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Inspection Equipment×ヒューブレイン - メーカー・企業と製品の一覧

Inspection Equipmentの製品一覧

16~30 件を表示 / 全 32 件

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Optical Communication / Appearance Inspection Equipment for High-Frequency Components, Devices, and Modules

Rich experience in manufacturing tailored to defective items and work shapes. Capable of building IoT systems as well.

Our company manufactures appearance inspection equipment for optical communication and high-frequency components, devices, and modules, which are difficult to inspect due to their complex shapes. Leveraging the optical engineering capabilities we have cultivated over many years as a specialized manufacturer, along with our unique advanced image processing technology, we can accommodate products of various shapes. We are also building a production management system as part of IoT, which includes information communication with upper servers, feedback to previous processes, and large-capacity storage of inspection results (optional). 【Features】 ■ Flexible design allows imaging from angles suitable for detecting defects ■ By implementing a remote system, software can be edited from distant locations ■ Remote real-time checking of ladders to identify problematic areas ■ Broadly accommodates scratches, component bending, misalignment of mounted parts, adhesive failures, discoloration, and unevenness *For more details, please refer to the materials. Feel free to contact us with any inquiries.

  • Visual Inspection Equipment

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Wafer Appearance Inspection Equipment (Before Dicing)

Selectable image resolution tailored to inspection accuracy! Achieving fast and high-precision inspections.

The "Wafer Appearance Inspection Device (Before Dicing)" is a device capable of inspecting appearance defects that occur in the wafer process with high speed and high precision. Image resolution can be selected according to inspection accuracy (macro inspection with a resolution of approximately 10μm or higher). Additionally, the viewer software includes features such as inspection result map display, NG chip magnification display, and defect classification display (defect items/total inspections/OK/NG). 【Features】 ■ Multifunctional image inspection software Hu-Dra ■ Capable of inspecting appearance defects occurring in the wafer process ■ Auto-focus function (optional) ■ Marking error check function for all units (optional) ■ ID reading and mapping data output function (optional) *For more details, please refer to the PDF document or feel free to contact us.

  • Visual Inspection Equipment

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Lib Extreme Plate Appearance Inspection Device

Ideal for visual inspection of coating, compression, and slitting processes, enabling high-precision detection!

【Features】 - Ideal for visual inspection in coating, compression, and slitting processes, enabling high-precision detection. - Capable of accommodating various shapes and coating patterns through proprietary visual inspection software. - Proven track record in classifying defective items using AI. - Production management support software facilitates easy statistical management of defects and feedback from previous processes.

  • Image analysis software

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Free Angle Multi-Surface Inspection Device

Inspection can be performed from various angles, similar to visual inspection. Setup changes are easy, making it suitable for small quantities and a wide variety of modular products and products with leads.

The "Free Angle Multi-Surface Inspection Device" utilizes a robotic hand to inspect products from various angles, such as sides and edges, similar to visual inspection. It captures images of products on a tray using suction transport and enables high-precision judgment through a combination of proprietary software and AI image processing. With a simple change of the suction mechanism at the hand's tip, it can accommodate a wide range of product varieties and sizes, allowing for efficient inspections. 【Features】 ■ Well-suited for inspecting modular products and products with leads ■ Efficiently conducts inspections for small quantities of diverse products ■ Equipped with multiple optical systems, capable of detecting various defects ■ Supports automated inspections using loaders and unloaders ■ The supply section can also handle products in bulk *Please refer to the accompanying materials. Feel free to contact us with any inquiries.

  • Visual Inspection Equipment

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Shinshu Matsukawa Office

We consistently design and manufacture appearance inspection machines targeted at electronic components.

Hube Brain Co., Ltd.'s Shinshu Matsukawa office consistently designs and manufactures visual inspection machines for electronic components. The image processing unit is equipped with in-house products, and all image inspection logic is developed in-house, allowing us to respond to diverse needs in a short period. We have two screening rooms where we thoroughly conduct lighting tests and other evaluations that significantly affect the success of image inspections. We provide handlers suitable for image inspections. For more details, please contact us or refer to our catalog.

  • Visual Inspection Equipment
  • Other image-related equipment

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Small glass panel appearance inspection device

Smartphone and tablet-related inspection equipment. Compatible with cover glass as well. Extensive track record in the FPD industry.

