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Inspection Equipment×アイビット - List of Manufacturers, Suppliers, Companies and Products

Inspection Equipment Product List

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High Magnification X-ray Inspection Device 'FX-300tRR'

High Magnification X-ray Inspection Device 'FX-300tRR'

Reel-to-reel inspection function added! 3D imaging is also possible with the optional CT unit.

The "FX-300tRR" is a high-magnification X-ray inspection device that allows for easy inspection of electronic components on reels. It retains the performance and functionality of the conventional model FX-300tR2 while offering "high magnification of 900x for 2D inspection, vertical 0° to diagonal 60°," "reel-to-reel inspection," and analysis with "3D-CT," making it a multifunctional product that serves three roles in one device. Additionally, by changing the tray, it can also perform solder inspection of mounted circuit boards and inspections using JEDEC standard trays. 【Features】 ■ Allows for photographic confirmation of individual components while still on the reel ■ Capable of inspecting 3,000 reel components in about one hour ■ Automatic operation allows for image storage of all components ■ Inspection of reel components with an inclined X-ray camera is also possible ■ The VCT function significantly improves shooting operability, enabling not only radiographic inspection but also three-dimensional analysis *For more details, please download the PDF or feel free to contact us.

  • X-ray inspection equipment

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X-ray wafer bump automatic inspection system 'Six-3000'

X-ray wafer bump automatic inspection system 'Six-3000'

Automated X-ray inspection device for inspecting solder bumps on wafers.

The "Six-3000" is an X-ray automatic inspection device that automatically inspects and judges bumps on wafers. It uses X-rays to penetrate voids (bubbles) inside the wafer, and from the transmitted images, it calculates the diameter (area) of the voids and automatically inspects whether the voids exceed the reference value. A micro-focus X-ray tube is used as the X-ray source, and a high-performance X-ray digital camera is employed for the X-ray imaging section, enabling the extraction of high-resolution images and allowing for high-precision void inspection. 【Features】 ■ High-resolution images can be extracted ■ High-precision void inspection is possible ■ High-speed inspection and inspection of small wafer bumps are possible *For more details, please refer to the catalog or feel free to contact us.

  • Semiconductor inspection/test equipment
  • X-ray inspection equipment

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Notice of Participation in the Exhibition "The 1st Kansai Nepcon Japan"

Notice of Participation in the Exhibition "The 1st Kansai Nepcon Japan"

We plan to unveil inline X-ray inspection equipment and 3D X-ray inspection equipment!

Aibit Inc. will be exhibiting at the "1st [Kansai] Nepcon Japan - Electronics Development and Implementation Exhibition" held at Intex Osaka. At this exhibition, cutting-edge electronic components, materials, and manufacturing, implementation, and inspection equipment that support the multifunctionality and high performance of electronic devices will be showcased. Manufacturers from various sectors such as electronics, semiconductors and sensors, electronic components, automotive and electrical equipment, and aerospace will attend for the introduction and comparative study of advanced technologies. Our company plans to exhibit inline X-ray inspection equipment and 3D X-ray inspection equipment. 【Event Overview】 ■ Dates: May 14 (Wed) - 16 (Fri), 2025 ■ Hours: 10:00 AM - 5:00 PM ■ Admission Fee: Free ■ Venue: Intex Osaka *For more details, please download the PDF or feel free to contact us.

  • X-ray inspection equipment
  • X-ray Inspection Machine

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3D X-ray stereo method X-ray inspection device 'FX-400tRX'

3D X-ray stereo method X-ray inspection device 'FX-400tRX'

Fully utilize CT functions with easy operation! Achieving high resolution of 2μm while being a sealed X-ray device.

The "FX-400tRX" is a 3D X-ray stereo inspection device capable of obtaining clear X-ray images with a geometric magnification of 500 times. It can also inspect the connection points of IC wire bonding and copper wires. Additionally, it can inspect through-holes inside printed circuit boards. With a high output of 110kV and 200μA, it has become possible to penetrate materials such as 3mm thick copper plates. 【Features】 ■ High output X-ray source of 110kV and 200μA allows penetration of copper plates (3mm) ■ High resolution of 2μm enables image acquisition of fine details ■ High magnification imaging with geometric magnification of 500 times ■ X-ray stereo method allows separation of the front and back surfaces of the mounted circuit board (approximately 4 seconds) ■ X-ray stereo CT method enables acquisition of 500 horizontal cross-sections of the mounted circuit board *For more details, please download the PDF or feel free to contact us.

  • X-ray inspection equipment

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