[Application Example] Multi-layer Printed Circuit Board Pattern Analysis Technology through Substrate Cutting
Separation and visualization of wiring and metal patterns in multilayer printed circuit boards by layer.
We would like to introduce a technology that applies "smart X-ray." Our company has developed a technology that separates and visualizes the wiring and metal patterns within multilayer printed circuit boards by differentiating X-ray transmission images obtained by cutting the printed circuit board layer by layer. By utilizing this technology, it becomes possible to analyze the circuit patterns within multilayer printed circuit boards. 【Applicable Uses】 ■ Comparison of differences between manufactured printed circuit boards and design drawings in Gerber data ■ Pattern analysis of existing boards ■ Remanufacturing of printed circuit boards without manufacturing data *For more details, please refer to the PDF materials or feel free to contact us.
- Company:ビームセンス
- Price:Other