The small glass panel appearance inspection device is a machine that inspects small glass panels (ranging from smartphone to tablet size) transported on a conveyor through image inspection. It uses a one-dimensional camera to capture images of each panel as it moves, conducting appearance inspections. It can accommodate various requests, such as simultaneous inspection of both the front and back surfaces and inline integration into any process. It has lighting conditions that detect fine scratches and surface defects, and it is also possible to add transmitted light as an option. For panels that are found to be defective, NG data is managed. Additionally, it is possible to equip the device with a marking mechanism as an option. For more details, please contact us or refer to the catalog.

  • Visual Inspection Equipment
  • Defect Inspection Equipment

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"Low-cost version" wafer chip appearance inspection device

It is possible to inspect appearance defects occurring in the wafer process and dicing process quickly and with high precision.

The "Low-Cost Version Wafer and Chip Appearance Inspection System HMWF-A2000" is an appearance inspection device equipped with a high-resolution color camera, providing excellent detection capabilities and enabling high-speed inspection of chip appearances after wafer processing and dicing. It can inspect appearance defects occurring in the wafer and dicing processes with high speed and precision, and is capable of inspecting a variety of chip patterns. 【Features】 ■ Capable of inspecting a variety of chip patterns. ■ Can capture features for each defect item through image processing and classify defects (categorization function). ■ The accumulated software technology significantly reduces the total cost of the device. *For more details, please contact us or download the catalog to view.

  • Semiconductor inspection/test equipment
  • Visual Inspection Equipment

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High-speed six-sided inspection machine with rotary mount head

"Live demonstration" of a device that continuously picks up and transports SMD chip components at high speed, performing visual inspections. It will be demonstrated at the exhibition venue!

6-Sided Inspection Machine with High-Speed Transfer Function Using Rotary Mount Head It sorts and stores good and defective items from tray or bulk supply. 【Exhibited Equipment at Internepcon】 ● 6-Sided Inspection Machine with RMH Tray Packing Function - 6-sided inspection machine with high-speed transfer function using a rotary mount head - Picks up workpieces from sheet rings, bulk, or tray storage states, sorts them for quality, and stores them in trays ● Glass Panel Inspection Machine - A device that inspects small glass panels transported on a conveyor using a 1D camera - Features simultaneous inspection of the front and back surfaces and integration into inline processes ● 3D Measurement System - High-speed and high-precision 3D measurement using high-speed phase shift method - Ideal for height defect inspection of ceramic substrates, PCB substrates, lead frames, etc. ● 10-Sided Appearance Inspection Device for Chip Components Using Transparent Film Method - 10-sided appearance inspection device for chip components using a transparent film belt - Capable of high-precision inspection for automotive electronic components and more 【For more details, please download the catalog or feel free to contact us】 ↓ ↓ ↓            ↓ ↓ ↓

  • Image Processing Equipment
  • Visual Inspection Equipment
  • Other inspection equipment and devices

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Automotive chip component 6-face + 4-edge appearance inspection device

In chip components with a cubic shape, in addition to the 6 faces and the 4 edges of the long sides, it is possible to perform visual inspection of the 4 edges of both short sides as an option.

- In chip components with a cubic shape, in addition to the six faces and the four edges of the long sides, optional visual inspection of the four edges of both short sides is possible. - The disks used in the equipment can be selected as either two vertical disks or a vertical to horizontal disk, depending on the shape of the workpiece. For workpieces with a square cross-section, the two vertical disk method is suitable. - In the vertical to horizontal disk method, it is possible to tape the good products after visual inspection. - With 30 years of experience in the electronic components industry, our accumulated lighting technology, proprietary inspection software, and transport technology combine to create a highly reliable device.

  • Image Processing Equipment

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Free Angle Appearance Inspection Device

Equipped with a 2-axis rotating robot! An appearance inspection device close to visual inspection is realized at a low price!

