Whetstone "Chamfering (Outer Edge) Wheel"
Achieve high precision and high efficiency processing! Introducing grinding wheels that use metal bond as the binder.
The "Chamfering (Outer Circumference) Wheel" is a grinding wheel for chamfering silicon wafers. It uses a metal bond as the binder, achieving high precision and high efficiency processing. It accommodates various specifications such as V shapes, R shapes, single grooves, and continuous grooves. We have processing examples with a particle size of #800, a wheel peripheral speed of 2500 m/min, and a surface roughness (Ra) of 0.3 μm. Please feel free to contact us when you need assistance. 【Features】 ■ For chamfering processing of silicon wafers ■ Uses metal bond as the binder ■ Achieves high precision and high efficiency processing ■ Accommodates various shapes, single grooves, continuous grooves, and rough/finish integrated types *For more details, please refer to the PDF document or feel free to contact us.
- Company：アダマス
- Price：Other
