such as sensors
FPC is optimal for curved areas where anti-fogging and heat retention are necessary.
【Features】 ■ Generates heat by passing electricity through the conductor. (There are two types of conductors: stainless steel and copper) ■ Supports flexible shapes ■ Heating distribution according to application ■ Lead wire installation possible ■ Components such as thermistors and fuses can be mounted. If you have any concerns or questions, please feel free to contact us.
FPC is ideal for curved areas that require anti-fogging and thermal insulation.
【Features】 ■ Generates heat by passing electricity through the conductor. (The conductors are made of two types: stainless steel and copper) ■ Supports flexible shapes ■ Heating distribution according to application ■ Lead wire attachment possible ■ Components such as thermistors and fuses can be mounted. If you have any concerns or questions, please feel free to contact us.
FPC is ideal for curved areas that require anti-fogging and thermal insulation.
【Features】 ■ Generates heat by passing electricity through the conductor. (There are two types of conductors: stainless steel and copper) ■ Supports flexible shapes ■ Heating distribution according to application ■ Lead wires can be attached ■ Components such as thermistors and fuses can be mounted. If you have any concerns or questions, please feel free to contact us.
The upper limit of operating temperature has significantly increased from 105°C to 150°C, enabling use in high-temperature environments, including automotive and industrial equipment applications.
In recent years, the demand for FPC (Flexible Printed Circuit) has been increasing in high-temperature processing applications such as automotive uses. To withstand higher temperature environments, it was necessary to improve the adhesive joints of the insulating layer that protects the circuit board, in order to prevent delamination of the insulating layer. High-temperature resistant FPC has achieved long-term reliability even in environments of 150°C by enhancing the heat resistance of the adhesive layer in the coverlay film that protects the surface of the FPC. Additionally, when used in combination with our 150°C rated FPC connector HF601 series, it enables use in high-temperature environments up to 150°C. ■ Features - Long-term reliability ensured at 150°C for 3,000 hours - FPC layer configuration: single-sided (1 layer), double-sided (2 layers) - Two types of substrates available: LCP material (YFA: single-sided, YFB: double-sided), PI material (YFH: single-sided) - Component mounting possible - With a GND reinforcement design, it can be used not only for high-temperature FPC applications but also as noise resistance. - Both FPC and connectors can be provided as a set of 150°C rated products.
Securing long-term reliability at 150℃ for 3,000 hours.
In recent years, the demand for FPC (Flexible Printed Circuit) has been increasing in high-temperature processing applications such as automotive uses. To withstand higher temperature environments, it was necessary to improve the adhesive joints of the insulating layer that protects the circuit board, in order to prevent delamination of the insulating layer. High-temperature resistant FPC has achieved long-term reliability even in environments of 150°C by enhancing the heat resistance of the adhesive layer in the coverlay film that protects the surface of the FPC. Additionally, when combined with our 150°C compatible FPC connector HF601 series, it enables usage in high-temperature environments up to 150°C. ■Features - Long-term reliability secured at 150°C for 3,000 hours - FPC layer configuration: single-sided (1 layer), double-sided (2 layers) - Two types of substrates available: LCP material (YFA: single-sided, YFB: double-sided), PI material (YFH: single-sided) - Component mounting possible - With a GND reinforcement design, it can be used not only for high-temperature FPC applications but also as noise resistance. - Both FPC and connectors can be provided as a set of 150°C compatible products.
Flexible handling up to 3 meters long, easy to insert even multiple thin catheters. Excellent cost performance and noise reduction achieved.
A catheter is a thin tube used in medical applications that is inserted into the body. In next-generation catheters, the number of signal lines has increased, presenting a challenge as conventional ultra-fine wire cables cannot fit within the catheter. Our company has addressed this challenge by developing a low-resistance, long-length FPC for catheters. By using FPC, it becomes possible to accommodate many signal lines within the catheter. This product, characterized by its long length, fine wiring, and ultra-thin design, is highly suitable for use in medical devices, including catheters. ■ Features - Long-length, fine wiring, ultra-thin FPC - Single-sided / double-sided (without TH) - Length = 2500mm, L/S = 50µm, FPC width 0.6mm (subject to consultation) - No adhesive layer, thin, and very flexible - Low resistance due to the selection of Cu 35mm, with good etching precision even at long lengths and high signal quality - Capable of mounting components such as sensors
