Solder resist formation technology for wearable devices
Specifications for terminal size, clearance, and solder mask thickness are provided.
In the wearable device industry, miniaturization and high-density mounting are required, making space-saving in circuit board design an important challenge. Solder resist formation technology enhances the mounting density of components and contributes to the overall miniaturization of devices. Our materials on solder resist formation technology are useful for product selection. [Usage Scenarios] - Miniaturization of wearable devices - High-density mounting - Protection of components [Effects of Implementation] - Miniaturization of devices - Improved reliability - Increased design flexibility
- Company：プリケン 本社、山形営業所、神奈川営業所、関西営業所、福岡営業所
- Price：Other