This product is a "Free Angle Appearance Inspection Device" equipped with a 2-axis rotating robot. The robot hand is equipped with arbitrary angle setting functionality and a rotating mechanism, allowing it to position the workpiece at angles and locations suitable for image inspection. It features a "parallel processing function" that inspects alternately using two hands, and a "full circumference inspection function" that transfers the workpiece from hand 1 to hand 2 for execution. The hand tip can accommodate various shapes such as chuck mechanisms and suction mechanisms, making it compatible with a variety of workpiece shapes. 【Features】 ■ Equipped with a 2-axis rotating robot ■ Lower price than conventional models ■ High-functionality image inspection system ■ Equipped with parallel processing and full circumference inspection functions ■ Compatible with various shapes *For more details, please refer to the PDF document or feel free to contact us.

  • Visual Inspection Equipment
  • Other inspection equipment and devices

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Selectable image resolution! Wafer chip appearance inspection device (after dicing)

Equipped with a variety of functions! Inspections are conducted using a 3CMOS color area camera with 3.2 million pixels.

The "Wafer Chip Appearance Inspection Device (Post-Dicing)" is a device for inspecting the appearance of chips after wafer dicing. Image resolution can be selected according to inspection accuracy (approximately 0.8μm to 2.0μm/pixel). Additionally, optional features include simultaneous front and back inspection, NG chip reject function, NG chip marking function, elimination of all errors, marking error check function, ID reading, and mapping data output function. 【Features】 ■ Multifunctional image inspection software Hu-Dra ■ A two-stage specification that allows for simultaneous appearance inspection and NG rejection is also available ■ Processing capabilities - Appearance inspection time: approximately 2 minutes at a resolution of 1.5μm (2-inch: chip size approximately 1mm) - Elimination time: 3 to 6 chips per second (varies depending on chip size and type of sheet) - Marking time: 3 to 4 chips per second for inker *For more details, please refer to the PDF document or feel free to contact us.

  • Visual Inspection Equipment

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37th Electro Test Japan <Introduction of Exhibited Equipment>

【January 25 (Wednesday) to 27 (Friday), 2023】 Equipment capable of performing individual piece inspection and overall wafer sensory inspection with a single unit, etc.

Hubbrain Inc. will be exhibiting at the 37th Electro Test Japan held at Tokyo Big Sight. We plan to showcase our "Crack Inspection Device (with AI)", "Wafer Inspection Device", "Line Camera Photometric Stereo", and "Line Camera Type 3D Inspection Device". We sincerely look forward to your visit. 【Exhibited Products】 ■ Crack Inspection Device (with AI) ■ Wafer Inspection Device ■ Line Camera Photometric Stereo ■ Line Camera Type 3D Inspection Device *For more details, please refer to the PDF document or feel free to contact us.

  • Other inspection equipment and devices
  • Visual Inspection Equipment
  • Defect Inspection Equipment

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Syringe testing device

Syringe testing device

【Features】 ■ This syringe inspection machine can perform inspections with and without needles. ■ Since it uses a rotating imaging method, side inspections can be done with just one camera. ■ The limited number of cameras makes maintenance and adjustments easy. ■ By using self-developed software for image processing, inspections can be tailored to meet customer needs. ■ Inspection history and images can be saved on an external PC.

  • Image Processing Board

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Cutting tool inspection device

This is a device for high-precision visual inspection of cutting and machining tool tips!

【Features】 ■ This device performs high-precision visual inspections of cutting and machining tool tips. ■ The edge area is inspected for fine chipping with high precision, while the entire surface is inspected for coating defects and stains using a high-resolution camera. ■ Equipped with a simple product registration function for ISO model number products. ■ The variety data management system allows for the registration of setting data for up to 10,000 varieties.

  • Image Processing Equipment

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DLP-type 2D + 3D sensor *Conducts various 3D inspections at high speed!

Coexistence of 3D inspection capabilities with conventional 2D inspection! Supports shape inspection of semiconductors with a size of 15mm square.

The "DLP-type 2D + 3D sensor" is a product that performs high-speed 3D inspection of various products. The Z accuracy is 2μm, and it can accommodate XY sizes up to 1m x 1m, with a cycle time of up to 0.05 seconds. We also offer options that can be added to existing 2D inspections. Please feel free to contact us when you need assistance. [Support] ■ Development support for both hardware and software ■ Addressing blind spots in three-dimensional workpieces ■ Support for composite materials and brightness unevenness *For more details, please download the PDF or feel free to contact us.

  • Sensors
  • Sensors
  • Other Sensors

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