Tools, semiconductor components, precision grinding wheels 'DPG WHEEL'
Adopting soft bonds and hard bonds! Enables sustained high-precision polishing.
The "DPG WHEEL" is a grinding wheel that utilizes a soft bond focused on sharpness and a hard bond that emphasizes surface roughness and wheel life over an extended period, enabling sustainable high-precision grinding for tools, semiconductor components, and precision grinding wheels. It is effective for processing non-ferrous metals, as well as carbide, cermet, ceramics, and copper. It can be used for applications such as processing magnetic materials, semiconductor components, and precision machining. 【Features】 ■ Utilizes soft bond and hard bond ■ Enables sustainable high-precision grinding ■ Effective for processing non-ferrous metals, carbide, cermet, ceramics, and copper ■ Standard dimensions: up to 16B *For more details, please refer to the PDF document or feel free to contact us.
- Company:TKX
- Price:Other