Automated X-ray inspection device for inspecting solder bumps on wafers.
The "Six-3000" is an X-ray automatic inspection device that automatically inspects and judges bumps on wafers. It uses X-rays to penetrate voids (bubbles) inside the wafer, and from the transmitted images, it calculates the diameter (area) of the voids and automatically inspects whether the voids exceed the reference value. A micro-focus X-ray tube is used as the X-ray source, and a high-performance X-ray digital camera is employed for the X-ray imaging section, enabling the extraction of high-resolution images and allowing for high-precision void inspection. 【Features】 ■ High-resolution images can be extracted ■ High-precision void inspection is possible ■ High-speed inspection and inspection of small wafer bumps are possible *For more details, please refer to the catalog or feel free to contact us.
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【Inspection Details】 ■Bump Diameter Measurement ■Void Measurement ■Bump Height Measurement ■Bump Shape Inspection *For more details, please refer to the catalog or feel free to contact us.
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For more details, please refer to the catalog or feel free to contact us.
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